• 제목/요약/키워드: Cu contact

검색결과 406건 처리시간 0.026초

Effect of Improved Surface Wetability and Adhesion of Undulated Diamond-like Carbon Structure with r.f. PE-CVD

  • Jang, Young-Jun;Kim, Seock-Sam
    • KSTLE International Journal
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    • 제9권1_2호
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    • pp.22-25
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    • 2008
  • This paper investigated the wetting and adhesion property of undulated DLC film with surface morphology controlled for a reduced real area of contact. The undulated DLC Films were prepared by 13.56 MHZ radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) by using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM, AFM analysis showed that the after repeated deposition and plasma induced damage with Ar ions, the surface was nanoscale undulated. This phenomenon changed the surface morphology of DLC surface. Raman spectra of film with changed morphology revealed that the plasma induced damage with Ar ions significantly suppressed the graphitization of DLC structure. Also, it was observed that while the untreated flat DLC surfaces had wetting angle starting ranged from $72^{\circ}$ and adhesion force of 333ni. Had wetting angle the undulated DLC surfaces, which resemble the surface morphology of a cylindrical shape, increased up to $104^{\circ}$ and adhesion force decreased down to 11 nN. The measurements agree with Hertz and JKR models. The surface undulation was affected mainly by several factors: the surface morphology affinity to cylindrical shape, reduction of the real area of contact and air pockets trapped in cylindrical asperities of the surface.

Influence of Adaptor on the Calibration of Inductance Standards

  • Kassim, Dewi Mohd;Kim, Dan Bee;Kim, Wan-Seop
    • Journal of Electrical Engineering and Technology
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    • 제13권2호
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    • pp.911-917
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    • 2018
  • Influence of the adaptors on the calibration of $100{\mu}H$ inductance standard was studied as a function of torque, applied when tightening the standard inductor terminal with the adaptor. Two different homemade adaptors of BPO gold-plated brass (BPO-Au) and banana-copper (BN-Cu) were made for the connection between the LCR meter and the inductance standard. The measured inductance (L) of the standard inductor and the contact resistance ($R_C$) between the adaptor and the standard inductor terminal showed exponential decreases against the torque increase from $25cN{\cdot}m$ to $150cN{\cdot}m$. The measured L and the calculated equivalence series resistance ($R_S$) were dependent on the adaptor type as well as on the $R_C$. The results of the adaptor analysis imply that the BPO-Au adaptor with the lower $R_C$ is more suitable for the inductance calibration. The calculated inductance of $99.956{\mu}H$ corrected by subtraction of the adaptor inductance and the contact resistance contributions from the measured value using the BPO-Au adaptor agreed well with the certificate ($99.948{\mu}H$) of the PTB within the measurement uncertainty of $140{\mu}H/H$.

Investigation of contact resistance between metal electrodes and amorphous gallium indium zinc oxide (a-GIZO) thin-film transistors

  • Kim, Woong-Sun;Moon, Yeon-Keon;Lee, Sih;Kang, Byung-Woo;Kwon, Tae-Seok;Kim, Kyung-Taek;Park, Jong-Wan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.546-549
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    • 2009
  • In this paper, we investigated the effects of different source/drain (S/D) electrode materials in thin film transistors (TFTs) based on indium-gallium-zinc oxide (IGZO) semiconductor. A transfer length and effective resistances between S/D electrodes and amorphous IGZO thin-film transistors were examined. Intrinsic TFT parameters were extracted by the transmission line method (TLM) using a series of TFTs with different channel lengths measured at a low drain voltage. The TFTs fabricated with Cu S/D electrodes showed the lowest contact resistance and transfer length indicating good ohmic characteristics, and good transfer characteristics with a field-effect mobility (${\mu}_{FE}$) of 10.0 $cm^2$/Vs.

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Effect of Particle Size of Ceria Coated Silica and Polishing Pressure on Chemical Mechanical Polishing of Oxide Film

  • Kim, Hwan-Chul;Lim, Hyung-Mi;Kim, Dae-Sung;Lee, Seung-Ho
    • Transactions on Electrical and Electronic Materials
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    • 제7권4호
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    • pp.167-172
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    • 2006
  • Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

전기적 불완전 접촉에 따른 동산화물의 발열 및 아크 특성 (The Heating of Cu-oxide and Arc Properties according to Electrical Poor Contact)

  • 김완수;박상준;황동현
    • 한국안전학회지
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    • 제34권3호
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    • pp.15-20
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    • 2019
  • As industry is progressing and standards of living are improved, the demand of electrical energy is expected to grow 8-9% annually. Therefore, the importance of electrical fire prevention technology with the ability of the power supply is being emphasized. According to the statistics of fire in Korea, fire occurred about 45,000 cases annually, and electrical fire possessed about 20%. The electrical fire by poor contact has increased gradually, can be connected as great fire to secondarily induce short circuit and earth fault. Then analysis of heating causes of electrical connections between copper and copper alloy is needed. Also, detection and analysis algorithm of oxide at copper alloy are necessary. In this research, in order to understand the characteristics of oxide growth with rising resistance and heating, it is demonstrated that the oxide at electrical connections can cause fire due to arcing.

하이드로포밍용 소재의 성형성 평가 연구 (Development of Formability Test for Tube, Hydroforming)

  • 한수식;박기철
    • 소성∙가공
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    • 제9권6호
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    • pp.631-637
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    • 2000
  • The tube hydroforming technology is new key production technologies, which contribute to a light-weight cu. Because the tubes are used for hydroforming instead of the sheet materials formability test for tube is required to measure the formability of materials for hydroforming. In this Paper, a kind of formability test for tube, which can well represent the characteristics of tube hydroforming processes, is developed. Developed formability test method can consider not oかy the influence of material Properties but also contact with die and material. Some investigation was carried out to verify the effectiveness of developed formability test.

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W/WC계 접점의 전기적 특성에 미치는 첨가물의 영향 (Effect of additives on the electrical properties of W/WC contacts)

  • 신대승;이희웅;변우봉;한세원
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1988년도 추계학술대회 논문집
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    • pp.112-114
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    • 1988
  • W/WC-Cu/Ag contacts of 60wt%-40wt% base and contacts with additives(Ni, Co, C) of 1wt% below were prepared by a press-sinter-infiltrate process to compare with their physical properties and arc erosion characteristics. In physical properties, electrical conductivity of contacts with additive is lower than that of base contacts but hardness is higher. The results of arc test show that the erosion rate of contact with -0.1wt% Ni is decreased.

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p-InGaN/GaN 초격자구조에서 열처리 조건에 따른 오믹전극의 특성 (Characteristics of p-InGaN/GaN Superlattice structure of the p-GaN according to annealing conditions)

  • 장선호;김세민;이영웅;이영석;이종선;박민정;박일규;장자순
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.160-160
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    • 2010
  • In this work, we investigate ohmic contacts to p-type GaN using a Pt/Cu/Au metallization scheme in order to achieve low resistance and thermally stable ohmic contact on p-GaN. An ohmic contact formed by a metal electrode deposited on a highly doped InGaN/GaN superlattice sturucture on p-GaN layer. The specific contact resistance is $1.56{\times}10^{-6}{\Omega}cm^2$ for the as-deposited sample, $1.35{\times}10^{-4}{\Omega}cm^2$ for the sample annealed at $250^{\circ}C$ and $6.88{\times}10^{-3}{\Omega}cm^2$ for the sample annealed at $300^{\circ}C$.

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월악산화강암(月岳山花崗岩)의 접촉변성(接觸變成)에 관(關)하여 (Study on The Contact Metamorphism of Weolagsan Granite)

  • 이대성;강준남
    • 자원환경지질
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    • 제11권4호
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    • pp.169-182
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    • 1978
  • The Weolagsan area consists of four units; (1) Low grade meta-sediments of the upper members of Ogcheon age unknown group such as Changri (mainly black slate and phyllitic rock), Majeonri (mainly alternation of slate, limestone and chert) and Hwanggangri Formation (pebble bearing phyllitic sediments); (2) Samtaesan Formation of Chosun System of Ordovician; (3) So called meta-volcanics and (4) Weolagsan Granite and its associations which intruded above mentioned meta-sediments and meta-volcanics. This study was focused to know the Woelagsan granite and its metasomatic effects to the country rocks petrographically and petrochemically. According to the field survey, microscopic work and some chemical analysis, the granite is a "normal granite" based on the Streckeisen's classification and belongs to a mass of the Central-zone younger group in Ogcheon geosynclinal belt. The granite metasomatized the country rocks along its northern contact zone. Zone of calcareous and cherty rocks (Majeonri formation) was silicified partly and skarned locally at the contact with the granite. The chemical analysis of the zone show no difinite variations in contents of $SiO_2$ and CaO with the distance from the granite. It seems to be indicated that the silicification of this part was not so metasomatized by the granite body, but thermally affected as much as to be partially remelted in the specific parts of the formations. Meta-volcanic rock zone was slightly chloritized near contact with the granite. Limestone of Samtaesan Formation was silicified and skarned along the contact zone by the granite body. The chemical analysis of the zone show some noticiable changes in compositions of $SiO_2$ and CaO with distance from the granite boundary. It can be imagined that the silicification of this zone was metasomatically originated by Woelagsan Granite. According to chemical analysis on several trace elements, the ratio of Zn/Cr and Ni/Cr are relatively higher than that of Cu/Cr in the above mentioned silicified zones. Generally the variation of these metal elements in the zones tend to be regular with distance from the granite body.

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액상 기지에 분산된 $YBa_2 Cu_3O_x$결정립의 형태와 분위기의 영향 (The Shape of $YBa_2 Cu_3O_x$ Grains in the Liquid Matrix and the Effect of Atmosphere on It)

  • 서정훈;윤덕용
    • 한국결정성장학회지
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    • 제1권2호
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    • pp.15-22
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    • 1991
  • $YBa_2Cu_3O_x$ 초전도체를 $925^{\circ}C$, 산소 분위기에서 16시간 액상 소결할 때 액상-포켓이 결정립 내부에 포획되어 있는 것이 관찰되었다. 액상-포켓은 a, b 축의 길이가 같고 c축이 짧은 직육면체 모양의 판상형태를 갖고 있었으며, 같은 조건에서 16시간 동안 재열처리해도 액상-포켓의 모양은 그대로 유지되었다. 그리고 액상에 분산되어 있는 모든 결정립들이 액상-포켓과 같은 형태를 보였는데, 이것은 액상에 분산되어 있는 $YBa_2Cu_3O_x$ 결정립의 모양이 열역학적 평형 조건에 의해 결정됨을 의미한다. 그러나 $925^{\circ}C$, 질소 분위기에서 16시간 액상 소결한 경우에는 $YBa_2Cu_3O_x$ 결정립이 산소에서 액상소결한 것보다 c축이 다소 두터워진 직육면체 모양의 판상형태를 갖는 것이 관찰되었다. 이러한 결정립 형태(grain shape)의 차이는 tetragonal 결정구조의 $CuO_2$면 (a-b basal plane)에 존재하는 산소 공공의 농도가 열처리 분위기에 따라 차이가 있기 때문이며, 이로 인해 c축에 평행한 (결국 $CuO_2$면에 수직한 방향) 고상-액상 계면 에너지가 열처리 분위기에 따라 변하기 때문인 것으로 믿어진다. 그리고 산소와 질소 분위기에서 각각 액상 소결한 So와 $S_N$시편을 분위기를 바꾸어 재열처리하는 스위칭 실험을 하여, 분위기에 따른 결정립 형태의 변화를 명확하게 관찰할 수 있었다.

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