• The Transactions of the Korean Institute of Electrical Engineers B
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• v.55 no.12
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• pp.628-632
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• 2006

This paper deals with the electric and thermal characteristics of the composite busbar composed of aluminum and copper. When AC current is flowing in Cu busbar used widely in conservative equipments like power cable, transformer, and switchgear & controlgear most current is concentrated on the surface of the busbar by the skin effect. Therefore, if the Cu region in the busbar having low current density is replaced with aluminum, we can largely reduce the product cost and weight of the busbar. To conform the performance of the composite busbar, we designed and fabricated a test Al/Cu composite busbar. Maximun temperature rise of the busbar was $35^{\circ}C$ when 1600 Arms of AC current was applied to the test composite busbar($120mm{\times}10mm$). Based on test results, we can expect to make the low-priced and light power equipments using the Al/Cu composite busbar.

• Applied Microscopy
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• v.36 no.2
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• pp.47-55
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• 2006

In this paper a transmission electron microscope (TEM) observation of fine Cu precipitates distributed randomly in Al-2.5Cu-1.5Mg wt.% alloy is first reported. This new observation happened to occur when an ion milling was peformed to remove oxides on the specimen, particularly, aged 100 hours at $150^{\circ}C$. Meanwhile the oxides were identified to be $Cu_2O$ particles. For this work involved with analysis of diffraction rings, the formulation of the electron diffraction rings pattern for powder particles was made. Finally the significance of this unexpected ion milling effort on the alloy was discussed

• Journal of the Korean Vacuum Society
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• v.10 no.4
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• pp.403-410
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• 2001

Acceleration in integration density and speed performance of ULSI circuits require miniaturization of CMOS and interconnections as well as higher current density capabilities for transistors. A leading candidate to substitute Al-alloy is Cu, which has lower resistivity and higher melting point. So we can expect much higher electromigration resistance. In this paper, we are going to explain the major features of EM for MOCVD Cu according to variant conditions. We compared the life time and activation energy of MOCVD Cu with those of I-beam Cu and AA in the same conditions. The electromigration experiments were performed with Cu/Al/TiN multilayer. Experimental results shows that the deposition rate and electromigration characteristics of Cu thin film were improved by the Al interlayer.

• Journal of Korea Foundry Society
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• v.16 no.6
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• pp.556-564
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• 1996

Variation of shape and size of solid particles and solute redistribution in Mg-9wt.%Al, AI-4.5wt.% Cu, and AI-7wt.%Si alloys were investigated when they were heated to semi-solid temperatures and held without stirring. In the case of Mg-9wt.% Al and Al-4.5wt.%Cu alloys, the polygonal shaped solid particles were agglomerated with non-uniform distribution, and there were no disappearance of the solid/solid boundary until the end of melting. But in the case of an Al-7wt.%Si alloys, two or three spherical shaped particles were coalesced or separated individually, and the coalesced particles had no solid/solid interface on the contrary to the prevous case. The maximum size of solid particles during isothermal heating at high temperature was smaller than that at lower temperature, but the time required to reach the maximum size at high temperature was shorter than that at lower temperature. The concentrations of main solute atom whose distribution coefficient is lower than 1, decreased in the primary solid particles as the liquid fraction increased, and the gradient of solute concentration was steeper in Mg-9wt.%Al alloy and Al-4.5wt.%Cu alloy than that of Al-7wt.%Si alloy.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.241-247
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• 1992

The direct bonding of Cu to $Al_2O_3$, employing the $Cu-Cu_2$O eutectic skin melt, is investigated. The bonding force and interface structure of samples prepared by oxidation at $1015^{\circ}C$ in $1.5{\times}10^{-1}$torr followed by bonding at 107$5^{\circ}C$ under $10_{-3}$ torr vacuum have been studied using peeling test, SEM, EDS and XRD. It has been found that the optimal strength is obtained for 3 minutes of oxidation while the adhesion force is decreased with oxidation shorter or longer than 3 minutes. The rupture occured at alumina-eutectic interface. Fractured surface of $Al_2O_3$covered with $Cu_2$O nodules pulled out of the Cu indicates that bonding strength is governed by $Cu-Cu_2$O interface and not by $Cu_2$O-A$l_2O_3$interface. The bonding force is slightly increased with bonding time and the reaction phases of CuA$l_2O_4$and $CuAlO_2$are formed at interface during the bonding.

• Journal of Korea Foundry Society
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• v.15 no.4
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• pp.368-376
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• 1995

An Al-composite material was fabricated with using the rheocompocasting process and the microstructure of the Al-Cu/SiCp composite material was investigated depending on the stirring times and the amount of Ti additions. The distribution of SiC dispersion shows the good result at the stirring time of 30 min. The degree of microdistribution of the $Al_2Cu$ and SiCp is improved when the amount of Ti addition is increased. At the compositon of 0.3%Ti, the primary solid is the compound of $Al_3Ti$ and no exist of the SiCp and $Al_2Cu$ phase around the primary $Al_3Ti$. In the process of compositization, SiCp is found at the primary and final solid parts and is found at the final solid part after remelting. $Al_2Cu$ and SiCp are distributed around and outside of dendrite or independently after remelting, which is different from the process of compositization.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.39 no.2
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• pp.152-157
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• 2003

Most Recently, with rapid development in marine industries such as marine structures and ship, there occurs much interest in the study of corrosion characteristics which play an important role in design of cooling water system like heat-exchanger. Especially, as operating environment of fresh cooling water system in vessels is acidified, this system is seriously corroded. In this study, to study on the corrosion characteristics of Al-alloy shell for cooler, the electrochemical polarization test of materials for the marine fresh water cooler such as Al-alloy, Cu and naval brass was carried out in fresh water. And thus the polarization resistance and anodic polarization behavior of Al-alloy, Cu and naval brass are investigated. Also, galvanic corrosion characteristics of Al-alloy coupled with Cu and naval brass is considered. The main results obtained are as follows ; (1) The current density of corrosion is high in order of Al-alloy > naval brass > Cu (2) As anodic potential increases, the corrosion resistance of naval brass is better than that of Cu. (3) The galvanic corrosion of Al-alloy coupled with Cu and naval brass is activated than corrosion of Al-alloy.

• Korean Journal of Materials Research
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• v.26 no.7
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• pp.376-381
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• 2016

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

• Korean Chemical Engineering Research
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• v.59 no.2
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• pp.296-303
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• 2021

The objective of this study is to investigate the applicability of a Cu-supported honeycomb catalyst as a catalyst for decomposition of a low toxic liquid propellant based on ammonium dinitramide (ADN). A mixture of copper, lanthanum, and alumina was supported on the honeycomb support by wash coating to prepare a Cu-La-Al/honeycomb catalyst. We elucidated that the effect of metal loading on the physicochemical properties of Cu-La-Al/honeycomb catalyst and catalytic performance in decomposition of the ADN-based liquid propellant. As the number of wash coatings increased, the amount of active metal Cu was increased to 4.1 wt%. The BET surface area of the Cu-La-Al/honeycomb catalyst was in the range of 3.1~4.1 ㎡/g. The micropores were hardly present in Cu-La-Al/honeycomb catalysts, however, the mesopores and macropores were well developed. The Cu (2.7 wt%)-La-Al/honeycomb catalyst exhibited the highest activity in the decomposition of the ADN-based liquid propellant, which is attributed to the largest surface area, the largest pore volume, and the well-developed mesopores and macropores.

• Bulletin of the Korean Chemical Society
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• v.11 no.1
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• pp.1-7
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• 1990

We present a theoretical investigation on the etching of an Al solid by $SiCl_4$ molecules at a collision energy of 600 eV. The classical trajectory method is employed to calculate Al etching yields, degree of anisotropy, kinetic energy distribution and angular distribution. The calculated results are compared with the reaction of a Cu solid by $SiCl_4$. The major products of the reaction are aluminum monomers and dimers together with considerable quantities of multimers. The Al solid shows better etching yield and better anisotropy than the Cu solid. This is consistent with the problem in the CMOS micro-fabrication of the CuAl and CuAlSi alloys. The relevance of these calculations for the dry etching of CuAl alloy is discussed.