• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.225-229
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• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.204.1-204.1
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• 2014

스마트폰과 같은 통신기기 및 각종 전자제품에 있어 크기의 축소와 간소화 추세에 따라 인쇄회로기판(PCB)의 초미세회로설계 기술이 요구됨에 따라, 인쇄회로기판과 첨단 전자부품 사이의 접합 신뢰성을 향상시키기 위해 무전해 니켈 도금이 널리 사용되고 있다. 일반적으로, 무전해 Ni도금은 강산, 강염기성 용액을 이용하여 수행되고 있다. 따라서, 공정과정 중에 기판의 손상을 초래하기도 할뿐만 아니라, 환경적으로도 문제시 되고 있다. 본 연구에서는 친환경적 도금공정의 개발을 위해 중성에서 N-(B)무전해 도금을 시행하였다. 중성의 무전해 도금공정은 어떠한 기판을 사용하여도 기판의 손상없이 도금이 가능하다는 장점을 가지고 있고, Boron(B)은 Ni을 비정질화 시키는 물질로 알려져 있다. B가 첨가된 무전해 Ni도금 박막에 있어 B의 영향을 알아보기 위하여 중성조건에서 B를 포함한 DMAB의 첨가량을 조절하였다. Ni-(B) 무전해 도금 시 도금조의 온도는 $40^{\circ}C$로 하였고, 무전해 도금액의 pH는 7(중성)로 유지하였다. Cu Foil기판을 사용하여 DMAB의 양에 따라 성장된 Ni-B무전해 도금 박막의 특성을 분석하기 위해 X-ray Diffraction (XRD), Field Emission Scanning Electron Microscope (FE-SEM), Optical microscope (OM), X-ray Photoelectron Spectroscopy (XPS), X-ray Absorption Spectroscopy (XAS)을 이용하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.34-34
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• 2018

레이저를 통한 플라스틱 일체형 회로형성 기술은 레이저 직접 성형 (Laser Direct Structuring, LDS) 기술과 도금기술을 이용하여 기판 표면에 전도성 회로 패턴을 형성하고 소자를 집적하여 부품을 제작하는 기술이다. 종래에는 PCB 기반의 평면기판을 기반으로 하여 제작된 소자와 부품이 전자제품의 주를 이루었으나, 최근 소자의 집적화와 제품 디자인의 유연화(flexible)로 굽힘(bendable) 형태의 스마트 시계와 같은 웨어러블(wearable) 전자 제품이 출시되었으며, 레이저를 통한 플라스틱 일체형 회로형성 기술은 미래 사회의 주를 이룰 웨어러블 형태의 제품의 상용화를 가능하게 할 뿐만 아니라 회로 집적이 가능하여 제품 혁신을 주도할 기술로 주목 받고 있다. 본 연구에서는 LDS 부품의 미세 회로 구현을 위한 공정 기술 개발에 있어서 고생산성 무전해 동도금액 및 부품 실장을 위한 표면처리 기술 개발에 대한 결과를 보고한다. 미세 회로 패터닝 기술의 상용화를 위해서는 도금액의 안정성뿐만 아니라 고속 공정기술이 필요하다, 현재 국내 무전해 동 도금의 석출 속도는 시간 당 $4{\sim}5{\mu}m$ 내외이기 때문에, 생산성을 향상시키기 위해서는 시간 당 $10{\mu}m$ 정도의 고속 무전해 동 도금 공정 개발 필요하다.

• Composites Research
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• v.28 no.5
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• pp.254-259
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• 2015

Carbon fiber/aluminum (CF/Al) composites were successfully fabricated without pressure casting using wettability modification of carbon fiber. The wettability of liquid aluminum on carbon fibers was enhanced through electroless plating of copper on carbon fibers. Liquid aluminum was well infiltrated into carbon fiber bundles with Cu coating layer due to low wetting angle, and a lot of pores that existed in CF/Al composite without Cu coating on CF were greatly removed. However, a few tiny pores existed in carbon fiber bundles, which is due to not bad wettability between CF and Al but shrinkage cavity that was generated during cooling of CF/Al composite. The tiny pores could be effectively removed by a subsequent rolling.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.42-48
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• 2002

Effects of coating treatment of metallic Cu, Ni-P film on $SiC_p$, for $SiC_p$/iron aluminide composites were studied. Porous hybrid preforms were fabricated by reactive sintering after mixing the coated $SiC_p$, Fe and Al powders. Then the final composites were manufactured by squeeze casting after pouring AC4C Al alloy melts in preforms. The change of reactive temperature, density, microstructure of the preforms and microstructure of the composites were investigated. The exprimental results were summarized as follows. The thickness of Cu and Ni-P metallic layer formed on $SiC_p$ by electroless plating method were about $0.5{\mu}m$ and coated uniformly. There was no remakable change in the ignition temperature with variation of the mixing ratio of Fe and Al powder while in the case of coated $SiC_p$ it was lower about $20^{\circ}C$ than in the non-coated $SiC_p$. The maximum reaction temperature increased with increasing Al contents, but decreased with increasing $SiC_p$ contents. Expansion ratio of preform after reactive sintering increased with amount of Cu coated $SiC_p$. In the case of Fe-70at.%Al, the expansion ratio was about 7% up to 8wt.% of $SiC_p$, addition but further addition of $SiC_p$, increased the ratio significantly. And in the case of Fe-50 and 60at.%Al, it was about 20% up to 16wt.% of $SiC_p$ addition and about 28% in 24wt.% of $SiC_p$, addition. The microstructures of compounds showed that the grains became finer as amount of $SiC_p$, and mixing ratio of iron powder increased and the shape of compounds was changed gradually from irregular to spheroidal.

• Polymer(Korea)
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• v.36 no.2
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• pp.169-176
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• 2012

Based on our experience in developing resistive humidity sensor, interdigital gold electrodes with different fingers and gaps have been fabricated on a glass epoxy (GE) substrate using screen printing techniques. The basic structure of the electrode consisted of a 3-, 4- and 5-fingers with gaps of 310 and 460 ${\mu}m$. Gold electrode/GE was prepared by first printing silver nanopaste, followed by consecutive electroless plating of Cu, Ni and then Au. Copolymer of [2-(methacryloyloxy)ethyl] dimethyl benzyl ammonium chloride (MDBAC) and methyl methacrylate (MMA) was used as a humidity-sensing polyelectrolyte, which was fabricated by a screen printing method on the Au electrode/GE substrate. The flexible humidity sensor showed acceptable linearity between logarithmic impedance and relative humidity in the range of 20-95%RH, low hysteresis of 1.5%RH, good response and recovery time of 75 sec at 1 V, 1 kHz, and $25^{\circ}C$. Electrode construction had a significant influence on the humidity-sensing characteristics of polymeric humidity sensors. The activation energy between electrode and ion conducting polyelectrolyte plays an important role in explaining the differences of humidity sensing characteristics such as temperature dependence, sensitivity, linearity and hysteresis.