• Proceedings of the KWS Conference
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• 1994.10a
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• pp.173-176
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• 1994

• Journal of the Korean Ceramic Society
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• v.38 no.11
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• pp.1000-1007
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• 2001

In an evacuated tube solar collector, the stable sealing of the heat pipe to the glass tube is important for the collector to use for a long period of time. The sealing of copper tube to the glass is quite difficult because of the large differences in the physical and chemical properties of the two materials. In this study, therefore, a proper copper oxide layer was induced to improve the chemical bonding of the two materials, and the oxidation state of copper and the interface between copper and glass were examined by XRD, SEM and EDS. Its bonding strength was also measured. Cu$_2$O was formed when the bare copper was heat-treated under 600$^{\circ}C$, while CuO oxide layer was formed above that temperature. The bonding state of CuO to the copper was very poor. The borate treatment of the copper, however, extend the stable forming of Cu$_2$O layer to 800$^{\circ}C$. Borosilicate glass tube was sealed to a copper tube by Housekeeper method only when the sealing part was covered with Cu$_2$O layer. The bonding strength at the interface was measured 354.4N, its thermal shock resistance was acceptable.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.228-230
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• 2006

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.191-193
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• 2004

GMA(Gas Metal Arc)용접에서는 콘택트 팁이 토치 선단에 위치하여 용접 와이어를 송급하여 준다. 이러한 콘택트 팁의 주된 기능은 용접 전류를 와이어에 전송시켜주고, 와이어를 용접하고자 하는 위치로 유도하는 것이다. (중략)

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.187-189
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• 2003

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.282-291
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• 1993

Joining ${Al}_{2}{O}_{3}$ and STS 304 stainless steel by active metal brazing method with using CuI Owt % Ti and Cu -7 .5wt % Zr insert metal, their interfaces were analyzed and strength of the joint brazed with Cu-7.5wt % Zr insert metal also investigated with shear strength testing method. In brazing with Cu-lOwt% Ti insert metal, the single reaction layer was formed by the reaction with Ti and ${Al}_{2}{O}_{3}$ at the interface between ${Al}_{2}{O}_{3}$ and insert metal, but the double reaction layer was found in brazing with Cu-7.5wt % Zr insert metal because of the difference of their wettability on the surface of ${Al}_{2}{O}_{3}$. Fracture shear strength about 86MPa was obtained from ${Al}_{2}{O}_{3}$/Cu-7.5wt% Zr/STS 304 stainless steel joint and reasonable strength of the joints is attributed to the formation of double reaction layer at the interface.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.222-223
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• 2003

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.34-36
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• 2003

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.181-183
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• 2006

This paper studies the mechanical behaviors of Sn-3.5Ag solder joint against substrate(such as Au/Ni/Cu, Au/cu, Ni/Cu and Cu pad) after induction heating, a new soldering method. It was found that the solder bump formation depends on the time and current of the induction heating system. Also the heating value of the solder bump were found to vary with respect to the thermal conductivity of the pads on the substrate. In case of Au/Ni/Cu pad and Au/Cu pad, solder bump's shear strength were high for the heating time of $1.5{\sim}2sec$. For Ni/Cu pad, solder bump's shear strength were found to increase with time increment.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.91-97
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• 2014

With Pb-free solder joints containing Sn-Ag-Cu-based ternary alloys (Sn-1.0 wt.%Ag-0.5Cu and Sn-4.0Ag-0.5Cu) and Sn-Ag-Cu-In-based quaternary alloys (Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, and Sn-1.2Ag-0.7Cu-0.4In), fracture-mode change, shear strengths, and fracture energies were observed and measured under a high-speed shear test of 500 mm/s. The samples in each composition were prepared with as-reflowed ones or solid-aged ones at $125^{\circ}C$ to 500 h. As a result, it was observed that ductile or quasi-ductile fracture modes occurs in the most of Sn-Ag-Cu-In samples. The happening frequency of a quasi-ductile fracture mode showed that the Sn-Ag-Cu-In joints possessed ductile fracture properties more than that of Sn-3.0Ag-0.5Cu in the high-speed shear condition. Moreover, the Sn-Ag-Cu-In joints presented averagely fracture energies similar to those of Sn-Ag-Cu joints. While maximum values in the fracture energies were measured after the solid aging for 100 h, clear decreases in the fracture energies were observed after the solid aging for 500 h. This result indicated that reliability degradation of the Sn-Ag-Cu-In solder joints might accelerate from about that time.