• 한국분말재료학회지
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• 제11권3호
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• pp.210-216
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• 2004

The possibility to decrease agglomeration of Cu nano powders and their separation during pulsed wire evaporation (PWE) process was investigated by controlling the working gas system, i.e., the design of the gas path, the type and pressure of the atmospheric gas. As a result, it was possible to choose the optimal design of the gas path providing large specific surface area and high degree of separation of the synthesized Cu nano powders. It was also shown that an Ar+10∼50$N_2$ mixture can be used in production of Cu nano powders, which do not react with nitrogen.

• 마이크로전자및패키징학회지
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• 제31권2호
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• pp.1-8
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• 2024

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al₂O₃ passivation.

• 대한금속재료학회지
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• 제50권12호
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• pp.913-920
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• 2012

In spite of some problems in processability and bondability, Au wires in the microelectronics industry are gradually being replaced by copper wires to reduce the cost of raw material. In this article, the effects of surface roughness enhanced capillaries on thermosonic Cu wire bonding were evaluated. The roughness-enhanced zirconia toughened alumina (ZTA) capillaries were fabricated via a thermal grooving technique. As a result, the shear bond strength of first bonds (ball bonds) bonded using the roughness-enhanced capillary was enhanced by 15% as compared with that of normal bonds due to more effective plastic deformation and flow of a Cu ball. In the pull-out test of second bonds (stitch bonds), processed at two limit conditions on combinations of process parameters, the bond strength of bonds formed using the roughness-enhanced capillary also resulted in values higher by 55.5% than that of normal bonds because of the increase in the bonding area, indicating the expansion of a processing window for Cu wire bonding. These results suggest that the adoption of roughness-enhanced capillaries is a promising approach for enhancing processability and bondability in Cu wire bonding.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.735-738
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• 2000

The characteristics of wire electrical discharge machining (WEDM) are governed by many factors such as the power supply type, operating condition and electrode material. This work deals with the effect of wire electrode materials on the machining characteristics such as, metal removal rate, surface characteristics and surface roughness during WEDM A wire's thermal physical properties are melting point, electrical conductivity and vapor pressure. One of the desired qualities of wire is a low melting point and high vapor pressure to help expel the contaminants from the gap. They are determined by the mix of alloying elements (in the case of plain brass and coated wire) or the base core material(i.e. molybdenum). Experiments have been conducted regarding the choice of suitable wire electrode materials and influence of the properties of these materials on the machinability and surface characteristics in WEDM, the experimental results are presented and discussed from their metallurgical aspect. And the coating effect of various alloying elements(Au, Ag, Cu, Zn, Cr, Mn, etc.) to the Cu or 65-35 brass core on them was reviewed also. The removal rate of some coated wires are higher than that of 65-35 brass electrode wire because the wire is difficult to break due to the wire cooling effect of Zn evaporation latent heat and the Zn oxide on the surface is effective in preventing short circuit. The removal rate increases with increasing Zn content from 35, 40 and Zn coated wire

• 한국분말재료학회지
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• 제16권4호
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• pp.243-248
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• 2009

Carbon-coated Cu nanopowders with core/shell structure have been successfully fabricated by pulsed wire evaporation (PWE) method, in which a mixed gas of Ar/$CH_4$ (10 vol.%) was used as an ambient gas. The characterization of the samples was carried out using x-ray diffraction (XRD), scanning electron microscope (SEM), and high resolution transmission electron microscope (HRTEM). It was found that the nanoparticles show a spherical morphology with the size ranging of 10-40 nm and are covered with graphite layers of 2-4 nm. When oxygen-passivated Cu nanopowders were annealed under flowing argon gas (600 and 800$^{\circ}C$), the crystallinity of $Cu_2O$ phase and the particle size gradually increased. On the other hand, carbon-coated Cu nanopowders remained similar to as-prepared case with no additional oxide or carbide phases even after the annealing, indicating that the metal nanoparticles are well protected by the carbon-coating layers.

• 한국화재소방학회논문지
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• 제34권2호
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• pp.54-63
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• 2020

전선 접속부 등에서 아산화동(Cu₂O)증식 발열에 의해 화재가 발생하는 것은 화재조사 전문가들에게 널리 알려져 있지만 아산화동증식 발열에 의한 화재사례를 구체적으로 분석하여 소개하는 논문은 거의 없다. 이 논문에서는 전기적인 접속부분의 발열에 의한 화재 통계와 아산화동증식 발열 현상과 특징을 분석한 후 아산화동증식 발열에 의해 대학실험실의 전선 접속부분에서 화재가 발생한 사례에 대해 구체적으로 분석하고 있다. 이 화재사례는 발화개소의 화재패턴 조사, 전선 접속부분에 대한 육안 조사, 3차원 CT 촬영 조사, 전원인가 시험, 실체현미경 조사, SEM과 EDS 분석을 통해서 전선 접속부분에서 아산화동 증식 발열로 인해 화재가 발생한 것으로 결론을 내릴 수 있었다.

• 대한전기학회논문지
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• 제40권9호
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• pp.908-912
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• 1991

YBaCuO oxide superconductor-shows superconductive at Liquid Nitrogen temperature-must be preparate wire or thin film form for utility. The wiring is possible with heat treatment after appropriate mixture of polymeric binder and YBaCuO oxide superconductor has fabricated. This study, analyzed the characteristics of fabricated superconductor and extruded wire after application to each of a mixed at different rate in the superconductor and compared with an original pure sample. From the result, we knew that the binder component influences superconducting characteristics. The best condition for superconductivity occurred at a criticla temperature of 86.4K (8:2 rate) and at a critical current density of 100.27A/cmy with a binder packing ratio of about 20~25 percent.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1472-1474
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• 1997

In this study, the $Nb_3Sn$ wire was tried to fabricate by internal tin process to investigate the relationship between the processing parameters in a cold working and the microstructure. The critical current densities of $Nb_3Sn$ wires were evaluated in magnetic fields at 4.2 K. $Nb_3Sn$ compound layer was found to be formed between Nb core and Cu-Sn. The Cu part in the wire transformed to Cu-Sn by the reaction with Sn and the Sn in the Cu-Sn part reacted with Nb.

• E2M - 전기 전자와 첨단 소재
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• 제5권2호
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• pp.175-181
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• 1992

Y-Ba-Cu-O계 보다 화학적 내구성이 좋은 Bi-Sr-Ca-Cu-O계 초전도체 wire를 중합 binder와 초전도체 파우더를 혼합하여 sol-gel법으로 제조하였다. 여러가지 혼합비와 열처리 조건하에서 제조한 wire의 특성분석 결과 Bi$_{2}$Sr$_{2}$Ca$_{2}$Cu$_{3}$O계 초전도체와 binder의 최적 혼합율은 22.25%이었고 가열비는 0.33.deg.C/min로 500.deg.C까지는 Ar gas와 $O_{2}$ gas분위기로 열처리하고 500.deg.C에서 835.deg.C까지는 $O_{2}$ gas분위기에서 40h동안 열처리하였을때 임계온도 98K를 갖는 초전도 선재를 얻을 수 있었다.

• 전기학회논문지
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• 제59권7호
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• pp.1272-1275
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• 2010

The Cu powder was prepared in distilled water. It has a wide range of size distribution. The submicron-sized particles in the Cu powder were removed by using continuous type centrifugal separator. The average particle size after classification was approximately 50nm. The XRD analysis showed that pure Cu phase and oxide phase ($Cu_2O$)weremixedinthepowderpreparedbythismethod.