• Journal of Magnetics
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• v.11 no.4
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• pp.156-159
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• 2006

We have studied the magnetic properties of the CuNi nanoparticles for three different sizes prepared by plasma and chemical techniques. The magnetization is enormously enhanced with decreasing the nanoparticle size. This enhanced magnetic moment shows almost inversely linear temperature dependence, which could be interpreted by the Langevin-type superparamagnetism. The field dependence exhibits ferromagnetic-like behavior with weak hysteresis, which could described in terms of uncompensated spin and/or surface anisotropy. In addition, the magnetic data suggest that the CuNi nanoparticles produced by the plasma method result in significantly less oxidized metallic nanoparticles than those prepared by other techniques.

• Bulletin of the Korean Chemical Society
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• v.35 no.8
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• pp.2519-2522
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• 2014

Recently, the observation of the electrocatalytic behavior of individual nanoparticles (NPs) by electrochemical amplification method has been reported. For example, the Iridium oxide ($IrO_x$) NP collision on the Pt UME was observed via electrocatalytic water oxidation. However, the bare Pt UME had poor reproducibility for the observation of NP collision signal and required an inconvenient surface pre-treatment for the usage. In this manuscript, we has been investigated other metal electrode such as Cu UME for the reproducible data analysis and convenient use. The $IrO_x$ NP collision was successively observed on the bare Cu UME and the reproducibility in collision frequency was improved comparing with previous case using the $NaBH_4$ pre-treated Pt UME. Also, the adhesion coefficient between NP and the Cu UME was studied for better understanding of the single NP collision system.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.95-103
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• 2021

Sn-58Bi-xRu composite solders were prepared by adding Ru nanoparticles to Sn-58Bi, a typical low-temperature solder, and the interfacial reaction and solder joint reliability were analyzed by reacting with Cu/OSP and ENIG surface treated PCB boards. The Cu₆Sn₅ IMC formed by the reaction with Cu/OSP had little change in thickness depending on the Ru content, and ductile fracture occurred inside the solder during the high-speed shear test without any significant change even after 100 hr aging. In reaction with ENIG, the Ni₃Sn₄ IMC thickness tended to decrease as the Ru content increased, and ENIG-specific brittle fracture was found in some specimens. Since Ru element is not found near the interface, it is judged not to be significantly involved in the interfacial reaction, and it is analyzed that it mainly exists together with the Bi phase.

• Bulletin of the Korean Chemical Society
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• v.27 no.11
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• pp.1869-1872
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• 2006

• 한국신재생에너지학회:학술대회논문집
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• 2006.06a
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• pp.222-224
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• 2006

A non-vacuum process for $Cu(In,Ga)Se_2$ (CIGS) thin film solar cells from nanoparticle precursors was described in this work CIGS nanoparticle precursors was prepared by a low temperature colloidal route by reacting the starting materials $(CuI,\;InI_3,\;GaI_3\;and\;Na_2Se)$ in organic solvents, by which fine CIGS nanoparticles of about 20nm in diameter were obtained. The nanoparticle precursors were mixed with organic binder material for the rheology of the mixture to be adjusted for the doctor blade method. After depositing the mixture of CIGS with binder on Mo/glass substrate, the samples were preheated on the hot plate in air to evaporate remaining solvents ud to burn the organic binder material. Subsequently, the resultant (porous) CIGS/Mo/glass simple was selenized in a two-zone Rapid Thermal Process (RTP) furnace in order to get a solar ceil applicable dense CIGS absorber layer. Complete solar cell structure was obtained by depositing. The other layers including CdS buffer layer, ZnO window layer and Al electrodes by conventional methods. The resultant solar cell showed a conversion efficiency of 0.5%.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.57-62
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• 2014

With synthesis temperature and adding amount of oleylamine, nanometer-sized Cu particles were fabricated by heptyl alcohol-based chemical synthesis. The synthetic temperature and amount of oleylamine changed excessively the shape and phase of synthesized nanoparticles. Only cubic-shaped $Cu_2O$ phase was formed at $160^{\circ}C$ regardless of the amount of oleylamine because of imperfect reduction reaction, representing results that the average size of $Cu_2O$ particles decreased with increasing the amount of oleylamine. In the case the synthesis at $170^{\circ}C$, however, nanoparticles of irregular sphere or peanut shapes were synthesized. Moreover, the average size of nanoparticles decreased continuously and gradually with an increase of the amount of oleylamine. According to the size decrease, the synthesized $Cu_2O$ nanoparticles were also transformed into pure Cu nanoparticles.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.32.1-32
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• 2003

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.64-64
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• 2004

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.216.1-216
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• 2003