• 제목/요약/키워드: Cu-Cu Bonding

검색결과 331건 처리시간 0.029초

Cu, Cr 등 천이원소가 첨가된 Al-1.4Mn-1.0Zn 합금을 심재로 하여 제조된 콘덴서 핀용 알루미늄 클래드 박판의 특성 (Properties of Aluminum Clad Sheets for Condenser Fins Fabricated with Transition Elements(Cu, Cr) added to Al-1.4Mn-1.0Zn Base Alloys)

  • 어광준;김형욱;이윤수;오영미;김동배
    • 소성∙가공
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    • 제23권6호
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    • pp.386-391
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    • 2014
  • In the current study, Al-Mn-Zn alloys are strip-cast and used as the base alloy for the core of aluminum clad sheets used in automotive condenser fins. Transition elements such as Cu and Cr are added to the base core alloy in order to improve the properties of the clad sheets. The AA4343/Al-Mn-Zn-X(X: Cu, Cr)/AA4343 clad sheets are fabricated by roll bonding and further cold-rolled to a thickness of 0.08 mm. Clad sheets were intermediately annealed during cold rolling at $450^{\circ}C$ in order to obtain 40% reduction at the final thickness. Tensile strength and sag resistance of the clad sheets are improved by Cu additions to the core alloy, while corrosion resistance is also increased. Cr-additions to the clad sheets enhance sag resistance and provide low enough corrosion, although tensile strength is not improved. The effect of Cu and Cr additions on the properties of the clad sheets is elucidated by microstructural analysis.

저온 브레이징용 Al-Si-Cu 합금의 Sn 첨가에 따른 융점 및 기계적 특성 변화 연구 (Effect of Tin Addition on the Melting Temperatures and Mechanical Properties of Al-Si-Cu Brazing Filler Metals)

  • 김민상;박천웅;변종민;김영도
    • 한국재료학회지
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    • 제26권7호
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    • pp.376-381
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    • 2016
  • For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

소결분위기 변환온도가 Al2O3/Cu 나노복합재료의 미세조직과 파괴강도에 미치는 영향 (Effect of Sintering Atmosphere Changing Temperature on Microstructure and Mechanical Property of Al2O3/Cu Nanocomposites)

  • 오승탁;윤세중
    • 한국분말재료학회지
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    • 제11권5호
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    • pp.421-426
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    • 2004
  • The microstructure and mechanical property of hot-pressed $Al_2O_3/Cu$ composites with a different temperature for atmosphere changing from H$_{2}$ to Ar have been studied. When atmosphere-changed from H$_{2}$ to Ar gas at 145$0^{\circ}C$, the hot-pressed composite was characterized by inhomogeneous microstructure and low fracture strength. On the contrary, when atmosphere-changed at low temperature of 110$0^{\circ}C$ the composite showed more homogeneous microstructure, higher fracture strength and smaller deviation in strength. Based on the thermodynamic consideration and microstructural analysis, it was interpreted that the Cu wetting behavior relating to the formation of CuAlO$_{2}$ is probably responsible for strong dependence of microstructure on atmosphere changing temperature. The reason for a strong sensitivity of fracture strength and especially of its deviation to atmosphere changing temperature was explained by the microstructural inhomogeneity and by the role of CuAlO$_{2}$ phase on the interfacial bonding strength.

$75{\mu}m$ Cu via가 형성된 3D 스택 패키지용 interconnection 공정 및 접합부의 전기적 특성 (Interconnection Process and Electrical Properties of the Interconnection Joints for 3D Stack Package with $75{\mu}m$ Cu Via)

  • 이광용;오택수;원혜진;이재호;오태성
    • 마이크로전자및패키징학회지
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    • 제12권2호
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    • pp.111-119
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    • 2005
  • 직경 $75{\mu}m$ 높이 $90{\mu}m$$150{\mu}m$ 피치의 Cu via를 통한 삼차원 배선구조를 갖는 스택 시편을 deep RIE를 이용한 via hole 형성공정 , 펄스-역펄스 전기도금법에 의한 Cu via filling 공정, CMP를 이용한 Si thinning 공정, photholithography, 금속박막 스퍼터링, 전기도금법에 의한 Cu/Sn 범프 형성공정 및 플립칩 공정을 이용하여 제작하였다. Cu via를 갖는 daisy chain 시편에서 측정한 접속범프 개수에 따른 daisy chain의 저항 그래프의 기울기로부터 Cu/Sn 범프 접속저항과 Cu via 저항을 구하는 것이 가능하였다. $270^{\circ}C$에서 2분간 유지하여 플립칩 본딩시 $100{\times}100{\mu}m$크기의 Cu/Sn 범프 접속저항은 6.7 m$\Omega$이었으며, 직경 $75 {\mu}m$, 높이 $90{\mu}m$인 Cu via의 저항은 2.3m$\Omega$이었다.

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EFFECT OF INTERMETALLIC COMPOUND ON MECHANICAL PROPERTIES OF Al-Cu DISSIMILAR BRAZING JOINT

  • Koyama, Ken;Shinozaki, Kenji;Ikeda, Kenji;Kuroki, Hidenori
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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    • pp.555-560
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    • 2002
  • Brazing of Al to Cu using AI-Si-Mg-Bi brazing alloy has been carried out in the vacuum furnace. In the bonded interlayer, there were two kinds of intermetallic compounds. One of these intermetallic compounds was e phase and the other was b phase. The growth of b phase was controlled by diffusion Al into Cu. Deformation behavior of Al-Cu brazing joint was brittle without deformation of the base metal. Shear strength of the joint was only about 20MPa. The shear specimen broken in the intermetallic compound, which was mainly e phase. Shear strength did not depend on the bonding temperature.

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수송기기 유압 실린더 블록 재료의 Fe-Cu 계면반응 특성 (A Characteristic of Fe-Cu Interfacial Reaction in the Hydraulic Cylinder Block for Vehicle Parts)

  • 김해지;김남경
    • 한국기계가공학회지
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    • 제3권1호
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    • pp.90-94
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    • 2004
  • Generally, a hydraulic cylinder block which is one of a vehicle parts that plays Important role in excavator power transmission, has copper alloy separation phenomenon by sliding motion between metals in high pressure condition. In this paper, to solve this problem, the interfacial reaction layer of Fe-Cu With SCM440 and copper alloy is studied through the melting method. As the result of this study, it is found that the interfacial reaction layer of $1{\mu}m$ created in the interface of Fe-Cu which has very strong physical bonding. It has been also confirmed that the melting method can improve life of the hydraulic cylinder block.

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초음파 금속 용착기를 이용한 Cu 박판의 접합성 평가 (The Establishment of Bonding Conditions of Cu Sheet using an Ultrasonic Metal Welder)

  • 박우열;장호수;박동삼
    • 한국기계가공학회지
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    • 제11권2호
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    • pp.66-72
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    • 2012
  • Ultrasonic metal welder is consisted of power supply, transducer, booster, and horn. Precise designing is required since each part's shape, length and mass can affect driving frequency and vibration mode. This paper gives a description of an experimental study of the ultrasonic welding of metals. A horn suitable for 40,000Hz was attached to the ultrasonic metal welder in order to weld Cu sheet. The Cu sheet welding was done with different amplitude, pressure and welding time, and its maximum tension was measured. Maximum tension of 177.99N was obtained when the pressure was 2.5bar, amplitude was 80%, and welding time was 0.34sec. Therefore, excessive welding condition negatively influences maximum tension measurement result.

프릿트 첨가에 따른 저온소성 기판과 Cu와의 접합 거동에 관한 연구 (The Effect of Frit on Bonding Behavior of Low-firing-substate and Cu Conductor)

  • 박정현;이상진
    • 한국세라믹학회지
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    • 제32권5호
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    • pp.601-607
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    • 1995
  • The bond strength between the low-firing-substrate and Cu conductor depended on the softening point and the amount of frit added to the metal paste. The addition of 3 wt% frit (softening point: 68$0^{\circ}C$) to the metal paste resulted in the improvement of bond strength, which was approximately 3 times higher (3kg/$\textrm{mm}^2$) than that of non frit condition. It was also found that fracture surface shifted to the ceramic substrate in the interface region. These phenomena were attributed to the frit migration into the metal-ceramic interface. It was thought that the migration of glass frit occurred extensively when the softening point of glass firt was 68$0^{\circ}C$. The sheet resistance of Cu conductor remained constant by the addition of 4 wt% frit regardless of softening point of frit. For all samples with more than 4 wt% frit, the sheet resistance increased abruptly.

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OSP 표면처리의 열적 열화에 따른 Cu/SnAgCu 접합부의 접합강도 (Bonding Strength of Cu/SnAgCu Joint Measured with Thermal Degradation of OSP Surface Finish)

  • 홍원식;정재성;오철민
    • 마이크로전자및패키징학회지
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    • 제19권1호
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    • pp.47-53
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    • 2012
  • 무연 리플로우 공정 횟수에 따른 organic solderability preservative(OSP) 표면처리 두께변화 및 열화현상을 분석하였다. 무연솔더 접합부의 접합강도에 미치는 OSP 표면처리의 열화특성을 SnPb 표면처리 경우와 비교하여 조사하였다. 또한 리플로우 pass에 따른 무연솔더 접합강도 열화분석을 위해 OSP 및 SnPb 표면처리된 FR-4 재질 PCB를 각각 1-6회 리플로우 처리하였다. 이후 각 리플로우를 거친 PCB 위에 2012 칩 저항기를 실장한 후 접합강도 변화를 측정하였다. 그 결과, 리플로우 공정 중 열 노출에 의해 OSP 코팅두께가 감소되는 것이 관찰되었고, 코팅두께의 변화 및 OSP 코팅 층의 산화를 유발함으로써, 솔더의 젖음성이 감소될 수 있음을 확인할 수 있었다. OSP 열화에 따른 솔더 접합강도는 SnPb 표리처리시 평균 62.2 N 이였으며, OSP의 경우는 약 58.1 N 이였다. 리플로우 공정 노출에 따라 OSP 코팅 층은 열분해 되지만, 솔더 접합부의 접합강도 측면에서는 산업적으로 적용 가능성을 확인할 수 있었다.

A$_2$O$_3$세라믹과 Ni-Cr-Mo鋼과의 인서트 合金을 이용한 擴散接合에 關한 硏究 (A study on the diffusion bonding of the $Al_2$O$_3$ ceramics to metal)

  • 김영식;박훈종;김정일
    • Journal of Welding and Joining
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    • 제10권3호
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    • pp.63-72
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    • 1992
  • The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

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