• Title/Summary/Keyword: Cu substrates

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Fabrication and Characterization of CuInSe2 Thin Films by Co-evaporation Method (Co-evaporation방법를 이용한 CuInSe2 박막 제조 및 특성분석)

  • Kwon, Se-Han;Kim, Seok-Ki;Yoon, Kyung-Hoon;Ahn, Byung-Tae;Song, Jin-Soo
    • Proceedings of the KIEE Conference
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    • 1996.07c
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    • pp.1437-1439
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    • 1996
  • In this paper, investigations on a three stage processing technique involving the co-evaporation of In-Se, Cu-Se and In-Se in this order at different deposition condition was undertaken. At first stage, we obtained good $In_{2}Se_{3}$ films by In-Se coevaporation. $In_{2}Se_{3}$ films show smooth and dense structure. And ration of In:Se was 2:3 $CulnSe_2$ thin films deposited by three stage process have shown strong adhesion on Mo coated glass substrates and good morphological properties suitable device fabrication. XWD spectra show single phase chalcopyrite $CulnSe_2$ films with strong orientation in the 112 plane. Resistivity of $CulnSe_2$ thin films was about $5{\times}10^{5}\;{\Omega}{\cdot}cm$. Surface morphology of CdS/$CulnSe_2$/Mo films was very good because of no pin holes.

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Effects of NaF evaporation rate on the properties of $CuInSe_2$ thin-film solar cells

  • Park, Sun-Yong;Lee, Eun-U;Lee, Sang-Hwan;Park, Sang-Uk;Jeong, U-Jin;Kim, U-Nam;Jeon, Chan-Uk
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.36.2-36.2
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    • 2010
  • A small amount of Na incorporated in $CuInSe_2$ (CIS) absorption layer has become widely accepted as a requirement for efficient polycrystalline CIS solar cells. However, there is ongoing argument on the role of sodium incorporated in the absorber. In this paper, CIS absorption layers have been deposited using the three-stage co-evaporation process on Mo coated non-Alkali glass substrates. The NaF was evaporated during the second-stage with various fluxes. This paper is focusing on differences of micro-structure and composition ratio of the absorber realized with different Na contents and the variation of electrical properties of the cells with the corresponding absorbers. The analytical results of x-ray diffraction (XRD) patterns, field emission scanning electron microscope (FE-SEM), energy dispersive spectroscopy (EDS) and current-voltage characteristics will be discussed to investigate the effect of NaF flux on the CIS absorber formation and its cell performance.

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Photovoltaic Properties of Cu(InGa)$Se_2$ Solar Cells with Sputter Conditions of Mo films (Mo 박막의 성장조건에 따른 Cu(InGa)$Se_2$ 박막 태양전지의 광변환효율)

  • Kim, S.K.;Lee, J.C.;Kang, K.H.;Yoon, K.H.;Park, I.J.;Song, J.;Han, S.O.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.05c
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    • pp.63-66
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    • 2002
  • Bi-layer Mo films were deposited on sodalime glass substrates using DC magnetron sputtering. As the gas pressure and power density, the resistivity varied from $1.5{\times}10^{-5}$ to $4.97{\times}10^{-4}{\Omega}{\cdot}cm$. Furthermore, stress direction yielded compressive-to-tensile transition stress curves. The microstructure of the compressive stress films which had poor adhesion consists of tightly packed columns, but of the tensile-stressed films had less dense structure. Under all gas pressure conditions, Mo films exhibited distinctly increasing optical reflection with decreasing gas pressure. The expansion of (110) peak width with the gas pressure meant the worse crystalline growth. Also, The highest efficiency was 15.2% on 0.2 $cm^2$. The fill factor, open circuit voltage and short circuit current were 63 %, 570 m V and 42.6 $mA/cm^2$ respectively.

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Growth and characterization of YBa2Cu3O7-$\delta$ thin films using pulsed laser (펄스레이저 증착에 의한 YBa2Cu3O7-$\delta$박막의 성장과 특성분석)

  • Chung, J.K.;Ko, R.K.;Choi, S.J.;Song, K.J.;Park, C.
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2003.02a
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    • pp.117-119
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    • 2003
  • YBa$_2$Cu$_3$O$_{7-{\delta}}$(YBCO) high temperature superconducting thin films were grown on SrTiO$_3$single crystal substrates by pulsed laser deposition(PLD). The texture and lattice parameter of the YBCO films were analysed using the GADDS (general area detector diffraction system) which enables XRD analyses to be done faster and with fewer sample movement than with the XRD system with point detector. The XRD results of the films grown in different deposition conditions are reported together with the SEM microstructure analysis results.ysis results.

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Study on the Fabrication Step-edges on $\textrm{SrTiO}_3$ Substrates and the Characterization of $\textrm{YBa}_{2}\textrm{Cu}_{3}\textrm{O}_{7-\delta}$ Step-edge Junctions ($\textrm{SrTiO}_3$ 기판 위에 계단형 모서리 제작 및 $\textrm{YBa}_{2}\textrm{Cu}_{3}\textrm{O}_{7-\delta}$계단형 모서리 접합의 특성 연구)

  • Nam, Byeong-Chang;Kim, In-Seon;Lee, Sun-Geol;Park, Jong-Cheol;Park, Yong-Gi
    • Korean Journal of Materials Research
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    • v.8 no.10
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    • pp.950-955
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    • 1998
  • Ar 이온 식각법을 이용하여 (001) SrTiO3(STO) 단결정 기판 위에 200nm 높이의 계단형 모서리를 제작하였다. 계단식은 입사하는 Ar 이온 빔에 대한 Ar 이온 입사각과 마스크 회전각을 조절함으로써 38$^{\circ}$-70$^{\circ}$의 넓은 범위로 제어할 수 있었다. 초전도 YBa2Cu3O7-$\delta$박막은 계단이 있는 STO 기판 위에 펄스레이저 증착법을 이용하여 증착하였으며, 박막의 두께는 계단 높이에 대한 박막의 두께비가 0.5-1.2가 되도록 하였다. 계단형 모서리 조셉슨 접합의 임계전류밀도와 IcRn값은 77K에서 각각 104A/$\textrm{cm}^2$, 70-200$\mu$V이었다.

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Preparation and Properties of $CuSb_2O_6$-doped $SnO_2$ Thin Films by Pulsed Laser Deposition (PLD법으로 제조된 $CuSb_2O_6-SnO_2$ 박막의 전기.광학적 특성)

  • Lee, Chae-Jong;Byun, Seung-Hyun;Lee, Hee-Young;Heo, Young-Woo;Lee, Joon-Hyung;Kim, Jeong-Joo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.262-263
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    • 2007
  • Effect of co-doping on optical and electrical properties of $SnO_2$ based thin films were studied. $SnO_2$ ceramic targets with up to 50mol% $CuSb_2O_6$ were prepared by sintering mixed-oxide compact in the temperature range of $1100^{\circ}C{\sim}1300^{\circ}C$ in air. Thin films were then deposited onto glass substrates by pulsed laser deposition where substrate temperature was maintained in the range of $500{\sim}650^{\circ}C$ with oxygen pressure of 3m~7.5mTorr and energy density of $1Jcm^{-2}$. It was found that with the increase amount of dopant, the electrical properties of thin films tended to improve with the smallest resistivity value obtained at about 8mol% doping, further increase, however, usually impaired the optical transmission in the visible range.

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Selective Atomic Layer Deposition of Co Thin Films Using Co(EtCp)2 Precursor (Co(EtCp)2프리커서를 사용한 Co 박막의 선택적 원자층 증착)

  • Sujeong Kim;Yong Tae Kim;Jaeyeong Heo
    • Korean Journal of Materials Research
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    • v.34 no.3
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    • pp.163-169
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    • 2024
  • As the limitations of Moore's Law become evident, there has been growing interest in advanced packaging technologies. Among various 3D packaging techniques, Cu-SiO2 hybrid bonding has gained attention in heterogeneous devices. However, certain issues, such as its high-temperature processing conditions and copper oxidation, can affect electrical properties and mechanical reliability. Therefore, we studied depositing only a heterometal on top of the Cu in Cu-SiO2 composite substrates to prevent copper surface oxidation and to lower bonding process temperature. The heterometal needs to be deposited as an ultra-thin layer of less than 10 nm, for copper diffusion. We established the process conditions for depositing a Co film using a Co(EtCp)2 precursor and utilizing plasma-enhanced atomic layer deposition (PEALD), which allows for precise atomic level thickness control. In addition, we attempted to use a growth inhibitor by growing a self-assembled monolayer (SAM) material, octadecyltrichlorosilane (ODTS), on a SiO2 substrate to selectively suppress the growth of Co film. We compared the growth behavior of the Co film under various PEALD process conditions and examined their selectivity based on the ODTS growth time.

Shear Strength of the ${Cu_6}{Sn_5}$-dispersed Sn-Pb Solder Bumps Fabricated by Screen Printing Process (${Cu_6}{Sn_5}$를 분산시켜 스크린 프린팅법으로 제조한 Sn-Pb 솔더범프의 전단강도)

  • Choe, Jin-Won;Lee, Gwang-Eung;Cha, Ho-Seop;O, Tae-Seong
    • Korean Journal of Materials Research
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    • v.10 no.12
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    • pp.799-806
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    • 2000
  • Cu$_{6}$Sn$_{5}$-dispersed 63Sn-37Pb solder bumps of 760$\mu\textrm{m}$ size were fabricated on Au(0.5$\mu\textrm{m}$)/Ni(5$\mu\textrm{m}$)/Cu(27$\pm$20$\mu\textrm{m}$) BGA substrates by screen printing process, and their shear strength were characterized with variations of dwell time at reflow peak temperature and aging time at 15$0^{\circ}C$ . With dwell time of 30 seconds at reflow peak temperature, the solder bumps with Cu$_{6}$Sn$_{5}$ dispersion exhibited higher shear strength than the value of the 63Sn-37Pb solder bump. With increasing the dwell time longer than 60 seconds, however the shear strength of the Cu$_{6}$Sn$_{5}$-dispersed solder bumps became lower than that the 63Sn-37Pb solder bumps. The failure surface of the solder bumps could be divided into two legions of slow crack propagation and critical crack propagation. The shear strength of the solder bumps was inversely proportional to the slow crack propagation length, regardless of the dwell time at peak temperature, aging time at 150 $^{\circ}C$ and the volume fraction of Cu$_{6}$Sn$_{5}$ dispersion.> 5/ dispersion.

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STRATEGIC RESEARCH AT ORNL EOR THE DEVELOPMENT OF ADVANCED COATED CONDUCTORS: PART - II

  • Paranthama, M. Parans;Aytug, T.;Sathyamurthy, S.;Zhai, H.Y.;Christen, H.M.;Martin, P.M.;Goyal, A.;Christen, D.K.;Kroeger, D.M.
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2002.02a
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    • pp.340-340
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    • 2002
  • In an effort to develop alternative single buffer layer technology for YBa$_2$Cu$_3$O$_{7-{\delta}}$ (YBCO) coated conductors, we have investigated both LaMnO$_3$, (LMO) and La$_2$Zr$_2$O$_{7}$ (LZO) as potential buffer layers. High-quality LMO films were grown directly on textured Ni and Ni-W (3%) substrates using rf magnetron sputtering. Highly textured LZO buffers were grown on textured Ni substrates using sol-gel alkoxide processing route. YBCO films were then grown on both LMO and LZO buffers using pulsed laser deposition. Detailed X-ray studies have shown that YBCO films were grown on both LMO and LZO layers with a single epitaxial orientation. A high J$_{c}$ of over 1 MA/cm$^2$ at 77 K and self-field was obtained on YBCO films grown on both LMO-buffered Ni or Ni-W substrates, and also on LZO-buffered Ni substrates. We have identified LaMnO$_3$ as a good diffusion barrier layer for Ni and it also provides a good template for growing high current density YBCO films. Similarly we have also demonstrated the growth of high J$_{c}$ YBCO films on all solution buffers. We will discuss in detail about our buffer deposition processes. processes.s.s.s.s.

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Trace impurity analysis of Cu films using GDMS: concentration change of impurities by applying negative substrate bias voltage (글로우방전 질량분석법을 이용한 구리 박막내의 미량불순물 분석: 음의 기판 바이어스에 의한 불순물원소의 농도변화)

  • Lim Jae-Won;Isshiki Minoru
    • Journal of the Korean Vacuum Society
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    • v.14 no.1
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    • pp.17-23
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    • 2005
  • Glow discharge mass spectrometry(GDMS) was used to determine the impurity concentrations of the deposited Cu films and the 6N Cu target. Cu films were deposited on Si (100) substrates at zero substrate bias voltage and a substrate bias voltage of -50 V using a non-mass separated ion beam deposition method. Since do GDMS has a little difficulty to apply to thin films because of the accompanying non-conducting substrate, we have used an aluminum foil to cover the edge of the Cu film in order to make an electrical contact of the Cu film deposited on the non-conducting substrate. As a result, the Cu film deposited at the substrate bias voltage of -50 V showed lower impurity contents than the Cu film deposited without the substrate bias voltage although both the Cu films were contaminated during the deposition. It was found that the concentration change of each impurity in the Cu films by applying the negative substrate bias voltage is related to the difference in their ionization potentials. The purification effect by applying the negative substrate bias voltage might result from the following reasons: 1) Penning ionization and an ionization mechanism proposed in the present study, 2) difference in the kinetic energy of accelerated Cu+ ions toward the substrate with/without the negative substrate bias voltage.