• Title/Summary/Keyword: Cu flake

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EMI Shielding Efficiency of Recycled plastic/Hybrid Conductive filer Composites filled Electro Arc furnace Slag (제강Slag 충진 폐플라스틱/복합 전도성 filler복합재료의 전자파 차폐 효과)

  • Kang Young-Goo;Song Jong-Hyeok
    • Journal of the Korean Society of Safety
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    • v.19 no.4 s.68
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    • pp.80-85
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    • 2004
  • Electromagnetic interference(EMI) shielding characteristics of composite filled with Cu flake and carbon brush powder as hybrid conductive filler and EAF slag have been studied. The coaxial transmission line method of ASTM D4935-99 was used to measure the EMI Shielding effectiveness of composites as formulation in frequency rage $100\~1,000MHz$ The SE also increases with the increase in flier loading. The hybrid filler filled composites show higher SE compared to that of only Cu flake. The correlation between SE and conductivity of the various composites is also discussed. The results indicate that the composites having higher filler loading$({\geq}40wt.\%)$ can be used for the purpose of safety materials to protect hazardous electromagnetic interference.

A Study of the CV graphite cast iron with small additions of a Al-Cu alloy (Al-Cu첨가(添加)에 의(依)한 CV흑연주철(黑鉛鑄鐵)에 관한 기초연구)

  • Jeon, Hyeong-Tag;Hur, Bo-Young;Kim, Soo-Yong
    • Journal of Korea Foundry Society
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    • v.3 no.4
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    • pp.239-247
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    • 1983
  • CV graphite cast iron has been studied and generally known to have properties close to the average values of those between flake and spheroidal graphite cast iron. However, the thermal diffusivity of CV graphite cast iron is much larger than that of the average value of those between flake and spheroidal graphite cast iron. In this study, an easy production method of CV graphite cast iron with small additions of a Al-Cu which is known as the element of the graphitization was investigated. The effects of hold time and of Al-Cu additions after the treatments with spheroidizer (Fe-Si-Mg alloy) were also investigated. Increasing the additions of a Al-Cu alloy, the holding time to form a CV graphite cast iron was decreasing. Tensile strength and thermal diffusivity (flash method) were measured in order to find the changes of the mechanical properties and the physical properties. Spheroidal, CV, and flake graphite cast iron have tensile strengths 46.44, 38.29, and $27.29\;kg/mm^2$ and thermal diffusivities $3.95{\times}10^{-6,}$ $8.41{\times}10^{-6}$, $8.81{\times}10^{-6}m^2/sec$, respectively at room temperature.

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Electromagnetic Wave Absorption Characteristics of Nanocrystalline FeCuNbSiB Alloy Flakes/Polymer Composite Sheets with Different Flake Thickness

  • Lee, Tae-Gyu;Kim, Ju-Beom;Noh, Tae-Hwan
    • Journal of Magnetics
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    • v.14 no.4
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    • pp.155-160
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    • 2009
  • This study examined the effects of a decrease in thickness of magnetic alloy flakes on the electromagnetic wave absorption characteristics of nanocrystalline $Fe_{73.5}Cu_1Nb_3Si_{15.5}B_7$ (at.%) alloy flakes/polymer composite sheets available for a quasi-microwave band. The thickness of FeCuNbSiB alloy flakes decreased to 1-2 $\mu$m with increasing milling time up to 24 h, and the composite sheet including alloy flakes milled for 24 h exhibited considerably enhanced power loss properties in the GHz range compared to the sheets having non-milled alloy powders. Although a considerable increase in loss factor upon milling was observed in the narrow frequency range of 4-6 GHz, there was no correlation between the complex permeability and flake thickness. However, the complex permittivity increased with increasing milling time, and there was good agreement between the milling time and the frequency dependences of the complex permittivity and power loss.

Graphene Flakes를 이용한 전극 제작

  • Kim, Seong-Hui;O, Jong-Sik;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.201-201
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    • 2013
  • ITO는 투명하면서도 전도성이 매우 높은 물질로 디스플레이 분야에서 전극으로 많이 사용된다. 하지만 ITO는 세라믹 물질이기 때문에 공정 단가가 높고, 유연성이 낮아 구부릴 경우 전도성이 파괴되며 충격에도 약하여 flexible한 소자에 적용할 수 없다. 또한 metal diffusion이 잘 일어나는 물질이기 때문에 OLED 소자의 특성을 저해한다. 이와 같은 문제점을 해결하기 위해 ITO를 대체하여 graphene을 이용한 투명전극 연구개발이 활발히 진행되고 있다. Graphene은 높은 mobility와 전도도를 가지고 있으며, 높은 열전도성, Young's modulus, 그리고 mechanical flexibility를 가진 물질이다. 최근에 이러한 장점들로 인해 ITO를 대체하는 물질로서 각광을 받고 있지만 graphene은 Cu, Ni과 같은 금속표면에 한정되어 성장하는 문제점을 가지고 있다. 이 graphene 합성방법은 전사과정을 필요로 하며, 이로 인해 낮은 생산성과 낮은 수율을 야기한다. 최근 높은 생산성을 가지는 graphene 전극을 만들기 위해 Reduced Graphene Oxide (rGO) 연구가 활발히 진행되고 있다. 그러나 rGO는 산화환원 과정에서 전기전도도와 electron mobility가 완벽히 회복되지 못한다는 문제점을 가지고 있다. 그리하여 본 연구에서는 높은 투과도와 높은 전도도를 갖는 graphene 전극을 얻기 위해서 powdered graphene flake를 사용하였다. Graphene flake를 IPA solvent에 분산시키기 위해 sonicator과 homogenizer를 이용하여 Graphene flake solution을 제작하였다. 그리고 uniform한 전극을 만들기 위해 Spray Coating 방법을 이용하여 PET 기판 위에 graphene flake를 증착시켰다. graphene flake를 이용하여 높은 투과도와 낮은 면저항을 갖는 투명전극을 제작하고, 그 특성을 UV-visible spectrophotometer과 four point probe를 이용하여 확인하였다.

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A Method for Application of Ammonium-based Pretreatment Solution in Preparation of Copper Flakes Coated by Electroless Ag Plating (구리 플레이크의 무전해 은도금에서 암모늄계 구리 전처리 용액의 적용법)

  • Kim, Ji Hwan;Lee, Jong-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.57-63
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    • 2015
  • In order to prepare a low-cost conductive filler material possessing improved anti-oxidation property, Ag-coated Cu flakes were fabricated and the effects of an applying method of ammonium-based pretreatment solution on the Cu flakes were analyzed. The pretreatment solution was used to remove the surface oxide layer on Cu flake. During a single-stage pretreatment process, hole-shaped defects were formed on the flake surface during the pretreatment after 2 min, and the number and size increased in proportion to the pretreatment time. In the case that Ag plating solution was injected in the pretreatment solution after the pretreatment for 2 min, the defects were also formed during Ag plating. In contrast, the defects tremendous decreased in the case that the pretreatment solution was removed after the first pretreatment for 2 min and the Ag plating proceeded after the second pretratment using a low concentration pretreatment solution. As the final result, the 15 wt% Ag-coated Cu flake sample which was fabricated using the single-stage pretreatment oxidized at $166^{\circ}C$, but the sample fabricated by the double-stage pretreatment oxidized at $224^{\circ}C$, indicating definitely improved anti-oxidation property.

Effects of Process Variables on Preparation of Silver-Coated Copper Flakes Using Hydroquinone Reducing Agent (하이드로퀴논 환원제를 사용한 은코팅 구리 플레이크의 제조에서 공정 변수의 영향)

  • Chee, Sang-Soo;Lee, Jong-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.3
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    • pp.57-62
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    • 2017
  • In the process for preparing Ag-coated Cu flakes by electroless silver plating using hydroquinone reducing agent, Ag coating qualities were compared by changing various process parameters such as type of pretreatment solution, plating temperature, pH of plating solution, type and injection rate of plating solution, and pulp density. Effective pretreatment solution for removing the oxide layer on a Cu flake was preferentially suggested. The conditions of low plating temperature, pH value of 4.34, slow injection rate of Ag plating solution, elimination of deionized water in the Ag plating solution, and high pulp density significantly suppressed the formation of separated tiny Ag particles, and thus the surface coverage of Ag coating on Cu flakes was enhanced.

Thermophysical Properties of Copper/graphite Flake Composites by Electroless Plating and Spark Plasma Sintering (무전해도금 및 방전 플라즈마 소결을 이용한 구리/흑연 복합재료 제조 및 열물성 특성 평가)

  • Lee, Jaesung;Kang, Ji Yeon;Kim, Seulgi;Jung, Chanhoe;Lee, Dongju
    • Journal of Powder Materials
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    • v.27 no.1
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    • pp.25-30
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    • 2020
  • Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m-1K-1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10-6 to 3.06 × 10-6K-1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

Influence of Graphite Content and Shape on the Cu-Based Sintered Friction Materials (동계 소결마찰재에 대한 흑연함량과 형상의 영향)

  • Choe, Byeong-Ho;Lee, Jong-Hyeong;Song, Gyeong-Tae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.1
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    • pp.44-52
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    • 1996
  • Influence of frictional and mechanical properties was studied with the content(8-18 wt.%) and shapes(flake of irregular) of graphite that was used as lubricant components of copper-based sintered materials. The density, hardness and bending strength of friction materials with the shape of flake graphite were lower and decreased rapidly than that of irregular, as the content of graphite increases up to 18 wt.%. In friction test, wear rate was about 2.0-$2.5{\times}10^{-7}\textrm{cm}^3$/kgf.m and coefficient of friction was 0.30-0.37, independent on graphite content and shape. As the temperature of friction materials increased, wear rate decreased rapidly because oxides such as $Cu_2O$ and $SnO_2$ in the surface of friction material were formed.

Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler (Ag 코팅 Cu 플레이크 필러를 사용한 도전 페이스트의 전기 및 열전도도)

  • Kim, Gahae;Jung, Kwang-Mo;Moon, Jong-Tae;Lee, Jong-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.51-56
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    • 2014
  • After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.