• Journal of the Korean Crystal Growth and Crystal Technology
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• 제6권1호
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• pp.88-97
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• 1996

The metallization is the key to determining cell costs, cell performance, and system reliability. Screen printing technology suffers from several limitations affecting mainly the front grid. The buried contact solar cell (BCSC) was specifically desinged to be compatible with low cost, mass production techniques and avoid the conventional metallization problem. By using electroless plating technique, we performed this metallization inexpensively and reliably. This paper presents the details of the optimization procedure of metallization schemes on laser grooved cell surfaces. Commercially available Ni, Cu and Ag plating solutions were applied for the cell metallization. The application of those solutions on the buried contact front metallization has resulted in an cell efficiency of 18.8%. The cell parameters are an open circuit voltage of 651 mV, short circuit current density of 37.1 mA/$\textrm{cm}^2$, and fill factor of 77.8 %. The efficiency of over 18 % was achieved in the above 90% of the batch.

• Tribology and Lubricants
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• 제39권6호
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• pp.256-261
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• 2023

This study is conducted to evaluate the durability of superhydrophobic surfaces, with a focus on two aspects: contact angle measurement and self-cleaning-performance analysis. Superhydrophobic copper and aluminum surfaces are fabricated using the immersion method and subjected to a rolling wear test, in which a 2 kg weight is placed on a rolling tester, under loaded conditions. To evaluate their durability, the contact angles of the specimens are measured for each cycle. In addition, the surface deformation of the specimens before and after the test is analyzed through SEM imaging and EDS mapping. The degradation of the self-cleaning performance is evaluated before and after the wear test. The results show that superhydrophobic aluminum is approximately 4.5 times more durable than superhydrophobic copper; the copper and aluminum specimens could endure 21,000 and 4,300 cycles of wear, respectively. The results of the self-cleaning test demonstrate that superhydrophobic aluminum is superior to superhydrophobic copper. After the wear test, the self-cleaning rates of the copper and aluminum specimens decrease to 72.7% and 83.4%, respectively. The relatively minor decrease in the self-cleaning rate of the aluminum specimen, despite the large number of wear cycles, confirms that the superhydrophobic aluminum specimen is more durable than its copper counterpart. This study is expected to aid in evaluating the durability of superhydrophobic surfaces in the future owing to the advantage of performing wear tests on superhydrophobic surfaces without damaging the surface coating.

• Journal of Korean Society of Environmental Engineers
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• 제30권3호
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• pp.345-351
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• 2008

Fe-impregnated activated carbon(Fe-AC) was prepared by Fe(III) loading on activated carbon(AC) in various preparation pH. In order to evaluate the stability of Fe-AC, dissolution of iron from Fe-AC in acidic conditions was measured. In addition, batch experiments were conducted to monitor the removal efficiency of copper by Fe-AC. Results of stability test for Fe-AC showed that the amount of extracted iron increased with contact time but decreased with increasing solution pH. The dissolved amount of iron gradually increased at solution pH 2 and finally 13% of the total iron loaded on activated carbon was extracted after 12 hr. However dissolution of iron was negligible over solution pH 3. Removal of Cu(II) by Fe-AC was greatly affected by solution pH and was decreased as solution pH increased as well as initial Cu(II) concentration decreased. Surface complexation modeling was performed by considering inner-sphere complexation reaction and using the diffuse layer model with MINTEQA2 program.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.99.1-99.1
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• 2016

The materials for an electronic packaging provide diverse important functions including electrical contact to transfer signals from devices, isolation to protect from the environment and a path for heat conduction away from the devices. The packaging materials composed of metals, ceramics, polymers or combinations are crucial to the device operating properly and reliably. The demand of effective charge and heat transfer continuous to be challenge for the high-speed and high-power devices. Nanomaterials including graphene, carbon nanotube and boron nitride, have been designed for the purpose of exploiting the high thermal, electrical and mechanical properties by combining in the matrix of metal or polymer. In addition, considering the inherent electrical and surface properties of graphene, it is expected that graphene would be a good candidate for the surface layer of a template in the electroforming process. In this talk, I will present recent our on-going works in nanomaterials for microelectronic packaging: 1) porous graphene/Cu for heat dissipations, 2) carbon-metal composites for interconnects and 3) nanomaterials-epoxy composites as a thermal interface materials for electronic packaging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.35-38
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• 1993

SCLD(supercondocting current 1imiting device) with YBaCuO superconductor was fabricated by the sol-gel and the doctor-blade method. Critical current density ($J_{c}$) and critical current ($I_{c}$) of the SCLD are 100.27 A/$cm^2$and 1A at 77K and the electrodes contact with SCLD by silver paste. The SCL was connected with test circuit in series. When apple iud current exceed critical current value of the SCLD in testing circuit, the SCLD ristricts the over current by generating resistance itself without delay. Resistance of SCLD increase lineary 0 to 1.6$\Omega$ in propotion to applied current above the critical current $I_{c}$.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 한국초전도저온공학회 2000년도 KIASC Conference 2000 / 2000년도 학술대회 논문집
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• pp.9-11
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• 2000

A key technology for achieving commercial Nb_{3}$Sn superconducting wires may be driven from fabrication process of big-scale billets. There was no breakage in the strand that was constituted with annealed sub-element. It was need that billet had to treat HIP because of remove of voids and good contact between Cu and Nb filaments. Ta wound sheet was better than Ta tube for barrier in the strand.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.167.2-167.2
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• 2017

수지상 구리분말은 하나의 상(statue)이 복수의 접점(contact point)를 제공하며 표면적이 넓은 구조적인 특징으로 인해 발열기판 전도성 페이스트 등 다양한 전기 전가 분야에 활용되어왔다. 때문에 본 연구에서는 전해도금방법으로 수지상 구리분말이 형성될 때 첨가제가 수지상의 형상에 어떠한 영향을 미치는지 분석하였다. 첨가제는 PEG, JGB를 사용하여 농도별로 실험을 진행하였다. SEM 이미지 분석결과 첨가제가 추가함에 따라 수지상이 미세해지며 첨가제의 농도가 증가함에 따라 DAS(dendrite arm spacing)값이 감소하여 표면적이 증가하였다. BET 비표면적 분석결과 PEG($1.882m^2/g$)보다 JGB($2.119m^2/g$)에서 표면적을 넓히는 효과가 뛰어났다.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.536-536
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• 2012

나노와이어는 센서, 메모리소자, 태양전지등과 같은 다양한 소자로 응용이 되고 있다. Bottom-up 방법으로 길러진 나노와이어들을 금속전극 위에 정렬 및 접합시킬 때, 나노와이어와 금속전극간의 기계적 접합강도와 안정적인 전기적 특성이 매우 중요하다. 본 연구에서는 열압착 공정과 솔더전극(Cr/Au/In/Au, Cr/Cu/In/Au)을 사용함으로써, 나노와이어를 금속전극에 압입시켜 강한 기계적 접합강도와 안정적인 전기적 특성을 얻을 수 있는 공정을 제안하였다. 나노와이어와 금속 전극간의 접합부 분석을 위해 scanning electron microscopy (SEM)와 transmission electron microscopy (TEM)을 이용하였으며, 기계적 특성은 lateral force microscopy (LFM), 전기적 특성은 semiconductor analyzer (Keithley 4200-SCS)를 사용하여 측정하였다. 접합강도 측정결과 lateral force가 나노와이어에 가해질 때 나노와이어가 파괴되는 힘에서도 나노와이어와 금속전극간의 접합부파괴가 일어나지 않았다. 또한 나노와이어와 금속전극간의 전기적 접촉특성은 안정적인 ohmic contact을 이루었다.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.304-304
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• 2012

CIGS(CuInGaSe2) 태양전지의 후면전극(Back contact)으로 널리 사용되는 Mo 박막은 낮은 면저항, 높은 반사율, 광흡수층 Na-path 제공 등의 조건이 요구된다. 일반적으로 Mo 박막 제작은 DC 마그네트론 스퍼터링 방법이 가장 널리 사용되며, 제작조건에 따라 태양전지 효율에 강한 영향을 미치는 것으로 보고되고 있다. 본 연구에서는 DC 마그네트론 스퍼터링 시 기판에 이온빔(Ion-beam)을 동시 조사하는 이온 빔 스퍼터링 증착(Ion-beam sputter deposition)법으로 Mo 박막을 제작하였다. 제작된 박막의 전기적 및 광학적 특성은 4-point probe, UV-Vis-NIR spectrometer로 각각 조사하였으며 Na-path 제어를 위한 구조적 특성은 XRD, FE-SEM으로 분석하였다. 분석결과에 따르면 기존 DC 마그네트론 스퍼터링 방법보다 상대적으로 더 치밀한 구조와 높은 반사율을 가지는 박막이 제작됨을 알 수 있었다. Mo 박막의 최적조건은 DC power 300 W, Ion-gun power 50 W, Ar flow rate 20 sccm 였다.

• Journal of Welding and Joining
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• 제18권6호
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.