• 대한금속재료학회지
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• 제50권6호
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• pp.419-425
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• 2012

The purpose of this research was to develop a low Ni austenitic cast iron through replacing Ni by Cu and Mn because they are cheaper than Ni. The effect of the Cu content (6-12 wt%) on the microstructure characteristics was investigated in Fe-3%C-16%(Ni+Cu+Mn) cast iron. Contrary to general effect of the Cu on cast iron, the result of the microstructure analysis indicated that bainite and cementite were formed in high Cu content (>8 wt%Cu). A crystallized Cu-solution (Cu-Mn) phase and MnS in the Cu-solution were formed. The quantity of those phases increased as the Cu content increased. Consequently, the high Cu content in the composition ratio (Ni+Cu+Mn=16%) caused the formation of Cu-Mn/MnS and those phases decreased the effect of Cu and Mn on austenite formation. For this reason, bainite and cementite were formed in high Cu content.

• 한국자기학회지
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• 제5권5호
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• pp.456-460
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• 1995

Giant magnetoresistance(GMR) of $Cu_{85-x}Co_{15}Ni_{x}$ melt-spu ribbons is closely correlated with the microstructure produced by the spinodal decomposition. The solid solution range is extanded by the replacement of Cu by Ni in the as-quenched state. The wavelengths obtained by subsequent isothermal aging in Cu-Co-Ni ribbons are shorter than those in Cu-Co binary ribbons, resulting in the increase of the surface-to-volume ratio. The largest MR ratio of 8 % in high field has been achieved in the $Cu_{80}Co_{15}Ni_{5}$ aged ribbon. The field dependence of MR ratio in low fields becomes larger with the Ni content.

• 열처리공학회지
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• 제2권2호
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• pp.38-45
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• 1989

The Cu-Fe permanent magnet were prepared in situ process, which has economic and mass productive merits in producing multi filamentary composites. The purpose of this research was to study the effect of reduction ratio and heat treatment on magnetic property. As the reduction ratio of Cu-Fe wire increased, the filament structure became finer and interfilament distances decreased and the morphology of filament cross section became ribbon shape. As Fe content increased significantly. The coercivity and squareness of Cu-55 wt%Fe composite increased as a reduction ratio became higher, whereas they increased to maximum values at 0.09 mm ${\phi}$ for Cu-30 wt%Fe, and 0.066 mm ${\phi}$ for CU-45 wt%Fe respectively, and decreased for further reduction. The magnetic properties of Cu-Fe composites can be more enhanced by intermediate heat treatment. The best magnetic properties were obtained from Cu-55 wt%Fe composite deformed to 0.054 mm ${\phi}$ and annealed.

• 한국재료학회지
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• 제9권6호
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• pp.569-576
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• 1999

In this study, the effect of the microstructural evolution on the electrical of Cu-Ag microcomposite was investigated. The nature of interfaces between silver filaments and Cu matrix may have pronounced effects on the physical properties of Cu-Ag filamentary microcomposites, little is known about these interfaces. In heavily drawn Cu-Ag filamentary microcomposities, the microstructure is too fine and the interfacial area is too large to maintsin a stable internal dislocation structure because of closely spaced filaments. Rather, most dislocations are thought to be gradually absorbed at the interfaces as the draw ratio increases. The mechanical and electrical properties of Cu-Ag filamentary microcomposites wires were also examined and correlated with the microstructural change caused by thermomechanical treatments. The study on the electrical conductivity combined to resistivity in Cu-Ag filamentary microcomposites and the rapid increase of the electrical conductivity at high annealing temperatures is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities at 295K($\rho$\ulcorner/$\rho$\ulcorner) in as-drawn Cu-Ag microcomposites can also be explained by the contribution of the interface scattering.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 춘계학술대회
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• pp.170-173
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• 2006

[ $CuInS_2$ ] filims were appeared from 0.84 to 1.27 of Cu/In composition ratio and sulfur composition ratios of $CuInS_2$ thin films fabricated, Also when Cu/In composition ratio was 1.03, $CuInS_2$ thin film with chalcopyrite structure had the highest XRD peak (112). And lattice constant (a) of and grain size of the film tin s ambient were appeared a little larger than those in only Vacuum The films in S ambient were p-type with resistive of around $10^{-1}{\Omega}cm$ and optical energy band gaps of the films in S ambient were appeared a little larger than those in only Vacuum. Analysis of the optical energy band gap of $CuInS_2$ thin films a value of 1.53eV.

• 한국자기학회지
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• 제13권1호
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• pp.15-20
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• 2003

Cu 금속 미분말은 확산속도가 CuO 보다 CuO 보다 빠르고 소결시 입자성장을 촉진시키기 때문에 기본조성 (N $i_{0.204}$C $u_{0.204}$Z $n_{0.612}$ $O_{1.02}$)F $e_{1.98}$ $O_{2.98}$에 들어가는 CuO대신 Cu/CuO의 비를 변화시켜 가면서 Cu가 ferrite에 미치는 영향을 조사하였다. Cu를 CuO 대신 치환함으로써 90$0^{\circ}C$에서 완전한 Spinel구조를 가짐을 XRD pattern을 통하여 확인하였고, Cu/CuO 비가 60%일 때가 투자율 1100, Ms 87 emu/g의 최적조건을 얻었다. Cu는 소결시 확산속도를 증가시켜 입자성장에 영향을 주었으며, CuO대신 Cu의 치환은 저온에서 투자율이 개선됨을 확인하고 소결온도를 3$0^{\circ}C$이상 낮출 수 있었다. 소결이 끝난 후에는 CuO와 같은 거동을 하는 것으로 확인되었다.

• 한국표면공학회지
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• 제41권3호
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• pp.109-113
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• 2008

High strength 7xxx series Al-Zn-Mg alloy have been investigated for using light weight automotive parts especially for bump back beam. The composition of commercial 7xxx aluminum has the Zn/Mg ratio about 3 and Cu over 2 wt%, but this composition isn't adequate for appling to automotive bump back beam due to its high resistance to extrusion and bad weldability. In this study the Zn/Mg ratio was increased for better extrusion and Cu content was reduced for better welding. With this new composition we investigated the effect of composition on the resistivity against stress corrosion cracking. As the Zn/Mg ratio is increased fracture energy obtained by slow strain rate test was decreased, which means degradation of SCC resistance. While the fracture energy was increased with Cu contents although it is below 1%, which means improvement of SCC resistance. These effects of composition change on the SCC resistivity were identified by observing the fracture surface and crack propagation.

• 열처리공학회지
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• 제4권2호
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• pp.9-18
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• 1991

Among the many maunfactured processes of producing multi filamentary composites, in situ process is widely used owing tv its simplicity and easyness of mass production. In this study, the mechanical and electromagnetic properties of Cu-Fe composite materials was investigated. The tensile strength of the Cu-Fe wires increased as the Fe content and reduction ratio were increased. The Cu-30 wt%Fe composites had the best properties in terms of figure merits compared to the other Cu-Fe composites made in this study or the commercially manufactured 6/1 ACSR cables of Cu cable. The coercivity was decreased by increasing Fe content, but the squareness was increased greatly. As increasing reduction ratio, the coercivity and squareness increased up to the maximum points, and then decreased. For example, the maximum values were obtained at $0.09mm{\phi}$ for Cu-30 wt%Fe composites and at $0.066mm{\phi}$ for Cu-45 wt%Fe composites. The magnetic property of Cu-Fe wires produced by precipitation treatment was higher than that of Cu-Fe wires produced by thermomechanical treatment. By annealing Cu-Fe wires after drawing process, the coercivity, remanence and squareness were improved.

• 한국자기학회지
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• 제16권3호
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• pp.173-177
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• 2006

수직자기이방성을 갖는 [Pd/Co] 다층박막으로 구성된 스핀밸브 구조에서 비자성층(space layer, SL) Pd 또는 Cu의 두께와 다층박막의 반복층수 N에 따른 자기저항효과의 의존성을 연구하였다. 비자성층을 Pd보다 Cu로 사용하였을 때 더 큰 자기저항비를 얻었다. 그리고 Cu층과 고정층 사이에 Co층을 삽입하는 경우 약 3배가량 자기저항비가 증가하는 것을 관찰하였다. $Ta_{(2.1nm)}/[Pd_{(0.61)}/Co_{(0.23)}]_4/Cu_{(2.37)}/Co_{(t)}/[Pd_{(0.61)}/Co_{(0.23)}]_2/FeMn_{(10.6)}/Ta_{(2.1)}$ 구조에서 삽입된 Co층의 두께가 0.62nm 또는 1.01nm에서 최대의 자기저항비 7.4%를 얻었다.

• 한국분말재료학회지
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• 제17권4호
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• pp.270-275
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• 2010

Ethylene glycol-based Cu nanofluids were prepared by pulsed wire evaporation (PWE) method. The structural properties of Cu nanoparticles were studied by X-ray diffraction (XRD) and high resolution transmission electron microscopy (HRTEM). The average diameter and Brunauer Emmett Teller (BET) surface area of Cu nanoparticles were about 100 nm and $7.46\;m^2/g$, respectively. The thermal conductivity and viscosity of copper nanofluid were measured as functions of Cu concentration and temperature. As the volume fraction of Cu nanoparticles increased, both the enhanced ratios of thermal conductivity and viscosity of Cu nanofluids increased. As the temperature increased, the enhanced ratio of thermal conductivity increased, but that ratio of viscosity decreased.