• Journal of Technologic Dentistry
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• v.36 no.3
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• pp.141-147
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• 2014

Purpose: Dental casting #Gr I (Co-25Cr-5Mo-3Sn-1Mn-1Si), #Gr II (Co-25Cr-5Mo-5Cu-1Mn -1Si) and #Gr III (Co-25Cr-5Mo-3Sn-5Cu-1Mn-1Si) master alloys of granule type were manufactured the same as manufacturing processes for dental casting Ni-Cr and Co-Cr-Mo based alloys of ingot type. These alloys were analyzed melting processes with heating time of high frequency induction centrifugal casting machine using infrared thermal image analyzer. Methods: These alloys were manufactured such as; alloy design, the first master alloy manufatured using vacuum arc casting machine, melting metal setting in crucible, melting in VIM, pouring in the mold of bar type, cutting the gate and runner bar and polishing. These alloys were put about 30g/charge in the ceramic crucible of high frequency induction centrifugal casting machine and heat, Infrared thermal image analyzer indicated alloys in the crucible were set and operated. Results: The melting temperatures of these alloys measuring infrared thermal image analyzer were decreased in comparison with remanium$^{(R)}$ GM 800+, vera PDI$^{TM}$, Biosil$^{(R)}$ f, WISIL$^{(R)}$ M type V, Ticonium 2000 alloys of ingot type and vera PDS$^{TM}$(Aabadent, USA), Regalloy alloys of shot type. Conclusion: Co-Cr-Mo based alloy in addition to Sn(#Gr I alloy) were decreased the melting temperature with heating time of high frequency induction centrifugal casting machine using infrared thermal image analyzer.

• Journal of Ocean Engineering and Technology
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• v.15 no.2
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• pp.88-93
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• 2001

In this paper, joints of Cu-1Cr-0.1Zr alloy to STS316L were performed by friction welding method. Particularly, Cu-1Cr-0.1Zr alloy is attractive candidate as nuclear power plant material and exibit the best combination of high strength and good electrical and thermal conductivity of any copper alloy examined. The stainless steel is a structural material while copper alloy acts as a heat sink material for the surface heat flux in the first wall. So, in this paper, not only the development of optimizing of friction welding with more reliability and more applicability but also the development of in-process real-time weld quality (such as strength and toughness) evaluation technique by acoustic emission for friction welding of such nuclear reactor component of Cu-1Cr-0.1Zr alloy to STS316L steel sere performed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.328-335
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• 2001

In this work, we made the precision thin film resistors of NiCr alloy (74wt%Ni-f18wt%Cr-4wt%Al-4wt%Cu) using DC/RF magnetron sputtering method and studied the sheet resistance and TCR(Temperature Coefficient of Resistance) etc... of the Ni-Cr-Al-Cu alloy thin film according to the change by annealing treatment to 400$\^{C}$ in air and nitrogen atmosphere and the change(power, pressure, substrate temperature) of sputtering process.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2000.10a
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• pp.42-46
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• 2000

In this paper, joints of Cu-1Cr-0.1Zr alloy to STS316L were performed by friction welding method. Cu-1Cr-0.1Zr alloy is attractive candidate as nuclear power plant material and exibit the best combination of high sts good electrical and thermal conductivity of any copper alloy examined. The stainless steel is a structural material who alloy acts as a heat sink material for the surface heat flux in the first wall. So, in this paper, not only the develop optimizing of friction welding with more reliability and more applicabililty but also the development of in-process rear quility(such as strength and toughness) evaluation technique by acoustic emission for friction welding of such nuclear component of Cu-1Cr-0.1Zr alloy to STS316L steel were performed.

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.80-80
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• 2002

• Proceedings of the Korean Magnestics Society Conference
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• 2004.12a
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• pp.91-92
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• 2004

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.6 s.249
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• pp.670-677
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• 2006

Vacuum interrupters are used in various switch-gear components such as circuit breakers, distribution switches, contactors. The electrodes of a vacuum interrupter are manufactured of sinter-forged Cu-Cr material for good electrical and mechanical characteristics. Since the closing velocity is 1-2m/s and impact deformation of the electrode depends on the strain-rate at the given velocity, the dynamic material property of the sinter-forged Cu-Cr alloy is important to design the vacuum interrupter reliably and to identify the impact characteristics of a vacuum interrupter accurately. This paper is concerned with the dynamic material properties of sinter-forged Cu-Cr alloy for various strain rates. The amount of chrome is varied from 10 wt% to 30 wt% in order to investigate the influence of the chrome content on the dynamic material property. The high speed tensile test machine is utilized in order to identify the dynamic property of the Cu-Cr alloy at the intermediate strain-rate and the split Hopkinson pressure bar is used at the high strain-rate. Experimental results from both the quasi-static and the high strain-rate up to the 5000/sec are interpolated with respect to the amount of chrome in order to construct the Johnson-Cook and the modified Johnson-Cook model as the constitutive relation that should be applied to numerical simulation of the impact behavior of electrodes.

• Applied Microscopy
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• v.24 no.4
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• pp.132-144
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• 1994

The application of TEM in investigating the evolution of microstructure during solid phase crystallization of the amorphous Si, $Si_{1-x}Ge_x,\;and\;Si_{1-x}Ge_x/Si$ films deposited on $SiO_2$ substrate, in identifying the failure mechanism of the TiN barrier layer in the Cu-metallization scheme, and in comparing the microstructure of the as-deposited Cu-Cr and Cu-Ti alloy films are discussed. First, it is identified that the evolution of microstructure in Si and $Si_{1-x}Ge_x$ alloy films strongly depends on the concentration of Ge in the film. Second, the failure mechanism of the TiN diffusion barrier in the Cu-metallization is the migration of the Cu into the Si substrate, which results in the formation of a dislocation along the Si {111} plane and precipitates (presumably $Cu_{3}Si$) around the dislocation. Finally, the microstructure of the as-deposited Cu-Cr and Cu-Ti alloy films is also quite different in these two cases. From these several cases, we demonstrate that the information which we obtained using TEM is critical in understanding the behavior of materials.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.