• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 추계학술발표대회 개요집
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• pp.94-96
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• 2004

• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2004년도 춘계총회 및 학술발표회
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• pp.36-36
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• 2004

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
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• pp.191-193
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• 2004

GMA(Gas Metal Arc)용접에서는 콘택트 팁이 토치 선단에 위치하여 용접 와이어를 송급하여 준다. 이러한 콘택트 팁의 주된 기능은 용접 전류를 와이어에 전송시켜주고, 와이어를 용접하고자 하는 위치로 유도하는 것이다. (중략)

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권4호
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• pp.239-245
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• 2000

A copper-tungsten sintered alloy(WCu) has been friction-welded to a tough pitch copper (Cu) in order to investigate friction weldability. The maximum tensile strength of the SWu-Cu friction welded joints had cp to 96% of those of the Cu base metal under the condition of friction time 0.6sec, friction pressure 45MPa, upset pressure 125MPa and upset time 5.0sec. And it is confirmed that the tensile strength of friction welded joints are influenced highly by upset pressure rather than friction time. And it is considered that mixed layer was formed in the Cu adjacent side to the weld interface, W particles included in mixed layer induced fracture in the Cu adjacent side to the weld interface and also, thickness of mixed layer was reduced as upset pressure increase.

• 한국정보통신학회논문지
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• 제13권1호
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• pp.110-114
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• 2009

최근에 유기물 전계효과 트랜지스터의 연구는 전자소자분야에서 널리 알려져 있다. 특히 본 연구에서는CuPc 물질을 기본으로 하여 소자를 제작하고, 또한 기판의 온도를 달리 하여 제작하였다. CuPc FET 소자는 top-contact 방식으로 제작하였으며, 기판의 온도는 상온과 $150^{\circ}C$로 달리 하였다. 또한 CuPc의 두께는 40nm로 하였고, 채널의 길이는 $50{\mu}m$, 폭은 3mm로 하였다. 제작된 소자를 이용하여 전압-전류 특성을 측정하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.318.2-318.2
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• 2014

The high contact resistance is still one of the major issues to be resolved in CdS/CdTe thin film solar cells. CdTe/Metal Schottky contact induced a high contact resistance in CdS/CdTe solar cells. It has been reported that the work function of CdTe thin film is more than 5.7 eV. There has not been a suitable back contact metal, because CdTe thin film has a high work function. In a few decades, some buffer layer was reported to improve a back contact problem. Buffer layers which are Te, $Sb_2Te_3$, $Cu_2Te$, ZnTe:Cu and so on was inserted between CdTe and metal electrode. A formed buffer layers made a tunnel junction. Hole carriers which was excited in CdTe film by light absorption was transported from CdTe to back metal electrode. In this report, we reported the variation of solar cell performance with different buffer layer at the back contact of CdTe thin film solar cell.

• Current Photovoltaic Research
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• 제8권3호
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• pp.102-106
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• 2020

In this paper, the effect of MoSe₂ on the contact resistance (R_C) of the transparent conducting oxide (TCO) and Mo junction in the scribed P2 region of the Cu(In,Ga)Se₂ (CIGS) solar module was analyzed. The CIGS/Mo junction becomes ohmic-contact by MoSe₂, so the formation of the MoSe₂ layer is essential. However, the CIGS solar module has a TCO/MoSe₂/Mo junction in the P2 region due to structural differences from the cell. The contact resistance (R_C) of the P2 region was calculated using the transmission line method, and MoSe₂ was confirmed to increase R_C of the TCO/Mo junction. B doped ZnO (BZO) was used as TCO, and when BZO/MoSe₂ junction was formed, conduction band offset (CBO) of 0.6 eV was generated due to the difference in their electron affinities. It is expected that this CBO acts as a carrier transport barrier that disturbs the flow of current, resulting in increased R_C. In order to reduce the R_C caused by CBO, MoSe₂ must be made thin in a CIGS solar module.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.36.1-36.1
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• 2010

While the substrate-type solar cells with Cu(In,Ga)Se2 absorbers yield conversion efficiencies of up 20%[1], the highest published efficiency of Cu(In,Ga)Se2 superstrate solar cell is only 12.8% [2]. The commerciallized Cu(In,Ga)Se2 solar cells are made in the substrate configuration having the stacking sequence of substrate (soda lime glass)/back contact (molybdenum)/absorber layer (Cu(In,Ga)Se2)/buffer layer (cadmium sulfide)/window layer (transparent conductive oxide)/anti reflection layer (MgF2) /grid contact. Thus, it is not possible to illuminate the substrate-type cell through the glass substrate. Rather, it is necessary to illuminate from the opposite side which requires an elaborate transparent encapsulation. In contrast to that, the configuration of superstrate solar cell allows the illumination through the glass substrate. This saves the expensive transparent encapsulation. Usually, the high quality Cu(In,Ga)Se2 absorber requires a high deposition temperature over 550C. Therefore, the front contact should be thermally stable in the temperature range to realize a successful superstrate-type solar cell. In this study, it was tried to make a decent superstrate-type solar cell with the thermally stable ZnO:Al layer obtained by adjusting its deposition parameters in magnetron sputtering process. The effect of deposition condition of the layer on the cell performance will be discussed together with hall measurement results and current-voltage characteristics of the cells.

• 한국전기전자재료학회논문지
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• 제23권7호
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• pp.575-579
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• 2010

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance caused by a better contact conductivity of Ni with Si and the subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading was combined with the lower resistance of a metal silicide contact and an improved conductivity of the plated deposit. This improves the FF (fill factor) as the series resistance is reduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopeds regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this paper the formation of a selective emitter, and the nickel silicide seed layer at the front side metallization of silicon cells is considered. After generating the nickel seed layer the contacts were thickened by Cu LIP (light induced plating) and by the formation of a plated Ni/Cu two step metallization on front contacts. In fabricating a Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2011년도 정기총회 및 추계학술대회 논문집
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• pp.994-999
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• 2011

The main wearing slider of pantograph is a difference which is considerable to wear phenomenon according to material properties. Especially, Cu-type wearing slider suddenly occurs the abnormal wear by precipitation, this threatens the travelling safety of the train. The abnormal wear by precipitation and arc influences are main factor decided to life time of Cu-type wearing slider and contact wire. Consequently, the application of the main wearing slider with wear resisting capacity, electrical conductivity, resistance arc and lubrication is demanded. In this paper through tribologic approach, overcame abnormal phenomenon of the Cu-type wearing slider by the precipitation and for the economic efficient augmentation by durability improvement and the travelling safety were accomplished. The Cu-type wearing slider which has excellent electric conductivity and arc characteristic but it occurs the normal and abnormal wear phenomenon according the precipitation which changes, respectively. Consequently, this phenomenon grasps fixed quantity according to precipitation, a mileage and wear volume then Fe-type wearing slider compared and analyzed.