• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• Journal of the Korean institute of surface engineering
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• v.45 no.5
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• pp.188-192
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• 2012

The hetero junction on dielectrics and ferrite for LTCC was prepared by using NiCuZn ferrite. The shrinkage behaviour of ferrite tapes in combination with a dielectric tape was investigated. The characteristics of NiCuZn ferrite were investigated using XRD (X-ray diffractometer), Dilatometer, FE-SEM (Field emission scanning electron microscope), EDS (Energy dispersive spectrometer). NiCuZn ferrite calcined at $700^{\circ}C$ had a good apparent density and initial permeability of magnetic properties. The shrinkage rate of the NCZF700 ferrite and dielectric material was similar. The multilayer revealed dense, uniform morphologies with excellent interface quality. Diffusion of hetero junction such as dielectric and ferrite was not occuring at $900^{\circ}C$.

• Bulletin of the Korean Chemical Society
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• v.17 no.8
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• pp.688-693
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• 1996

Tetradentate Schiff base ligands derived from 2-hydroxy-1-naphthaldehyde and aliphatic diamine have been synthesized. Cu(Ⅱ) complexes of Schiff base ligands have been synthesized from the free ligands and copper acetate. The mole ratio of ligand to copper was identified to be 1:1 by the result of elemental analysis and Cu(Ⅱ) complexes were in a four-coordinated configuration. The electrochemical redox process of Cu(Ⅱ) complexes in a DMF solution has been investigated by cyclic voltammetry, chronoamperometry, differential pulse voltammetry, and controlled potential coulometry. The redox process of Cu(Ⅱ) complexes is one electron transfer process in quasi-reversible and diffusion-controlled reaction. The electrochemical redox potentials and the kinetic parameters of Cu(Ⅱ) complexes are affected by the chelate ring of Schiff base ligands.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.2
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• pp.79-85
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• 2019

To investigate the influence of heat treatment on the growth intermetallic compounds (IMCs) at the joint interface of friction-welded Cu-Al, several heat treatments are performed at three different temperature with different times. The experiments reveal three different IMCs layers which are significantly influenced by atomic diffusion of Cu and Al with heat treatment conditions. Since the formation of these IMCs layers can affect mechanical properties of friction-welded Cu-Al interfaces, the relationship between the microstructure of IMCs layers and the tensile strength is analyzed according to heat treatment temperature and times.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.469-474
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• 2007

Electroless deposition(ELD) was applied to fabricate Cu interconnections on a TaN diffusion barrier with Pd seed layer. The Pd seed layer was obtained by self-assembled monolayer method(SAM) with PDDA and PSS as surfactants. We were able to obtain about 10nm Pd nano particles as seeds for electroless Cu deposition and the density of Pd seeds was much higher than that of Pd seeds fabricated by conventional Pd sensitization-activation method. Also we were able to obtain finer Cu interconnections by ELD. Therefore we concluded that the Pd seed layer by SAM was able to be applied to form Cu interconnection by ELD for under 30nm feature.

• Journal of the Korean Chemical Society
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• v.37 no.9
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• pp.806-812
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• 1993

Complexes of $Cu(I)(hfac)PR_3$(P: phosphine and R: Me, Et and Bu) as Cu(I)(${\beta}$-diketonate) compounds have been synthesized and their electrochemical properties have been investigated using glassy carbon and carbon microelectrode in aprotic solvent. Reduction process of $Cu(I)(hfac)PR_3$ compounds carried out one electron pathway to Cu(0) by cyclic voltammetry in acetonitrile solution. Chronoamperometric curve using carbon microelectrode shows that these complexes are one electron process and diffusion coefficients are $4.5{\sim}6.7{\times}10^{-6}cm^2$/sec.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• Journal of Powder Materials
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• v.9 no.1
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• pp.19-24
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• 2002

This paper reports the results of an investigation into the effect of Cu additions upon the nano-crystallization behaviour of an Al-Y-Ni alloy. 1 at.% Cu was added to a base alloy of Al/sub 88/Y₄Ni/sub 8/ either by substitution for Al to form Al/sub 87/Y₄Ni/sub 8/Cu₁, or by substitution for Ni to form Al/sub 88/Y₄Ni/sub 7/Cu₁. Consistent with previous findings in the literature, the substitution of Cu for Al was found to increase the thermal stability of the amorphous phase whereas the substitution of Cu for Ni was found to decrease its thermal stability. Comparing the microstructures of these alloys after heat treatment to produce equivalent volume fractions of Al nanocrystals showed average grain sizes of 14 nm, 12 nm and 9 nm for the alloys Al/sub 88/Y₄Ni/sub 8/, Al/sub 87/Y₄Ni/sub 8/Cu₁respectively. The effect of Cu in refining the size of the nanocrystals was attributed to enhanced nucleation increasing the number density of the nanocrystals, rather than diffusion limited or interface limited growth.

• Journal of Technologic Dentistry
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• v.14 no.1
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• pp.23-43
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• 1992

Corrosion characteristics of four commerial gold-based dental alloys(C-1; Au75%, Ag13.9%, Pd3%, Cu & etc.,8.1%, C-2 ;Au 52.08, Ag 24%, Pd 5%, Cu & etc.,18.92, C-3 ; Au 53%, Ag 22%, Pd 5%, Pt 3% Cu & etc.,17%, C-4 ; Au 53%, Pd4, Pt1.5%, Ag & Cu & etc.,41.5%) and four experimental ternary Au-Ag-Cu alloys(E-1 ; Au 50%, Ag 30%, Cu 20%, E-2 ; Au 50%, Ag 20%, Cu 30%, E-3 ; Au 50%, Ag 10%, Cu 40%, E-4 ; Au 50%, Ag 40%, Cu 10%) were investigated by potentiodynamic polarization analysis and the structure was examined by optical microscope and SEM. All corrosion testing was conducted in 1% NaCl solution. The main results are as follows : 1. The corrosion resistence of commercial alloys was decreased in the order of C-1, C-3, C-4, C-2. C-2. 2. The E-1 and E-3 ternary alloys exhibits the higher corrosion resistence than E-2 and E-4 alloys. 3. The cast microstructure of alloys reveals dendrite morphology which shows the significant microsegregation caused by the difference in the diffusion rate between liquid and solid. 4. It is found that the surface corrosion products were mainly AgCl by X-ray diffraction results.

• Transactions of the Korean hydrogen and new energy society
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• v.13 no.3
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• pp.214-223
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• 2002

Kinetic and effectiveness factors for methanol steam reforming using commercial copper-containing catalysts in a plug flow reactor were investigated over the temperature ranges of $180-250^{\circ}C$ at atmospheric pressure. The selectivity of $CO_2$/$H_2$ was almost 100%, and CO products were not observed under reaction conditions employed in this work. It was indicated that $CO_2$ was directly produced and CO was formed via the reverse water gas shift reaction after methanol steam reforming. The intrinsic kinetics for such reactions were well described by the Langmuir-Hinshelwood model based on the dual-site mechanism. The six parameters in this model, including the activation energy of 103kJ/mol, were estimated from diffusion-free data. The significant effect of internal diffusion was observed for temperature higher than $230^{\circ}C$ or particle sizes larger than 0.36mm. In the diflusion-limited case, this model combined with internal effectiveness factors was also found to be good agreement with experimental data.