• Journal of Welding and Joining
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• v.29 no.6
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Journal of Institute of Control, Robotics and Systems
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• v.13 no.7
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• pp.616-623
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• 2007

A dual micro gas sensor array was fabricated using nano sized $SnO_2$ thin films which had good sensitivities to CO and combustible gases, or $H_2S$ gas for air quality sensors in automobile. The already existed air quality sensor detects oxidizing gases and reducing gases, the air quality sensor(AQS), located near the fresh air inlet detected the harmful gases, the fresh air inlet door/ventilation flap was closed to reduce the amount of pollution entering the vehicle cabin through HVAC(heating, ventilating, and air conditioning) system. In this study, to make $SnO_2$ thin film AQS sensor, thin tin metal layer between 1000 and $2000{\AA}$ thick was oxidized between 600 and $800^{\circ}C$ by thermal oxidation. The gas sensing layers such as $SnO_2$, $SnO_2$(pt) and $SnO_2$(+CuO) were patterned by metal shadow mask for simple fabrication process on the silicon substrate. The micro gas sensors with $SnO_2$(+Pt) and $SnO_2$(CuO) showed good selectivity to CO gas among reducing gases and good sensitivity to $H_2S$ that is main component of bad odor, separately.

• Current Photovoltaic Research
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• v.5 no.1
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• pp.20-24
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• 2017

Recently, three-dimensional (3D) light harvesting structures are highly attracted because of their high light harvesting capacity and charge collection efficiencies. In this study, we have fabricated $Cu_2ZnSn(S_xSe_{1-x})_4$ based 3D thin film solar cells on PR patterned Molybdenum (Mo) substrates using photolithography technique. Specifically, Mo patterns were deposited on PR patterned Mo substrates by sputtering and the thin Cu-Zn-Sn stacked layer was deposited over this Mo patterns by sputtering technique. The stacked Zn-Sn-Cu precursor thin films were sulfo-selenized to form CZTSSe pattern. Finally, CZTSSe absorbers were coated with thin CdS layer using chemical bath deposition and ZnO window layer was deposited over CZTSSe/CdS using DC sputtering technique. Fabricated 3-D solar cells were characterized by X-ray diffraction (XRD), X-ray fluorescence (XRF) analysis, Field-emission scanning electron microscopy (FE-SEM) to study their structural, compositional and morphological properties, respectively. The 3% efficiency is achieved for this kind of solar cell. Further efforts will be carried out to improve the performance of solar cell through various optimizations.

• Current Photovoltaic Research
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• v.2 no.4
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• pp.177-181
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• 2014

$Cu_2ZnSn(S_xSe_{1-x})_4$ (CZTSSe) absorber thin films were prepared on Mo coated soda lime glass substrates by sulfo-selenization of sputtered stacked Zn-Sn-Cu precursor thin films. The Zn-Sn-Cu precursor thin films were sulfo-selenized inside a graphite box containing S and Se powder using rapid thermal processing furnace at $540^{\circ}C$ in Ar atmosphere with pre-treatment at $300^{\circ}C$. The effect of different S/Se ratio on the structural, compositional, morphological and electrical properties of the CZTSSe thin films were studied using XRD (X-ray diffraction), XRF (X-ray fluorescence analysis), FE-SEM (field-emission scanning electron microscopy), respectively. The XRD, FE-SEM, XRF results indicated that the properties of sulfo-selenized CZTSSe thin films were strongly related to the S/Se composition ratio. In particular, the CZTS thin film solar cells with S/(S+Se)=0.25 shows best conversion efficiency of 4.6% ($V_{oc}$ : 348 mV, $J_{sc}$ : $26.71mA/cm^2$, FF : 50%, and active area : $0.31cm^2$). Further detailed analysis and discussion for effect of S/Se composition ratio on the properties CZTSSe thin films will be discussed.

• 보존과학연구
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• s.10
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• pp.1-40
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• 1989

Between 1976 and 1984 approximately 26.7 tons of Chinese coins were recovered from a shipwreck which was found at the seabed of the Shin an area in the south-western coast of the Korean peninsula. Elements, Cu, Pb, Sn, Fe, Sb, As, Zn, Ag, Ni, Co and Mn, of 54 pieces of the coins were determined by Inductively Coupled Plasma Atomic Emission Spectroscopy(ICP-AIS). The result shows that Ch, Pb, and Sn were found to be major elements roughly the coins with the ratio of 7 : 2 : 1, respectively. Trace elements were classified into 3 levels according to the avarage concentration : Fe,As and Sb(0.1-0.5%), Ag, Mi, Co and Zn(100-1000ppm) and Mn(10ppm). Some systematic tendencies are observed in the composition change with a function of their minting ages .The Wuzhu coins(오수전) from the Eastern Han dynasty(A.D.25-219 )are much more abundant in Cu than the coins of Tang dynasty(A.D.618-907) and later periods. Major element compositions of the Kai -tong Vuan-Bao(개통원보) coins from the Tang dynasty, were remarkably variable. In general, however, the Tang dynasty coins were much more abundant in Cu than the Song dynasty(A.S.S60-1279) coins. The amount of major elements Cu and Sn decreases while that of Pb in creasesby passage of age from the Bei Song dynasty(A.D.960-1127) to later Nam Song dynasty (A.D.1127-1279 ). It means that the quality of coins mere degraded. The amounts of trace elemends(Fe, As, Co, Hn) increases with the above age. High amounts of trace elements are supposed to be a reflection of immaturity of minting techniques or use of impurity-rich raw materials. The Jin dynasty(A.D.1125-1234) coins are found to be rich in Sn and thus contain Pb as the third component. It is quite different from the coins of the Song dynasty. The Zhi-dai Tong-Bao(지대통보) coins of the Yuan dynasty from A.0.1310 are much more abundant in Cu and Sn than those of the Nam Song dynasty .

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.7-12
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• 2013

The $Cu_2ZnSnS_4$ (CZTS) thin film solar cell is a candidate next generation thin film solar cell. For the application of an absorption layer in solar cells, CZTS thin films were deposited by pulsed laser deposition (PLD) at substrate temperature of $300^{\circ}C$ without post annealing process. Deposition time was carefully adjusted as the main experimental variable. Regardless of deposition time, single phase CZTS thin films are obtained with no existence of secondary phases. Irregularly-shaped grains are densely formed on the surface of CZTS thin films. With increasing deposition time, the grain size increases and the thickness of the CZTS thin films increases from 0.16 to $1{\mu}m$. The variation of the surface morphology and thickness of the CZTS thin films depends on the deposition time. The stoichiometry of all CZTS thin films shows a Cu-rich and S-poor state. Sn content gradually increases as deposition time increases. Secondary ion mass spectrometry was carried out to evaluate the elemental depth distribution in CZTS thin films. The optimal deposition time to grow CZTS thin films is 150 min. In this study, we show the effect of deposition time on the structural properties of CZTS thin film deposited on soda lime glass (SLG) substrate using PLD. We present a comprehensive evaluation of CZTS thin films.

• Journal of Conservation Science
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• v.31 no.3
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• pp.319-330
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• 2015

This study attempted to review the chemical composition of 25 samples of Sangpyeongtongbo having different manufacturing place and period, and then to find the manufacturing method. As a result of chemical composition analysis of Sangpyeongtongbo, main components include Cu, Zn and Pb, and some samples contained Sn and Fe. But, the chemical composition of each Sangpyeongtongbo varied with big differences. When the main content change was examined, Cu and Sn became decreased at the later period, and Zn and Pb had higher contents. The difference in the ingredient content had close relation for the profit of Sangpyeongtongbo. When refined microstructure was observed, 25 kinds of Sangpyeongtongbo had developed different types of microstructure such as dendrite, large grain and grain refinement. But, 25 kinds of Sangpyeongtongbo had no heat treatment processing. And, the types of microstructure were difference, which seems because different microstructure was developed due to the difference of Sn and Fe and cooling speed in Sangpyeongtongbo.

• Journal of Welding and Joining
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• v.32 no.1
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• pp.66-70
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• 2014

In Ti active brazing of YSZ to STS 430 using Ag-Cu Filler Metal, the effect of Ti contents on the shear bonding strength were investigated together with the effect of brazing temperature and holding time. The addition of Ti in Ag-Cu Filler Metal increased the bonding strength up to 4.68% Ti, followed by the decrease with further addition. This seems to be caused by formation of TixOy at the reaction layer. Brazing temperature was optimized at $960^{\circ}C$ among a given temperature ranges. The addion of Sn to Ag-Cu filler metal brought the decrease of its melting temperature its melting temperature without a significant decrease of bonging strength.

• Journal of Surface Science and Engineering
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• v.35 no.1
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• pp.47-52
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• 2002

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.

• Archives of Metallurgy and Materials
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• v.67 no.4
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• pp.1475-1479
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• 2022

This work mainly focuses on the sintering behavior of the Cu-Sn alloy with the addition of Ag up to 4 wt% after pulsed electric current sintering (PECS) process for ultra-fast sintering. The microstructural evolution was characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and density measurements. The mechanical properties were evaluated via measurements of transverse rupture strength (TRS) and Rockwell hardness. The mechanism during the sintering process has been discussed thoroughly, and the effect on porosity with the addition of the Ag is also correlated. The results showed that the growth of porosity progressed with the amount of Ag up to 2 wt%, and further addition of Ag leads reduction in porosity. The effect on mechanical properties were improved slowly as the amount of Ag increased.