• 한국분말재료학회지
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• 제16권1호
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• pp.9-15
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• 2009

Amorphization and crystallization behaviors of $Ti_{50}Cu_{50}Ni_{20}Al_{10}$ powders during high-energy ball milling and subsequent heat treatment were studied. Full amorphization obtained after milling for 30 h was confirmed by X-ray diffraction and transmission electron microscope. The morphology of powders prepared using different milling times was observed by field-emission scanning electron microscope. The powders developed a fine, layered, homogeneous structure with prolonged milling. The crystallization behavior showed that the glass transition, $T_g$, onset crystallization, $T_x$, and super cooled liquid range ${\Delta}T=T_x-T_g$ were 691,771 and 80 K, respectively. The isothermal transformation kinetics was analyzed by the John-Mehn-Avrami equation. The Avrami exponent was close to 2.5, which corresponds to the transformation process with a diffusion-controlled type at nearly constant nucleation rate. The activation energy of crystallization for the alloy in the isothermal annealing process calculated using an Arrhenius plot was 345 kJ/mol.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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• pp.189-195
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• 1999

We have studied the vortex dynamics in YBa$_2Cu_3O_7$ single crystals with columnar defects using micro Hall-probe array. The Hall-probe array technique allowed a simultaneous measurement of the time and spatial dependence of the vortex density so that more detailed information on flux dynamics could be obtained. We found that field profiles inside sample were similar to the Bean's critical state model from the magnetic hysteresis measurement. Normalized relaxation rates were maximum near the center and decreased toward the edge if applied field H$_{app}$ is greater than the penetration field H. But applied magnetic field H$_{app}$ is less than H, relaxation rates were minimum near the center and increased toward edge. We found that glassy exponent ${\mu}$ has the value of ${\sim}$ 1 whose corresponding vortex motion is half-loop excitation. However, single vortex creep, ${\mu}$ ${\sim}$ 1/7, was also found at 30 K and H$_{app}$ ${\cong}$ H'. Calculation of activation energy, U, was possible from direct analysis of the local relaxation data using the basic diffusion equation. From these results, we found that U increases logarithmically with time and U around center was lower than that at the edge.

• ETRI Journal
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• 제38권2호
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• pp.265-271
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• 2016

We analyzed the interface characteristics of Zn-based thin-film buffer layers formed by a sulfur thermal cracker on a $Cu(In,Ga)Se_2$ (CIGS) light-absorber layer. The analyzed Zn-based thin-film buffer layers are processed by a proposed method comprising two processes - Zn-sputtering and cracker-sulfurization. The processed buffer layers are then suitable to be used in the fabrication of highly efficient CIGS solar cells. Among the various Zn-based film thicknesses, an 8 nm-thick Zn-based film shows the highest power conversion efficiency for a solar cell. The band alignment of the buffer/CIGS was investigated by measuring the band-gap energies and valence band levels across the depth direction. The conduction band difference between the near surface and interface in the buffer layer enables an efficient electron transport across the junction. We found the origin of the energy band structure by observing the chemical states. The fabricated buffer/CIGS layers have a structurally and chemically distinct interface with little elemental inter-diffusion.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.380.2-380.2
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• 2014

Direct synthesis of graphene using a chemical vapor deposition (CVD) has been considered a facile way to produce large-area and uniform graphene film, which is an accessible method from an application standpoint. Hence, their fundamental understanding is highly required. Unfortunately, the CVD growth mechanism of graphene on Cu remains elusive and controversial. Here, we present the effect of graphene growth parameters on the number of graphene layers were systematically studied and growth mechanism on copper substrate was proposed. Parameters that could affect the thickness of graphene growth include the pressure in the system, gas flow rate, growth pressure, growth temperature, and cooling rate. We hypothesis that the partial pressure of both the carbon sources and hydrogen gas in the growth process, which is set by the total pressure and the mole fraction of the feedstock, could be the factor that controls the thickness of the graphene. The graphene on Cu was grown by the diffusion and precipitation mode not by the surface adsorption mode, because similar results were observed in graphene/Ni system. The carbon-diffused Cu layer was also observed after graphene growth under high CH4 pressure. Our findings may facilitate both the large-area synthesis of well-controlled graphene features and wide range of applications of graphene.

• 폴리머
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• 제38권6호
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• pp.801-808
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• 2014

광경화 아크릴고분자 필름에서 이온이동에 관한 연구를 하였다. 고분자에 결합된 아민기와 카르복실산 작용기의 함량을 조절하여 수소이온과 수산화이온의 이동에 적합한 필름을 제조하였다. 수소이온 이동 검출을 위해 p-methylred(PMR) 유도체를 사용하였고 수산화이온 검출을 위해 페놀프탈레인 유도체를 합성하여 각각 고분자에 도입하였다. 수소이온의 이동은 아민기의 함량이 많을수록 빠르게 진행되었고 수산화이온은 카르복실산의 함량이 높을수록 빠르게 이동하였다. 수소이온 이동은 필름표면과 내부로 빠르게 진행하였고 PMR 포함 필름의 흡수스펙트럼을 통해 관찰되었다. 산 용액에 감응하는 필름을 사용하여 색상변화의 가역성을 관찰하였고 연속 50회를 실시하는 동안 정확히 재현되었다. 구리(II) 이온은 카르복실산 작용기의 함량이 높은 필름에서 빠르게 이동하였다. 로다민이 도입된 필름에서 구리이온의 배위로 로다민의 고리열림 반응이 진행되었고 광흡수 및 발광특성 측정을 통해 구리이온의 이동을 추적하였다.

• 한국세라믹학회지
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• 제51권6호
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• pp.549-553
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• 2014

$CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface.

• 한국표면공학회지
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• 제49권1호
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• 대한화학회지
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• 제65권2호
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• pp.93-105
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• 2021

Mononuclear Cu(II), Ni(II), Co(II), Mn(II), Zn(II), Fe(III), Ru(III), and UO2(II) complexes of 2-hydroxy-4-(p-tolyldiazenyl)benzylidene)-2-(p-tolylamino)acetohydrazide (H2L) were prepared by direct method. The ligand and its complexes were isolated in solid state and characterized by analytical techniques such as elemental and thermal analyses, molar conductance, magnetic susceptibility measurements and spectroscopic techniques such as UV-Visible, IR, 1H-NMR and 13C-NMR. The spectral data indicated that the ligand acted as neutral/monobasic bidentate or monobasic/dibasic tridentate ligand bonded to the metal ions through the oxygen atom of ketonic or enolic carbonyl group, azomethine nitrogen atom and deprotonated/protonated phenolic oxygen atom forming either tetragonally distorted octahedral or octahedral. Antimicrobial activities of the ligand and its complexes were evaluated against Escherichia coli, Bacillus subtilis and Aspergillus niger by well diffusion method. The results of antifungal activity showed that the Fe(III) complex (10) exhibited higher antifungal against Aspergillus niger than the other complexes. However, the results of antibacterial activity revealed that Cu(II) complex (4) is the most active against Escherichia coli while the Cu(II) complex (5) and Fe(III) complex (10) exhibited higher antibacterial effect on Bacillus subtilis than the other complexes.

• 공업화학
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• 제32권4호
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• pp.442-448
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• 2021

고분자전해질 연료전지에서 분리판 유로 형상은 유체 공급과 물 및 열 확산, 접촉 저항 등에 영향을 주는 중요한 요소이다. 본 연구에서는 25 cm² 단위 전지를 이용하여 공기극에 구리폼을 적용한 분리판을 이용하여 연료전지 성능 평가를 수행하였다. 압력과 상대습도 조건에 대한 영향을 분극 곡선과 전기화학적 임피던스 분광법을 이용하여 분석하였다. 구리폼의 ohmic 저항이 높아 사형유로형상 보다 연료전지 성능은 낮았지만, 다공성 구조로 인한 균일한 연료 분포로 활성화 손실과 물질전달 손실이 적은 것을 확인하였다. 구리폼의 소수성이 높아 물 배출이 유리한 장점이 있지만, 저가습 조건에서는 사형유로에 비하여 전해질막 수화도가 낮은 것을 확인하였다. 다공성 금속 분리판은 균일한 압력 분포와 효과적인 수분 배출로 연료전지 성능을 개선할 수 있을 것으로 판단되며, 저항을 최소화할 수 있도록 금속폼의 물성에 대한 연구가 수행되어야 할 것이다.

• 한국분말재료학회지
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• 제29권3호
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• pp.213-218
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• 2022

This study investigates the interfacial reaction between powder-metallurgy high-entropy alloys (HEAs) and cast aluminum. HEA pellets are produced by the spark plasma sintering of Al_0.5CoCrCu_0.5FeNi HEA powder. These sintered pellets are then placed in molten Al, and the phases formed at the interface between the HEA pellets and cast Al are analyzed. First, Kirkendall voids are observed due to the difference in the diffusion rates between the liquid Al and solid HEA phases. In addition, although Co, Fe, and Ni atoms, which have low mixing enthalpies with Al, diffuse toward Al, Cu atoms, which have a high mixing enthalpy with Al, tend to form Al-Cu intermetallic compounds. These results provide guidelines for designing Al matrix composites containing high-entropy phases.