• 자원리싸이클링
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• 제13권2호
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• pp.3-8
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• 2004

석유화학공정에서 발생하는 산화철폐촉매를 이용하여 폐수 중 중금속회수에 관한 기초연구를 실시하였다. Zn, Ni, Cu, 및 Fe의 농도가 200mg/L인 각각의 합성폐수에 폐촉매 첨가량을 변화하여 실험한 바, 각 금속의 98% 회수율을 얻은 폐촉매 첨가량은 Cu 와 Fe 폐수 ：2％ 이상, Zn 폐수：3％ 이상, Ni 폐수 ：7％ 이상이었다. 또한 폐산화철 촉매로서 Zn, Ni, Cu 및 Fe 금속의 98％ 이상 회수할 수 있는 각각의 폐수 pH는 Ni： 10.6 이상, Cu： 8.0 이상, Fe：6.5 이상, Zn：8.5 이상이었다. 따라서 폐산화철 촉매에 의한 폐수 중 중금속 회수는 폐촉매의 알카리성분에 의한 침전이 주 메카니즘이고, 각 금속의 수산화침전 pH이하 폐촉매의 등전점(pH 3.0) 이상의 pH범위에서는 금속이온이 폐촉매 표면에서 물리흡착에 의해 일부 회수된다.

• 한국식품영양학회지
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• 제9권3호
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• pp.299-306
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• 1996

The study was performed under the various conditions, such as the edible parts and particle sizes of Allium. The concentrations, the temperartures, and the pH of heavy metal solutions to investigated their adsorption capacity of heavy metals by genus Allium. The adsorption amount of Pb by Allium in the aqueous soluton was apparently higher than that of Ni and Cu by them. The larger the particle sloe of welsh onion and shallot was, the higher the adsorption of Cu was. The adsorptlons of Cu, Ni and sorption ratio was not different. As the temperature increased, the amount of heavy metal adsorption increased in general, but the adsorption of Ni by welsh onion and wild garlic and leek, Cu by shallot, wild garlic and leek decreased. Adsorption of Pb to Allium was not affected by the different values of pH, and adsorptions of Ni and Cu were greatly affected by those of pH. Especially, the higher the pH was, the greater the Ni adsorption to Allium was, and the lower the pH was, the higher the Cu adsorption was. The correlation between the amount of components in edible parts of Allium and that of adsorption of heavy metals was significantly high In amino acids containing sulfhydryl group(-SH) and vitamin B2.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.29-34
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• 2020

본 연구에서는 무전해 니켈 도금액 pH 변화에 따른 electroless nickel immersion gold (ENIG)/Sn-3.0wt.%Ag-0.5wt.%Cu(SAC305) 솔더 접합부 취성 파괴 거동에 대하여 평가하였다. ENIG 표면처리를 위한 무전해 니켈 도금액의 pH는 4.0에서 5.5로 변화 시켰다. 무전해 니켈 도금 후 Ni-P 표면 관찰 결과, 도금액의 pH가 낮아질수록 Ni-P 층 nodule 표면에 핀홀이 증가하였다. 솔더링 후 접합부 계면에서는 (Cu,Ni)6Sn5 금속간화합물이 형성되었으며, 무전해 니켈 도금액의 pH가 증가할수록 솔더접합부의 계면 금속간화합물의 두께는 증가하였다. 고속전단 시험을 통하여 ENIG/SAC305 솔더 접합부의 취성파괴 거동을 확인하였으며, 무전해 니켈 도금액의 pH가 증가할수록 솔더접합부의 전단강도는 감소하는 경향을 보였다. 또한, 솔더 접합부의 취성 파괴율은 pH가 5일 때 가장 높은 값을 보였다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.953-954
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• 2006

Ti-Cu-Ni-Sn quaternary amorphous alloys of $Ti_{50}Cu_{32}Ni_{15}Sn_3$, $Ti_{50}Cu_{25}Ni_{20}Sn_5$, and $Ti_{50}Cu_{23}Ni_{20}Sn_7$ composition were prepared by mechanical alloying in a planetary high-energy ball-mill (AGO-2). The amorphization of all three alloys was found to set in after milling at 300rpm speed for 2h. A complete amorphization was observed for $Ti_{50}Cu_{32}Ni_{15}Sn_3$ and $Ti_{50}Cu_{25}Ni_{20}Sn_5$ after 30h and 20h of milling, respectively. Differential scanning calorimetry analyses revealed that the thermal stability increased in the order of $Ti_{50}Cu_{32}Ni_{15}Sn_3$, $Ti_{50}Cu_{25}Ni_{20}Sn_5$, and $Ti_{50}Cu_{23}Ni_{20}Sn_7$.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.33-35
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• 2006

The interactions between Cu/Sn-Ag-(Cu) and Sn-Ag-(Cu)/Ni interfacial reactions were studied during isothermal aging at $150^{\circ}C$ for up to 1000h using Cu(ENIG)/Sn-3.5Ag-(0.7Cu)/Cu(ENIG) sandwich solder joints. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing, whereas a $(Cu,Ni)_6Sn_5$ IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni side was sourced from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment was performed at $150^{\circ}C$, no Ni was detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the $(Cu,Ni)_6Sn_5$ IMC layer of the Cu/sn-Ag/ENIG sandwich joint effectively retarded the Ni consumption from the electroless Ni-P layer.

• E2M - 전기 전자와 첨단 소재
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• 제3권4호
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• pp.325-331
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• 1990

본 연구는 텅스텐 소결에 저온 활성제로 작용하는 Ni-P 공정합금을 미량첨가하여 제조공정의 간단화를 통한 새로운 W-Cu계 전기접점제조를 목표로 하였다. 이를 위해 1회 용침공정을 통해 제조한 W(Ni-P)-Cu 합금에 대한 전기접점특성을 조사하여 접점의 미세구조 관점에서 논의하였다. Ni-P 합금첨가한 접점은 기존의 순수 W-Cu 합금에 비해 낮은 접촉저항 및 낮은 아크소모를 나타내는 우수한 접점성능을 보여주었다. 이것은 Ni-P합금이 Cu용침이 개시되기전 짧은 승온단계에서 분말간의 강한 결합과 Cu용침에 유리한 기공통로를 갖는 W 분말 골격체의 형성을 유도하기 때문인 것으로 판단된다.

• 열처리공학회지
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• 제27권1호
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• pp.1-9
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• 2014

For connector material applications, the influence alloying elements of Mn, Cr, Fe, and Ti and cold rolling reduction on the mechanical property, electrical conductivity and bendiability of Cu-Ni-Si-P alloy was investigated. The hot rolled plates were solution treated at $980^{\circ}C$ for 1.5 h, quenched into water, cold rolled by 10% and 30% reduction in thickness, and then aged at $440{\sim}500^{\circ}C$ for 3, 4, 5 times. respectively. Cu-Ni-Si-P-x alloys cold rolled by 10 reduction before heat treatment have a good bendability compare to cold rolled by 30 reduction. Cu-3.4Ni-0.8Si-0.03P-0.1Ti shows the peak strength value of 759 MPa, an electrical conductivity of 39%IACS, an elongation of 10% and a hardness of 256 Hv aged at $440^{\circ}C$ for 6 hrs. Thus it is suitable for lead frame and connector.

• 통합자연과학논문집
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• 제2권4호
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• pp.233-236
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• 2009

This study was undertaken to measure the electrochemical corrosion of amorphous $Zr_{65}Al_8Ni_{15}Cu_{12}$ (at.%) alloy ribbon under various conditions, including 0.4 mM HCl solution, and for various values of the pH and the immersion time. The corrosion potentials($E_{corr}$) for the amorphous $Zr_{65}Al_8Ni_{15}Cu_{12}$ alloy in 0.4 mM HCl decreased with increasing temperature; the corrosion current density($I_{corr}$) increased with increasing temperature in general. The polarization resistance($R_p$) was inversely proportional to the corrosion rate. While pH=7, 9, 11 was not as sensitive as pH=3, 5, pH=3 was more sensitive for amorphous $Zr_{65}Al_8Ni_{15}Cu_{12}$ alloy than other pHs specially. The change of mass in the 70 mM $H_2SO_4$ solution with immersion time was the greatest in the first 100 h.

• 한국표면공학회지
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• 제24권2호
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• pp.103-113
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• 1991

Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30$0^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50$0^{\circ}C$, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.

• 한국표면공학회지
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• 제24권4호
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• pp.187-195
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• 1991

Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion strengths of Ni-P and Ni deposit were higher than that of Cu deposit, because of higher initial nucleation rates than the latter. The electroless-plated Ni-P and Ni underlayer improved the adhesion strength of the Cu deposit. In could be attributed to the enhanced adhesion between the substrate and those underlayers as well as the satisfactory adhesion between Cu deposits and those underlayers. Heat treatment was also conducted in order to enhance the adhesion strength of Cu layer. The strength was enhanced by about 19% when the treatment was conducted at $150^{\circ}C$ for 2 hours. The enhancement was attributed to relief of internal stress and release of hydrogen.