• 제목/요약/키워드: Cu-Cr alloy

검색결과 109건 처리시간 0.026초

Microstructural Evolution in CuCrFeNi, CuCrFeNiMn, and CuCrFeNiMnAl High Entropy Alloys

  • Hyun, Jae Ik;Kong, Kyeong Ho;Kim, Kang Cheol;Kim, Won Tae;Kim, Do Hyang
    • Applied Microscopy
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    • 제45권1호
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    • pp.9-15
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    • 2015
  • In the present study, microstructural evolution in CuCrFeNi, CuCrFeNiMn, and CuCrFeNiMnAl alloys has been investigated. The as-cast CuCrFeNi alloy consists of a single fcc phase with the lattice parameter of 0.358 nm, while the as-cast CuCrFeNiMn alloy consists of (bcc+fcc1+fcc2) phases with lattice parameters of 0.287 nm, 0.366 nm, and 0.361 nm. The heat treatment of the cast CuCrFeNiMn alloy results in the different type of microstructure depending on the heat treatment temperature. At $900^{\circ}C$ a new thermodynamically stable phase appears instead of the bcc solid solution phase, while at $1,000^{\circ}C$, the heat treated microstructure is almost same as that in the as-cast state. The addition of Al in CuCrFeNiMn alloy changes the constituent phases from (fcc1+fcc2+bcc) to (bcc1+bcc2).

폴리이미드에 스퍼터 증착된 Cu-Cr 합금박막의 열처리 거동 (Thermal behavior of Cu-Cr Alloy Films sputter-deposited onto polyimide)

  • 임준홍;이태곤;김영호;한승희
    • 한국표면공학회지
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    • 제27권5호
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    • pp.273-284
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    • 1994
  • Thermal behavior of Cu-Cr thin alloy films has been investigated by SEM, AES, and TEM. Cu-Cr alloy films containing 3wt% Cr, 8wt% Cr have been sputter-deposited onto polyimide substrates and heat treated at $400^{\circ}C$ for 2hrs in the various atmosphere. Before heat treatment, Cu and Cr content in the film are uniform through the thickness and oxygen content in the film is negligible. Redistribution of Cr, Cu, and O in the film due to heat treatment depends on the Cr content and heat treatment atmoshpere. There kinds of thermal behavior are ascribed to the formation of surface and interface oxides as well as internal oxidation. Hillocks are observed on the surface of Cu-Cr alloy films which have been heat treated in N2. The hillocks are composed of large grainss of Cu.

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폴리이미드에 스퍼터 증착한 Cu-Cr, Cu-Ti 합금박막의 열처리 전후의 접착력과 미세구조 (Microsstructure of Sputter-Deposited and Annealed Cu-Cr, Cu-Ti Alloy Films on Polyimide Substrate and Their Adhesion Property)

  • 서환석;김기범
    • 한국표면공학회지
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    • 제27권5호
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    • pp.261-272
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    • 1994
  • Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

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크롬동합금의 도전율과 경도에 미치는 용체화처리와 시효처리의 영향 (The Effects of Solution Heat Treatment and Aging Treatment on the Electrical Conductivity and Hardness of Cu-Cr Alloys)

  • 김신우
    • 열처리공학회지
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    • 제15권1호
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    • pp.21-24
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    • 2002
  • The electrode materials for welding machine in automobile industry such as Cu-Cr, Cu-Zr and Cu-$Al_2O_3$ require the high electrical conductivity and the proper hardness. Therefore the effects of solution heat treatment and aging treatment on the electrical conductivity and hardness of Cu-0.8wt%Cr and Cu-1.2wt%Cr alloys have been investigated. Cu-0.8wt%Cr alloy showed the higher electrical conductivity and hardness than Cu-1.2wt%Cr alloy and both alloys showed the better electrical conductivity at $930^{\circ}C$ among 930, 980 and $1030^{\circ}C$ solution heat treatment temperatures. The electrical conductivity and hardness in both alloys were not affected by aging treatment but remarkably affected by solution heat treatment temperature. The final drawing process reduced electrical conductivity and increased hardness more in Cu-1.2wt%Cr alloy.

알루미나/니켈크롬강 접합체의 미세조직 및 접합강도에 미치는 Ag-Cu-Zr-X 브레이징 합금성분의 영향 (Effect of the Alloying Elements in Ag-Cu-Zr-X Brazing Alloy on the Microstructure and the Bond Strength of $Al_2O_3$/Ni-Cr Steel Brazed Joint)

  • 김종헌;유연철
    • 소성∙가공
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    • 제7권5호
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    • pp.465-473
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    • 1998
  • The effect of alloying elements of Ag-Cu-Zr-X brazing alloy on the microstructure and the bond strength of $Al_2O_3/Ni-Cr$ brazed steel joint was investigated. The reaction layer, $ZrO_2$ (a=5.146 ${\AA}$ , b=5.213 ${\AA}$ , c=5.311 ${\AA}$ )was formed at the interface of $Al_2O_3/Ni-Cr$ steel joint by the redox reaction between alumina and Zr. The addition of An and Al to the Ag-Cu-Zr brazing alloy gave rise to changes in the thickness of the reaction product layer and the morphology of the brazement. Sn caused the segregation of Zr was decreased b Al the $ZrO_2$ layer formed at the Ag-Cu-Zr-Al alloy was thinner than that of $ZrO_2$ formed at the Ag-Cu-Zr-An alloy. The fracture shear strength was strongly dependent on the microstructure of the brazement. Brazing with Ag-Cu-Zr-Sn alloy resulted in a better bond strength than with Ag-Cu-Zr or Ag-Cu-Zr-Al alloy.

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아말감과 이종(異種)금속의 거리에 따른 부식에 대한 고찰 (A Study on Corrosion according to Distance between Amalgam and Dissimilar Metals)

  • 김주원;정은경
    • 치위생과학회지
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    • 제4권3호
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    • pp.103-109
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    • 2004
  • 본 실험은 제조회사 매뉴얼과 통법에 의해서 Amalgam 합금, Ni-Cr alloy의 Crown용 Verabond, Denture용 Talladium $^{TM}alloy$로 각각 24개의 총 72의 시편을 하악 제1대구치근 원심 치관 폭경과 임상에서의 MOD cavity를 고려하여 제작하였고 인공 타액 80ml를 담은 200ml 용 비이커에 시편을 넣어 0mm, 7mm, 40mm 거리에서 7일 후 갈바닉 부식을 측정하였다. 유리금속은 유도 플라즈마 방출 분광기(Inductively Coupled Plasma - Atomic Emission Spectrometer(ICP-AES, JY-50P, VG Elemental Co. France)로 전해액내의 Cu, Ag, Ni, Cr, Sn, Zn, Hg를 정량 분석했으며 그 결과 다음과 같은 결론을 얻었다. 첫째, Cu, Sn, Ag, Hg, Zn은 아말감이 금 합금과 접촉했을 때가 크라운용 Ni-Cr alloy와 덴쳐용 Talladium alloy 보다 아주 많이 유리 했으며 금 합금이 구강조직과 생체 적합성이 가장 좋다지만 아말감과 함께 있을 때 가장 불리 했슴을 알 수 있었다. 둘째, 아말감이 금 합금과 접촉했을 때, 금 합금의 조성에서 Ni, Cr 같은 중금속이 함유되지 않았기 때문인지 전혀 유리되지 않았으나 Sn은 조성에는 없었지만 $227.1{\pm}18.0035{\mu}g/cm^2$나 유리 되었고 Hg도 유리되었는데 이는 아말감 자체의 유리 물질임을 추측할 수 있었다. 셋째, 아말감 합금과 금 합금 사이에서의 0mm, 7mm, 40mm 거리에서는 Cu, Ag는 유의성이 있었으며 Hg는 유의성이 없었다. 이는 금합금은 절대 아말감과 같이 사용해서 안되며 이종 보철물 사이의 거리에 관계없이 사용을 금해야 하는 것으로 사료된다. 넷째, 아말감합금이 Crown용 Ni-Cr 합금과 접촉했을 때 아말감의 Ag이 유리 되지 않았으며 Zn, Ni, Sn, Hg, Cu의 순으로 유리되었다. 0mm, 7mm, 40mm 거리에 따라서 유의성이 있었다. Hg는 유리 되지 않았지만 중금속인 Ni, Cr은 유리되었고 반대 악궁이나 거리가 떨어져 있으면 접촉보다 Hg의 유리가 적었다. 다섯째, 아말감합금이 Denture용 Talladium alloy 합금과 접촉했을 때 0mm, 7mm, 40mm 거리에서도 유의성이 있었다. 0mm, 7mm, 40mm 거리에 따라서 유의성이 있었다. Hg는 유리 되지 않았지만 중금속인 Ni, Cr은 유리되었고 반대 악궁이나 거리가 떨어져 있으면 접촉보다 Hg의 유리가 적었다. 여섯째, 인공 타액에서 접촉 시 Amalgam alloy와 Gold, Verabond, Talladium alloy의 Cu, Sn, Ag, Hg, Zn, Ni, Cr의 ICPES 검사 결과 Cu, Hg가 유의성을 있었다. 일곱째, 인공타액에서 아말감합금과 두 비귀금속인 Ni-Cr alloy(crown용), Denture용 Talladium alloy가 접촉한 경우 거리에 따른 Hg, Ni, Cr의 유리 부산물에서 유의성을 확인했다.

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Effect of gadolinium and boron addition on the texture development and magnetic properties of 23Cr-10NiCu duplex stainless steels

  • Baik, Youl;Kang, Bo Kyeong;Choi, Yong;Woo, Wan Chuck
    • Nuclear Engineering and Technology
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    • 제53권6호
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    • pp.1887-1892
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    • 2021
  • The effect of gadolinium and boron on the texture development and magnetic properties of the texture controlled 23Cr-10NiCu duplex stainless steels were studied to develop a high performance neutron and electromagnetic shielding material. The 23Cr-10NiCu base alloy is composed of 60% of austenite and 40% of ferrite, whereas, the 23Cr-10NiCu-0.5Gd-0.8B modified alloy is composed of 66% of austenite, 27% of ferrite and 7% of CrFeB intermetallic compounds. The gadolinium and boron addition to the 23Cr-10NiCu base alloy increased mechanical properties. Microstructure observation showed that the small addition of 0.5 wt% gadolinium and 0.8 wt% boron to the alloy retarded to form texture at the same hot rolling conditions, and improved the maximum magnetism, residual magnetism and coercive force about 3%, 122% and 120%, respectively.

THIN FILM ADHESION IN Cu/Cr/POLYIMIDE AND Cu/Cu-Cr/POLYIMIDE SYSTEMS

  • Joh, Cheol-Ho;Kim, Young-Ho;Oh, Tae-Sung;Park, Ik-Sung;Yu, Jin
    • 한국표면공학회지
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    • 제29권5호
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    • pp.379-385
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    • 1996
  • Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

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Cu-Fe계 합금의 강도 및 전기전도도에 미치는 Cr 원소첨가의 영향 (Effects of Added Cr Element on the Tensile Strength and Electrical Conductivity of Cu-Fe Based Alloys)

  • 김대현;이광학
    • 한국재료학회지
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    • 제20권2호
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    • pp.60-64
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    • 2010
  • This study looked at high performance copper-based alloys as LED lead frame materials with higher electrical-conductivity and the maintenance of superior tensile strength. This study investigated the effects on the tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases when Cr was added in Cu-Fe alloy in order to satisfy characteristics for LED Lead Frame material. Strips of the alloys were produced by casting and then properly treated to achieve a thickness of 0.25 mm by hot-rolling, scalping, and cold-rolling; mechanical properties such as tensile strength, hardness and electrical-conductivity were determined and compared. To determine precipitates in alloy that affect hardness and electrical-conductivity, electron microscope testing was also performed. Cr showed the effect of precipitation hardened with a $Cr_3Si$ precipitation phase. As a result of this experiment, appropriate aging temperature and time have been determined and we have developed a copper-based alloy with high tensile strength and electrical-conductivity. This alloy has the possibility for use as a substitution material for the LED Lead Frame of Cu alloy.

Cu-Cr 합금의 인장강도와 전기전도도에 미치는 Cr 첨가량 및 가공열처리의 영향 (Effects of Cr content and Thermomechanical Treatment on Tensile Strength and Electrical Conductivity of Cu-Cr Alloys)

  • 김기태;정운재;신한철;최종술
    • 열처리공학회지
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    • 제14권1호
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    • pp.17-21
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    • 2001
  • The effects of Cr content above its solubility limit and thermomechanical treatment on tensile strength and electrical conductivity of Cu-Cr alloys were studied to obtain optimum Cr content exhibiting a high tensile strength without degradation of electrical conductivity. The increase in Cr content above the solubility limit increased tensile strength of Cu-Cr alloys without deterioration of the electrical conductivity. The electrical conductivity was not affected by cold rolling. The electrical conductivity of a Cu-3.5%Cr alloy subjected to cold rolling ${\rightarrow}$ aging treatment ($450^{\circ}C{\times}1hr$) ${\rightarrow}$ cold rolling was equal to that of the alloy subjected to cold rolling ${\rightarrow}$ aging treatment. However, the tensile strength of the alloy subjected to the former thermomechanical treatment was superior to that of the alloy subjected to the latter thermomechanical treatment at all the deformation degrees.

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