• Applied Microscopy
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• v.45 no.4
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• pp.236-241
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• 2015

Carbon-coated Ni, Cu and Sn nanocapsules were investigated by means of X-ray diffraction (XRD), transmission electron microscopy (TEM) and a four-point probe device. All of these nanocapsules were prepared by an arc-discharge method, in which the bulk metals were evaporated under methane ($CH_4$) atmosphere. Three pure metals (Ni, Cu, Sn) were typically diverse in formation of the carbon encapsulated nanoparticles and their different mechanisms were investigated. It was indicated that a thick carbon layers formed on the surface of Ni(C) nanocapsules, whereas a thin shell of carbon with 1~2 layers covered on Cu(C) nanocapsules, and the Sn(C) nanocapsules was, in fact, a longger multi-walled carbon nanotubes partially-filled with metal Sn. As one typical magnetic/dielectric nanocomposite particles, Ni(C) nanocapsules and its counterpart of oxide-coated Ni(O) nanocapsules were compared in the electrically conductive behaviors for further applications as the electromagnetic materials.

• Current Photovoltaic Research
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• v.1 no.2
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• pp.109-114
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• 2013

$Cu_2ZnSnS_4$ (CZTS) nanoparticles were synthesized by a solvothermal method using copper (II) acetate, zinc acetate, tin chloride, and sulfur in diethylenetriamine solvent. Binary sulfide particles such as CuS, ZnS, SnS, and $SnS_2$ were obtained at $180^{\circ}C$; single-phase CZTS nanoparticles were obtained at $280^{\circ}C$. CZTS nanoparticles with spherical shape and grain size of 40 to 60 nm were obtained at $280^{\circ}C$. In the middle of 180 and $280^{\circ}C$, CZTS and ZnS phases were found. The time variation of reaction at $280^{\circ}C$ revealed that an amorphous state formed first instead of binary phases and then the amorphous phase was converted to crystalline CZTS state; it is different reaction path way from conventional solid-state reaction path of which binary phases react to form CZTS. CZTS films deposited and annealed from single-phase nanoparticles showed porous microstructure and poor adhesion. This indicates that a combination of CZTS and other flux phase is necessary to have a dense film for device fabrication.

• Current Photovoltaic Research
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• v.3 no.4
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• pp.135-139
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• 2015

$Cu_2SnS_3$ (CTS) based thin film solar cells (TFSCs) are of great interest because of its earth abundant, low-toxic and eco-friendly material with high optical absorption coefficient of $10^4cm^{-1}$. In this study, the DC sputtered precursor thin films have been sulfurized using rapid thermal annealing (RTA) system in the graphite box under Ar gas atmosphere for 10 minute. The systematic variation of sulfur powder during annealing process has been carried out and their effects on the structural, morphological and optical properties of CTS thin films have been investigated. The preliminary power conversion efficiency of 1.47% with a short circuit current density of $33.9mA/cm^2$, an open circuit voltage of 159.7 mV, and a fill factor of 27% were obtained for CTS thin film annealed with 0.05g of S powder, although the processing parameter s have not yet been optimized.

• Journal of Powder Materials
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• v.31 no.2
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• pp.146-151
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• 2024

Pure SnO₂ has proven very difficult to densify. This poor densification can be useful for the fabrication of SnO₂ with a porous microstructure, which is used in electronic devices such as gas sensors. Most electronic devices based on SnO₂ have a porous microstructure, with a porosity of > 40%. In pure SnO₂, a high sintering temperature of approximately 1300℃ is required to obtain > 40% porosity. In an attempt to reduce the required sintering temperature, the present study investigated the low-temperature sinterability of a current system. With the addition of TiO₂, the compositions of the samples were Sn_1-xTi_xO₂-CoO(0.3wt%)-CuO(2wt%) in the range of x ≤ 0.04. Compared to the samples without added TiO₂, densification was shown to be improved when the samples were sintered at 950℃. The dominant mass transport mechanism appears to be grain-boundary diffusion during heat treatment at 950℃.

• Journal of Conservation Science
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• v.29 no.4
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• pp.355-366
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• 2013

Diverse scientific analyses, including microstructure, ICP-AES, SEM-EDS, and P-XRF(Bench Top type and Gun type), were carried out on 6 bronze artefacts which handed from generation to generation. Also, we attempted to study applicability for authenticity of the bronze artefacts using scientific analyses based on the specific element. The results of ICP-AES analysis showed that the bronze were formed from an alloy of Cu, Sn, Pb with trace elements such as Ag, As, Co, Fe, but there were not Zn found. The result of P-XRF are 10~25% lower in Cu and 10~20% higher in Sn than that of ICP-AES. This is because of destannification that the compound of $SnO_2$ are present on the surface. The results of SEM-EDS represented that there is lead segregation. It was difficult to study applicability for authenticity of bronze artefact according to the microstructures and chemical components of the bronze artefacts. Therefore, as bronze artefacts have shown different corrosion materials depending on the buried environment and conserving environment, identifying the authenticity would be possible on the basis of the additional researches on the corrosion and comparative research of ancient art.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.5
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• pp.467-471
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• 2015

Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.91-95
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• 2007

Electromigration characteristics of Sn-3.5Ag flip chip solder bump were analyzed using flip chip packages which consisted of Si chip substrate and electroplated Cu under bump metallurgy. Electromigration test temperatures and current densities peformed were $140{\sim}175^{\circ}C\;and\;6{\sim}9{\times}10^4A/cm^2$ respectively. Mean time to failure of solder bump decreased as the temperature and current density increased. The activation energy and current density exponent were found to be 1.63 eV and 4.6, respectively. The activation energy and current density exponent have very high value because of high Joule heating. Evolution of Cu-Sn intermetallic compound was also investigated with respect to current density conditions.

• Journal of Surface Science and Engineering
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• v.46 no.1
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• pp.22-28
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• 2013

$WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.531-536
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• 2003

The electromagnetic properties and microstructures of the ferrites based on ($Ni_{0.2}$ $Cu_{0.2}$ $Zn_{0.6}$)$_{1.085}$($Fe_2$$O_3$)$_{0.915}$ were investigated by changing the amount of additive SnO$_2$and CaO and the sintering temperatures. Addition of $SnO_2$caused pores in the specimen. There was no variation of grain size by changing the amount of additives. Total loss was reduced when ($Ni_{0.2} $Cu_{0.2}$ $Zn_{ 0.6}$)$_{1.085}$ ($Fe_2$$O_3$)$_{0.915}$ composition was sintered at $1150^{\circ}C$ rather than $1300^{\circ}C$. Addition of CaO was useful to reduce the total loss because it increased the sintering density. The lowest total loss was obtained when 0.06 wt% $SnO_2$and 0.4 wt% CaO were added at the same time.