• Journal of Powder Materials
• /
• v.18 no.4
• /
• pp.322-326
• /
• 2011

Inkjet printing was successfully done using Cu nano powder ink after these Cu nano powders were dry-coated with 1-octanethiol for oxidation prevention. 1-octanethiol, which is Self-Assembled Multi-layers (SAMs), was coated approximately 10-nm thick on the surface of Cu nano powders. 1-Octanol, which has the same chain length as that for 1-octanethiol, was used as a solvent to make the ink for inkjet printing. As a result, the fabricated ink was dispersed for about 4 weeks, and after printing and heat treatment at $350^{\circ}C$ for 4 hours, the resistivity for the printed pattern was measured to be $1.15{\times}10^{-5}{\Omega}{\cdot}cm$.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.30 no.5
• /
• pp.174-182
• /
• 2020

The printed electronics field using ink-jet printing technology is in the spotlight as a next-generation technology, especially ink-jet 3D printing, which can simultaneously discharge and precisely control various ink materials, has been actively researched in recent years. In this study, complex structure of an insulating layer and a conductive layer was fabricated with photo-curable silica ink and PVP-added Cu nano ink using ink-jet 3D printing technology. A precise photocured silica insulating layer was designed by optimizing the printing conditions and the rheological properties of the ink, and the resistance of the insulating layer was 2.43 × 10¹³ Ω·cm. On the photo-cured silica insulating layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the PVP-added nano Cu ink was performed using an IPL flash sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Finally, it was confirmed that the resistance of the PVP-added Cu conductive layer was very low as 29 μΩ·cm under 100℃ annealing temperature and 700 V of IPL applied voltage, and the adhesion to the photo-cured silica insulating layer was very good.

• Journal of the Korean Ceramic Society
• /
• v.49 no.5
• /
• pp.417-422
• /
• 2012

Copper nano particles have been considered as the materials for conductive ink due to its good thermal, electrical conductivity and low cost. However, copper nanoparticles oxidize easily, decreasing dispersion stability and electrical conductivity. Therefore, it is important to develop a method to minimize oxidation of copper nano particles to improve its dispersion stability property in copper nano ink. In this study, copper nano particles were coated with 1-Octanethiol VSAM(Vaporized Self Assembled Multilayers) to prevent oxidation and coated copper powders were dispersed in conductive ink successfully by studying its relationship of different chain length of solvents to 1-Octanethiol coating layer to fabricate nano ink. Various alcohol solvents, such as 1-Hexanol, 1-Octanol, and 1-Decanol were used. The coating layer was observed using FESEM and TEM. Furthermore, dispersion of copper nano particles in nano inks, was characterized using Turbiscan analyzer, viscometer, and contact angle measurement tool.

• Journal of the Korean Ceramic Society
• /
• v.56 no.4
• /
• pp.354-359
• /
• 2019

Information security films that can ensure personal privacy by reducing the viewing angle of display screens were fabricated by microlouver patterning and a ZnO nano-ink filling process. Optical simulation results demonstrated that all the microlouver films showed good security performances. Security performances were evaluated as calculated relative luminance ratios compared between the side and front. Based on the simulation results, microlouver films were fabricated by UV imprint lithography and nano-ink bar coating. However, distortion of the microlouver pattern occurred with the use of high-viscosity nano-inks such as ZrO₂ and TiO₂, and the CuO-filled microlouver film suffered from very low optical transmittance. Accordingly, the effects of ZnO filling height on security performance were intensively investigated through simulation and experimental measurements. The fabricated microlouver film with a 75-㎛-high ZnO filling exhibited a good relative luminance ratio of 0.75 at a 60° side angle and a transmittance of 44% at a wavelength of 550 nm.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1806-1809
• /
• 2008

Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.1370-1373
• /
• 2006

The Cu-Ag nanoparticles have been synthesized in aqueous medium using a hydrazine reduction method. The assisted role of polymeric dispersant on synthesis of highly concentrated Cu-Ag nanoparticles was studied. The 30wt% of Cu-Ag nanoparticles with the range of 10 nm in diameter was prepared.

• Korean Journal of Materials Research
• /
• v.25 no.12
• /
• pp.719-726
• /
• 2015

For a decade, solution-processed functional materials and various printing technologies have attracted increasingly the significant interest in realizing low-cost flexible electronics. In this study, Cu nanoparticles are synthesized via the chemical reduction of Cu ions under inert atmosphere. To prevent interparticle agglomeration and surface oxidation, oleic acid is incorporated as a surface capping molecule and hydrazine is used as a reducing agent. To endow water-compatibility, the surface of synthesized Cu nanoparticles is modified by a mixture of carboxyl-terminated anionic polyelectrolyte and polyoxylethylene oleylamine ether. For reducing the surface tension and the evaporation rate of aqueous Cu nanoparticle inks, the solvent composition of Cu nanoparticle ink is designed as DI water:2-methoxy ethanol:glycerol:ethylene glycol = 50:20:5:25 wt%. The effects of poly(styrene-co-maleic acid) as an adhesion promoter(AP) on rheology of aqueous Cu nanoparticle inks and adhesion of Cu pattern printed on polyimid films are investigated. The 40 wt% aqueous Cu nanoparticle inks with 0.5 wt% of Poly(styrene-co-maleic acid) show the "Newtonian flow" and has a low viscosity under $10mPa{\cdots}S$, which is applicable to inkjet printing. The Cu patterns with a linewidth of $50{\sim}60{\mu}m$ are successfully fabricated. With the addition of Poly(styrene-co-maleic acid), the adhesion of printed Cu patterns on polyimid films is superior to those of patterns prepared from Poly(styrene-co-maleic acid)-free inks. The resistivities of Cu films are measured to be $10{\sim}15{\mu}{\Omega}{\cdot}cm$ at annealing temperature of $300^{\circ}C$.

• Korean Journal of Materials Research
• /
• v.26 no.4
• /
• pp.216-221
• /
• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• Journal of Welding and Joining
• /
• v.29 no.5
• /
• pp.90-94
• /
• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.222-222
• /
• 2012

Metal oxide gas sensors based on semiconductor type have attracted a great deal of attention due to their low cost, flexible production and simple usability. However, most works have been focused on n-type oxides, while the characteristics of p-type oxide gas sensors have been barely studied. An investigation on p-type oxides is very important in that the use of them makes possible the novel sensors such as p-n diode and tandem devices. Monoclinic cupric oxide (CuO) is p-type semiconductor with narrow band gap (~1.2 eV). This is composed of abundant, nontoxic elements on earth, and thus low-cost, environment-friendly devices can be realized. However, gas sensing properties of neat CuO were rarely explored and the mechanism still remains unclear. In this work, the neat CuO layers with highly ordered mesoporous structures were prepared by a template-free, one-pot solution-based method using novel ink solutions, formulated with copper formate tetrahydrate, hexylamine and ethyl cellulose. The shear viscosity of the formulated solutions was 5.79 Pa s at a shear rate of 1 s-1. The solutions were coated on SiO2/Si substrates by spin-coating (ink) and calcined for 1 h at the temperature of $200{\sim}600^{\circ}C$ in air. The surface and cross-sectional morphologies of the formed CuO layers were observed by a focused ion beam scanning electron microscopy (FIB-SEM) and porosity was determined by image analysis using simple computer-programming. XRD analysis showed phase evolutions of the layers, depending on the calcination temperature, and thermal decompositions of the neat precursor and the formulated ink were investigated by TGA and DSC. As a result, the formation of the porous structures was attributed to the vaporization of ethyl cellulose contained in the solutions. Mesoporous CuO, formed with the ink solution, consisted of grains and pores with nano-meter size. All of them were strongly dependent on calcination temperature. Sensing properties toward H2 and C2H5OH gases were examined as a function of operating temperature. High and fast responses toward H2 and C2H5OH gases were discussed in terms of crystallinity, nonstoichiometry and morphological factors such as porosity, grain size and surface-to-volume ratio. To our knowledge, the responses toward H2 and C2H5OH gases of these CuO gas sensors are comparable to previously reported values.