• Journal of Welding and Joining
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• v.23 no.5
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• pp.49-54
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• 2005

The effective charge number and the critical current density of electromigration in eutetic SnPb and Pb Free $(SnAg_{3.8}Cu_{0.7)$ flip chip solder bumps are studied. The effective charge number of electromigration in eutectic SnPb solder is obtained as 34 and the critical current density is $j=0.169{\times}({\delta}_{\sigma}/{\delta}_x})\;A/cm^2,\;where\;({\delta}_{\sigma}/{\delta}_x})$ is the electromigration-induced compressive stress gradient along the length of the line. While the effect of electromigration in Pb free solder is much smaller than that in eutectic SnPb, the product of diffusivity and effective charge number $DZ^{\ast}$ has been assumed as $6.62{\times}10^{-11}$. The critical length for electromigration are also discussed.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.35-42
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• 2024

Recently, with the miniaturization and high integration of semiconductor chips, the bump bridge phenomenon caused by fine pitches is drawing attention as a problem. Accordingly, Cu pillar bump, which can minimize the bump bridge phenomenon, is widely applied in the semiconductor package industry for fine pitch applications. When exposed to a high-temperature environment, the thickness of the intermetallic compound (IMC) formed at the joint interface increases, and at the same time, Kirkendall void is formed and grown inside some IMC/Cu and IMC interfaces. Therefore, it is important to control the excessive growth of IMC and the formation and growth of Kirkendall voids because they weaken the mechanical reliability of the joints. Therefore, in this study, isothermal aging evaluation of Cu pillar bump joints with a CS (Cu+ Sn-1.8Ag Solder) structure was performed and the corresponding results was reported.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.90-96
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• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• Progress in Superconductivity and Cryogenics
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• v.24 no.1
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• pp.13-17
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• 2022

The mechanical properties of REBCO coated conductor (CC) tapes under uniaxial tension are mainly determined by the thick layer Components like the substrate and the stabilizer. Depending on the applications of the CC tapes, it is also needed to externally reinforce thin metallic foils to one side or both sides of the CC tapes. This study investigated the effect of additional stabilizer layers or lamination on the electrical resistivity and electromechanical properties in RCE-DR processed GdBCO CC tapes with different structures. The strain/stress tolerance of I_c in differently processed 12 mm-wide REBCO CC tapes under uniaxial tension at 77 K and self-field could be determined by the loading-unloading scheme. As a result, Sn-Cu stabilized CC tape showed a significant decrease in mechanical properties due to its soft but thick stabilizing layer. However, similar electromechanical properties have been observed on both Sn-Cu and Sn-stabilized CC tapes, the I_c degradation behavior was independent of whether the CC tape has an external reinforcement or different stabilizing layers.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.49-53
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• 2011

High-speed Cu filling into a through-silicon-via (TSV) and simplification of bumping process by electroplating for three dimensional stacking of Si dice were investigated. The TSV was prepared on a Si wafer by deep reactive ion etching, and $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to increase the filling rate of Cu into the via, a periodic-pulse-reverse wave current was applied to the Si chip during electroplating. In the bumping process, Sn-3.5Ag bumping was performed on the Cu plugs without lithography process. After electroplating, the cross sections of the vias and appearance of the bumps were observed by using a field emission scanning electron microscope. As a result, voids in the Cu-plugs were produced by via blocking around via opening and at the middle of the via when the vias were plated for 60 min at -9.66 $mA/cm^2$ and -7.71 $mA/cm^2$, respectively. The Cu plug with a void or a defect led to the production of imperfect Sn-Ag bump which was formed on the Cu-plug.

• Korean Journal of Materials Research
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• v.31 no.11
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• pp.619-625
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• 2021

Cu₂ZnSn(S,Se)₄ (CZTSSe) based thin-film solar cells have attracted growing attention because of their earth-abundant and non-toxic elements. However, because of their large open-circuit voltage (V_oc)-deficit, CZTSSe solar cells exhibit poor device performance compared to well-established Cu(In,Ga)(S,Se)₂ (CIGS) and CdTe based solar cells. One of the main causes of this large V_oc-deficit is poor absorber properties for example, high band tailing properties, defects, secondary phases, carrier recombination, etc. In particular, the fabrication of absorbers using physical methods results in poor surface morphology, such as pin-holes and voids. To overcome this problem and form large and homogeneous CZTSSe grains, CZTSSe based absorber layers are prepared by a sputtering technique with different RTA conditions. The temperature is varied from 510 ℃ to 540 ℃ during the rapid thermal annealing (RTA) process. Further, CZTSSe thin films are examined with X-ray diffraction, X-ray fluorescence, Raman spectroscopy, IPCE, Energy dispersive spectroscopy and Scanning electron microscopy techniques. The present work shows that Cu-based secondary phase formation can be suppressed in the CZTSSe absorber layer at an optimum RTA condition.

• Journal of the Korean Magnetics Society
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• v.13 no.3
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• pp.121-126
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• 2003

The electromagnetic properties and microstructures of the basic composition of (N $i_{0.2}$C $u_{0.2}$Z $n_{0.6}$)$_{1.085}$(F $e_2$ $O_3$)$_{0.915}$ were invested by changing of the additive Sn $O_2$, CaO amounts and ferrite processes. There is no variation of grain size by changing additive amount. It can reduce the total loss when (N $i_{0.2}$C $u_{0.2}$Z $n_{0.6}$)$_{1.085}$(F $e_2$ $O_3$)$_{0.915}$ composition sintered at 1150 $^{\circ}C$ better than 130$0^{\circ}C$. Additive CaO confirmed of useful addition for the reduce total loss, because it increasing sintering density. Decreasing total loss were observed by adding both Sn $O_2$ 0.06 wt％ and CaO 0.4 wt％.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.580-585
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• 2009

The effects of shear speed and tip height on the high speed shear test of Sn-3.0wt.%Ag-0.5wt.%Cu ball joints were investigated. Solder balls of $450{\mu}m$ in diameter were reflowed at $245^{\circ}C$ on a FR4 PCB (Printed Circuit Board) in order to obtain a sample for the high-speed shear test. The UBM was comprised of Cu/Ni/Au, and the shear speed and tip height varied from 0.5 to 3.0 m/s, and from 10 to $135{\mu}m$, respectively. According to the experimental results, faster shear speed enhanced the shear strength of the solder joints, regardless of the tip height. The fraction of ductile (solder) fracture decreased when the shearing speed was raised from 0.5 to 3.0 m/s. With an increasing tip height from 10 to 50 and $135{\mu}m$, the fracture mode changed from pad lift to mixed (ductile and brittle) and ductile fracture, respectively, while the shearing energy also increased in the same order. The shear energy had a proportional relationship with the fraction of the solder fracture.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.211-220
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• 2011

To improve the low ductility and high strain-rate sensitivity in Sn-Bi based solder alloys, the influences of the minor additions of alloying elements (Ag, Mn, In) were investigated. The strain-stress curves of various Sn-40Bi(-X) alloys, including a pre-suggested Sn-40Bi-0.1Cu composition were measured using a tensile testing machine. As a result, the elongation and ultimate tensile strength (UTS) values were compared. The small addition (0.5 wt.%) of Ag significantly enhanced the ductility and high strain-rate sensitivity of the alloys at strain rates of $10^{-4}$ to $10^{-2}\;s^{-1}$ mainly due to the increase and refinement of eutectic lamellar structures. The microstructure change increased the area of grain boundaries, thus ameliorating the grain boundary sliding mode. It was also found that Mn is an effective element in enhancing the ductility, especially at the strain rates of $10^{-3}$ to $10^{-2}\;s^{-1}$ The enhancement is likely attributed to the fine and homogeneous microstructure in the alloys containing Mn.