• Journal of Powder Materials
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• v.4 no.4
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• pp.283-290
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• 1997

$Ti_5Si_3$ intermetallics containing 0-6 wt% of Cu were made by reactive sintering (RS) under vacuum using elemental powder mixtures (Process 1), electro-pressure sintering (EPS) using RS'ed materials (Process2), and EPS using elemental powder mixtures (Process 3). Relatively low dense titanium silicides were gained by process 1, in which porosity decreased with increasing Cu content. For example, porosity changed from 42 to 19.4% with the increase in Cu content from 0 to 6 wt%, indicating that Cu is a useful sintering aid. The titanium silicides fabricated by Process 2 had a higher density than those by Process 1 at given composition, and porosity decreased with increasing Cu content. For example, porosity decreased from 38 to 6.8% with the change in Cu content from 0 to 6 wt%. A high dense titanium silicides were obtained by Process 3. In this Process, porosity decreased a little by Cu addition, and was almost insensitive to Cu content. Namely, about 9 or 7% of porosity was shown in 0 or 1-6 wt% Cu containing silicides, respectively. The hardeness increased by Cu addition, and was not changed markedly with Cu content for the silicides fabricated by Process 3. This tendency was considered to be resulted from porosity, hardening of grain interior by Cu addition, and softening of grain boundary by Cu-base segregates. All these results suggested that EPS using elemental powder mixtures (Process 3) is an effective processing method to achieve satisfactorily dense titanium silicides.

• Journal of Powder Materials
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• v.7 no.4
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• pp.218-227
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• 2000

It is well known that the Cu-Cr alloys are very difficult to be made by conventional sintering methods. This difficulty originates both from limited solubility of Cr in the Cu matrix and from limited sintering temperature due to high vapor pressures of Cr and Cu components at the high temperature. Densification of Cu-50%Cr Powder compacts by conventional Powder metallurgy Process has been studied. Three kinds of sintering methods were tested in order to obtain high-density sintered compacts. Completely densified Cu-Cr compacts could be obtained neither by solid state sintering method nor by liquid phase sintering method. Both low degree of shrinkage and evolution of large pores in the Cu matrix during the solid state sintering are attributed to the anchoring effect of large Cr particles, which inhibits homogeneous densification of Cu matrix and induces pore generation in the Cu matrix. In addition, the effect of undiffusible gas coming from the reduction of Cu-oxide and Cr-oxide was observed during liquid phase sintering. A two-step sintering method, solid state sintering followed by liquid phase sintering, was proved to have beneficial effect on the fabrication of high-dendsity Cu-Cr sintered compacts. The sintered compacts have properties similar to those of commercial products.

• Journal of Powder Materials
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• v.22 no.2
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• pp.87-92
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• 2015

Metallic porous materials have many interesting combinations of physical and geometrical properties with very low specific weight or high gas permeability. In this study, highly porous Cu foam is successfully fabricated by a slurry coating process. The Cu foam is fabricated specifically by changing the coating amount and the type of polyurethane foam used as a template. The processing parameters and pore characteristics are observed to identify the key parameters of the slurry coating process and the optimized morphological properties of the Cu foam. The pore characteristics of Cu foam are investigated by scanning electron micrographs and micro-CT analyzer, and air permeability of the Cu foam is measured by capillary flow porometer. We confirmed that the characteristics of Cu foam can be easily controlled in the slurry coating process by changing the microstructure, porosity, pore size, strut thickness, and the cell size. It can be considered that the fabricated Cu foams show tremendous promise for industrial application.

• Journal of Powder Materials
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• v.7 no.2
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• pp.93-101
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• 2000

In order to clarify the enhanced sintering behavior of nanostructured(NS) W-Cu powder prepared by mechaincal alloying, the sintering behavior during heating stage was analysed by a dilatometry with various heating rates. The sintering of NS W-Cu powders was characterized by the densification of two stages, having two peaks in shrinkage rate curves. The temperature at which the first peak appear was much lower than Cu melting point, and dependent on heating rate. On the basis of the shrinkage rate curves and the microstructural observation, the coupling effect of nanocrystalline W-grain growth and the liquid-like behavior of Cu phase was suggested as a possible mechanism for the enhanced sintering of NS W-Cu powder in the state.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.121-124
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• 1998

Generally the structure of powder electroluminescent devices (PELDs) on ITO-film was makeup of the ZnS:Cu phosphor layer and BaTiO$_3$ insulating layer. The active layer, which consists of a suitably doped ZnS powder mixed in a dielectric, is sandwiched between two electrodes; one of which are ITO film and the other is aluminum. In this paper, three kinds of powder eleotroluminescent devices (PELDs) : WK-A(ITO/BaTiO$_3$/ZnS:Cu/Silver paste). WK-B(ITO/BaTiO$_3$+ZnS:Cu/Silver paste) and WK-C(ITO/BaTiO$_3$/ZnS:Cu/BaTiO$_3$/Silver paste), fabricated by spin coating method, were investigated. To evaluate the luminescence properties of three kinds of PELDs, EL emission spectroscopy, transferred charge density and time response of EL emission intensity under square wave voltage driving were measured.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.11a
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• pp.34-35
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• 2002

• Journal of Powder Materials
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• v.10 no.6
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• pp.422-429
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• 2003

The reduction mechanism of the composite powders mixed with $WO_3$ and CuO has been studied by using thermogravimetry (TG), X-ray diffraction, and microstructure analyses. The composite powders were made by simple Turbula mixing, spray drying, and ball-milling in a stainless steel jar with the ball to powder ratio of 32 to 1 at 80 rpm for 1 h without process controlling agents. It is observed that all the oxide composite powders are converted to W-coated Cu composite powder after reducing treatment under hydrogen atmosphere. For the formation mechanism of W-coated Cu composite powder, the sequential reduction steps are proposed as follows: CuO contained in the ball-milled composite powder is initially reduced to Cu at the temperature range from 20$0^{\circ}C$ to 30$0^{\circ}C$. Then, $WO_3$ powder is reduced to W $O_2$ via W $O_{2.9}$ and W $O_{2.72}$ at higher temperature region. Finally, the gaseous phase of $WO_3(OH)_2$ formed by reaction of $WO_2$ with water vapour migrates to previously reduced Cu and deposits on it as W reduced by hydrogen. The proposed mechanism has been proved through the model experiment which was performed by using Cu plate and $WO_3$ powder.

• Journal of Powder Materials
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• v.20 no.2
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• pp.114-119
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• 2013

In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of $2CuO{\rightarrow}Cu_2O$ + 1/2 $O_2$ by placing powder bed of CuO or $Cu_2O$ around the Cu/AlN bonding pair at $1065{\sim}1085^{\circ}C$. The adhesion strength was relatively better in case of using CuO powder than when $Cu_2O$ powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of $Cu_2O$, Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and $Cu_2O$.

• Journal of Powder Materials
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• v.4 no.2
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• pp.122-132
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• 1997

Nanostructured(NS) W-Cu composite powders of about 20~30 nm grain size were synthesized by mechanical alloying. The properties of NS W-Cu powder and its sintering behavior were investigated. It was shown from X-ray diffraction and TEM analysis that the supersaturated solid solution of Cu in W was not formed by the mechanical alloying of mixed elemental powders, but the mixture of W and Cu particles with nanosize grains, i.e., the nanocomposite powder was attained. Nanocomposite W-20wt%Cu and W-30wt%Cu powders milled for 100 h were sintered to the relative density more than 96% and 98%, respectively, by sintering at 110$0^{\circ}C$ for 1 h in $H_2$. Such a high sinterability was attributed to the high homogeneous mixing and ultra-fine structure of W and Cu phases as well as activated sintering effect by impurity metal introduced during milling.

• Journal of Powder Materials
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• v.12 no.3
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• pp.192-200
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• 2005

Ultrafine copper powder was prepared from $CuO-H_2O$ slurry with hydrazine, a reductant, under $70^{\circ}C$. The influence of various reaction parameters such as temperature, reaction time, molar ratio of $N_2H_4$, PvP and NaOH to Cu in aqueous solution had been studied on the morphology and powder phase of Cu powders obtained. The production ratio of Cu from CuO was increased with the ratio of $N_2H_4/Cu$ and the temperature. When the ratio of $N_2H_4/Cu$ was higher than 2.5 and the temperature was higher than $60^{\circ}C$, CuO was completely reduced into Cu within 40 min. The crystalline size of Cu obtained became fine as the temperature increase, whereas the aggregation degree of particles was increased with the reaction time. The morphology of Cu powder depended on that of the precursor of CuO and processing conditions. The average particle size was about $0.5{\mu}m$.