• 열처리공학회지
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• 제7권2호
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• pp.96-102
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• 1994

The present work was aimed to examine the changes of the shape and particle size distribution(PSD) of ${\delta}^{\prime}$ particles on ageing in Al-Li-(Cu, Zr) alloys which had low density, high specific strength and stiffness, Increasing ageing time and temperature resulted in particles whose aspect ratio tended toward 1. The aspect ratio of ${\delta}^{\prime}$ particles was not dependent upon the ageing temperature and time in Al-Li-Cu alloy but was dependent upon them in Al-Li-Zr alloy. The PSD of ${\delta}^{\prime}$ particles in Al-Li-Zr alloy skewed to the right hand compared with that in Al-Li-Cu alloy, because $Al_3Zr$ phase in Al-Li-Zr alloy formed before ageing promoted the precipitation and growth of ${\delta}^{\prime}$ phase. Therefore, the PSD of the ${\delta}^{\prime}$ particles was found to be affected by the presence of $Al_3Zr$ particles. The growth rate of ${\delta}^{\prime}$ phase was not affected by the existence of the third transition phase $T_1$ formed by the addition of Cu in Al-Li alloy but was affected by the existence of $Al_3Zr$ formed by the addition of Zr in Al-Li alloy.

• 한국재료학회지
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• 제5권2호
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• pp.169-177
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• 1995

Cu와 Si사이의 확산방지막으로 1000$\AA$ 두께의 TiN의 특성에 대하여 면저항 측정, 식각패임자국 관찰, X선 회절, AES, TEM 등을 이용하여 조사하였다. TiN 확산방지막은 $550^{\circ}C$, 1시간의 열처리 후에 Cu의 안쪽 확산으로 인해 Si(111)면을 따라 결정결함(전위)을 형성하고, 전위 주위에 Cu 실리사이드로 보이는 석출물들을 형성함으로써 파괴되었다. Al의 경우와는 달리 Si 패임자국이 형성되지 안흔 것으로부터 TiN확산방지막의 파괴는 Cu의 안쪽 확산에 의해서만 일어나는 것을 알 수 있었다. 또한, Al의 경우에는 우수한 확산방지막 특성을 보여주었던 충진처리된 TiN가 Cu의 경우에는 거의 효과가 없는 것을 알 수 있었다. 이것은 Al의 경우에는 TiN의 결정립계에 존재하는 $TiO_{2}$가 Al과 반응하여 $Al_{2}O_{3}$를 형성함으로써 Al의 확산을 방해하는 화학적 효과가 매우 크지만, Cu의 경우에는 CuO 또는 $Cu_{2}O$와 같은 Cu 산화물은$TiO_{2}$에 비해서 열역학적으로 불안정하기 때문에 이러한 화학적 효과를 기대할 수 없으며, 따라서 충진처리 효과가 거의 없는 것으로 이해된다.

• 한국주조공학회지
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• 제10권6호
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• pp.503-508
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• 1990

The effect of interlamellar spacing on tensile behavior and fracture mode at high temperatures has been studied for unidirectionally solidified $Al-CuAl_2$ eutectic composite. The tensile properties at room temperature in $Al-CuAl_2$ eutectic composite improved as the interlamellar spacing decreased due to the constraint effects of closely spaced lamellae, while the opposite behavior was observed at high temperatures due to the annihilation of the constraint effects by phase boundary sliding. The $Al-CuAl_2$ eutectic composite exhibited brittle fracture mode below the temperature at which the reinforcing phase softened but ductile fracture mode above the temperature.

• 한국주조공학회지
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• 제17권5호
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• pp.480-487
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• 1997

Particle reinforced metal matrix composites(MMCs) via a centrifugal spray-cast deposition(CSD) process were fabricated by injecting second phase particles($Al_2O_3$<40${\mu}m$, W<17.3${\mu}m$) into copper melt on the atomizing disc. Compositing modes were investigated by combining microstructures and mathematical modeling between Cu droplets and the reinforced particles injected. The $Cu/W_P$ powders were shown that the W particles penetrate and get embedded in the Cu droplets. It is considered that the W particles composite preferentially in Cu melt on the atomizing disc. On the other hand, the $Al_2O_3$, particles did not penetrate into the Cu droplets on the atomizing disc but get attached in surface of Cu droplets during the flight. It is considered that the compositing may be attained in the flight distance which the relative velocity between Cu droplet and $Al_2O_3$, particle is maximum. The microstructure of the $Cu/W_P$ and the $Cu/(Al_2O_3)_p$ composite preform was strongly influenced by compositing modes of droplets, and after subsequent deposition it was comprised as it is called the dispersed type and the cell type of microstructure, respectively.

• 한국재료학회지
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• 제14권8호
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• pp.595-599
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• 2004

We investigated the structural, electrical and magnetic properties of Mn-doped $CuAlO_2$ delafossite ceramics ($CuAl_{1-x}Mn_{x}O_2,\;0\le\;x\;\le0.05$), synthesized by solid-state reaction method in an air atmosphere at a sintering temperature of $1150^{\circ}C$. The solubility limit of Mn ions in delafossite $CuAlO_2$ was found to be as low as about 3 $mol\%$. Positive Hall coefficient and the temperature dependence of conductivity established that non-doped $CuAlO_2$ ceramic is a variable-range hopping p-type semiconductor. It was found that the Mn-doping in $CuAlO_2$ rapidly reduced the hole concentration and conductivity, indicating compensation of free holes. The analysis of the magnetization data provided an evidence that antiferromagnetic superexchange interaction is the dominant mechanism of the exchange coupling between Mn ions in $CuAl_{1-x}Mn_{x}O$ alloy, leading to an almost paramagnetic behavior in this alloy.

• 한국전기전자재료학회논문지
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• 제14권5호
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• pp.435-443
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• 2001

As power durable RF SAW filters, AL-(0∼2wt%)Cu alloy multi-layered thin electrodes were deposited on 42° LiTaO$_3$ piezoelectric substrates by magnetron sputtering process, and then ladder-type RF SAW filters, satisfying the electrical specification of CDMA transmission band, were fabricated through optimizing SAW resonator structures. The temperature of film electrodes in SAW filter was increased with RF power, and reached the maxima to cause a failure of SAW filters at the cut-off frequencies of the RF filter band. As RF power increases, the electrodes of Al-Cu alloy showed higher power durability than that of pure Al. The multi-layer laminated film of Al-1wt.% Cu/Cu/Al-1wt%Cu resulted in the best power durability up to 4W of RF power. Every film electrode, however, was destroyed within seconds whenever applying a critical RF power to SAW filters, regardless of the composition and structure of film electrodes. The breakdown of film electrodes under FR power seems to believe due to the fatigue of electrodes caused by repetitive cyclic stress of surface acoustic wave, which is amplified as RF power increases.

• 한국재료학회지
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• 제30권8호
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• pp.435-440
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• 2020

The relationship between the precipitation of secondary phase and the thermal properties of Al-4.5%Cu alloy (in wt.%) after various heat treatments has been studied. Solid solution treatment of alloy was performed at 808 K for 6 hours, followed by warm water quenching; then, the samples were aged in air at 473 K for different times. The thermal diffusivity of the Al-4.5%Cu alloy changed with the heat treatment conditions of the alloy at temperatures below 523 K. The as-quenched specimen had the lowest thermal diffusivity, and as the artificial aging time increased, the thermal diffusivity of the specimen increased in the temperature range between 298 and 523 K. For the specimen aged for five hours, the thermal conductivity was 12% higher than that of the as-quenched specimens at 298 K. It is confirmed that the thermal diffusivity and thermal conductivity of the Al-4.5%Cu alloy significantly depend on their thermal history at temperatures below 523 K. The precipitation and dissolution of the Al₂Cu phase were confirmed via DSC for the alloys, and the formation of coefficient of thermal expansion peaks in TMA was caused by precipitation. The precipitation of supersaturated solid solution of Al-4.5%Cu alloys had an additional linear expansion of ≈ 0.05 % at 643 K during thermal expansion measurement.

• Archives of Metallurgy and Materials
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• 제65권3호
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• pp.1019-1022
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• 2020

In the past few years, overhead copper transmission lines have been replaced by lightweight aluminum transmission lines to minimize the cost and prevent the sagging of heavier copper transmission lines. High strength aluminum alloys are used as the core of the overhead transmission lines because of the low strength of the conductor line. However, alloying copper with aluminum causes a reduction in electrical conductivity due to the solid solution of each component. Therefore, in this study, the authors attempt to study the effect of various Al/Cu ratios (9:1, 7:3, 5:5) to obtain a high strength Al-Cu alloy without a significant loss in its conductivity through powder metallurgy. Low-temperature extrusion of Al/Cu powder was done at 350℃ to minimize the alloying reactions. The as-extruded microstructure was analyzed and various phases (Cu9Al₄, CuAl₂) were determined. The tensile strength and electrical conductivity of different mixing ratios of Al and Cu powders were studied. The results suggest that the tensile strength of samples is improved considerably while the conductivity falls slightly but lies within the limits of applications.

• 열처리공학회지
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• 제33권6호
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• pp.284-289
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• 2020

Since the dissimilar bonded interface usually consists of intermetallic compounds (IMCs) layer and cracks, their mechanical and electrical properties can be influenced by microstructure at interface between two different metals. In this study, the friction welded Cu-Al busbar, which is widely used to connect a secondary battery and their component, is selected to analyze the influence of interfacial characteristic on their tensile strength and electric conductivity. Then, the electrical characteristics of Cu busbar and Cu-Al busbar were investigated by thermal flow analysis and temperature rise test. In addition, the relationship between the maximum saturation temperature and the electrical conductivity were discussed in terms of interfacial characteristics of the friction welded Cu-Al busbar.

• 한국응용과학기술학회지
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• 제33권2호
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• pp.401-410
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• 2016

금속 산화물과 혼합한 $Pt-Sn/Al_2O_3$ 촉매의 프로판 탈수소 반응 성능의 향상 가능성에 대해서 연구하였다. 금속 산화물로서 $Cu-Mn/{\gamma}-Al_2O_3$, $Ni-Mn/{\gamma}-Al_2O_3$, $Cu/{\alpha}-Al_2O_3$를 제조하여 $Pt-Sn/Al_2O_3$ 촉매와 혼합하고, 프로판 탈수소 반응 성능을 측정하였다. 이 결과들을 불활성 물질인 glass bead를 혼합한 $Pt-Sn/Al_2O_3$ 촉매를 기준샘플로 삼아 비교하였다. 촉매와 금속산화물을 환원처리하지 않고 반응 실험한 경우, $576.5^{\circ}C$에서 기준샘플의 전환율 8% 대비, $Cu-Mn/{\gamma}-Al_2O_3$를 혼합한 $Pt-Sn/Al_2O_3$ 촉매가 14.9%의 높은 전환율과 96.8%의 선택도를 보였다. 촉매와 금속산화물을 환원 처리하여 반응활성을 측정한 경우, $Cu/{\alpha}-Al_2O_3$과 $Pt-Sn/Al_2O_3$의 혼합촉매가 기준샘플대비 초기에 높은 수율을 보였다. 그러나, 촉매를 환원 처리한 경우 전반적으로 전환율 상승이 크지 않았고, 이것으로 $Cu-Mn/{\gamma}-Al_2O_3$의 격자산소가 탈수소반응의 전환율 증가 영향을 주었음을 알 수 있었다.