• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.341-341
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• 2011

초발수 표면은 자가세정, 부식방지, 방오특성의 특징을 가진다. 이러한 특성은 오염성이 높은 건물외장재 및 자동차유리, 태양전지 모듈유리, 디스플레이등 적용분야가 매우 다양하며, 코팅 방법으로 sol-gel, CVD, PVD등의 여러 가지 방법으로 많은 연구가 보고 되고 있다. 초발수 표면을 제작하는 대표적인 방법으로 PTFE와 같은 낮은 표면에너지를 가지는 물질을 증착하는 방법이 많이 사용되고 있으나, 초발수 표면에 가까운 접촉각을 구현하기에는 한계가 있다. 본 연구에서는 여러 가지 기판(Al, Cu, Sus, glass)에 추가적으로 표면 미세요철구조를 만들어 특성을 분석 하였다. 표면의 미세구조는 기판을 산에 Etching 하는 방법으로 Sample을 준비 하였다. 준비된 기판에 RF-Magnetron Sputtering 방법을 이용하여 PTFE를 증착하여 특성을 분석 하였다. 표면과 물방울이 이루는 각도를 알아보기 위해 Contact Angle을 측정한 결과 Glass와 Sus 기판을 제외한 Al과 Cu기판에서 약 150도에 이르는 초발수 특성을 보였으며, 이러한 표면형상을 관찰하기 위해서 SEM 측정을 해본 결과 표면의 미세요철구조가 확인 되었으며, AFM 측정결과 표면의 미세요철의 거칠기가 Etching공정을 통해 증가 된 것을 확인할 수 있었으며, Etching후 Al과 Cu는 수 nm ~ mm의 거칠기를 보였으며, 거칠기가 증가하여 접촉각의 향상에 기여 하였으리라 생각된다. XPS 측정결과 낮은 표면에너지를 가지는 CF2와 CF3 피크가 보이는 것으로 보아 표면에너지가 낮아져 접촉각이 높아졌으리라 사료 된다.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.4
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• pp.265-271
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• 2000

The microstructural change and transformation characteristics with cooling rate i.e. wheel speed were investigated in 82.8wt%Cu-12.8wt%Al-4.3wt%Ni SMA ribbons fabricated by melt-spinning. The thickness and width of ribbon were decreased with increasing wheel speed, while the uniformity of it was improved. At same wheel speed, the grain size of the contact surface of ribbon was smaller than that of free surface. The mean grain size was decreased with increasing wheel speed, resulted in obtaining grains with $3{\mu}m$ in mean diameter in the wheel speed of 30 m/s. However, micro-voids and cracks at grain boundary could be observed at higher wheel speed. $M_s$ and $A_s$ temperatures were decreased, and $M_s{\sim}M_f$ and $A_s{\sim}A_f$ temperature ranges were broadened with increasing wheel speed. All the ribbons were retained the ordered $D0_3$ due to rapid cooling, the volume fraction of it was increased with increasing wheel speed.

• Journal of Welding and Joining
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• v.17 no.3
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• pp.71-78
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• 1999

The welded metal bellows is commonly manufactured by welding pairs of washer-shaped discs of thin sheet metal stamped from strip stock in thickness from 0.025 to 0.254 mm. The discs, or diaphragms, are formed with mating circumferential corrugations. In this study, the diaphragms were welded by using a CW Nd: YAG laser to form metal bellows. The bellows was fixed on a jig and compressed axially, while Cu-rings were installed between belows edges for intimate contact of edges. The difference between the inner diameter of bellows and jig shaft causes an eccentricity, while the tolerance between motor shaft and jig shaft causes a wobble type motion. A vision sensor which is based on the optical triangulation was used for seam tracking. An image processing algorithm which can distinguish the image by bellows edge from that by Cu-ring was developed. The geometric relationship which describes the eccentricity and wobble type motion was modeled. The seam tracking using the image processing algorithm and the geometric modeling was performed successfully.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.193-200
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• 2007

Micro forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Al5083 superplastic alloy with very small grains has a great advantage in achieving micro deformation under low stress due to its relatively low strength at a specific high temperature range. Micro forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, the micro formability of Al5083 superplastic alloy and bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$, was investigated with the specially designed micro vibration forming system using pyramid-shape, V-shape and U-shape micro die pattern. With these dies, micro vibration forming was conducted by varying the applied load, time. Micro formability was estimated by comparing the hight of formed shape using non-contact surface profiler system. The vibration load effect to metal flow in the micro die and improve the micro formability of Al5083 superplastic alloy and $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG).

• Bulletin of the Korean Chemical Society
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• v.34 no.5
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• pp.1513-1520
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• 2013

Novel chitosan (CS) based membrane networks were developed by solution casting and followed by crosslinking with different crosslinkers such as glutaraldehyde, urea-formaldehyde, and thiourea-formaldehyde. The developed membrane networks were designated as CS-GA, CS-UF and CS-TF. Crosslinking reaction of CS membranes was confirmed by Fourier transform infrared spectroscopy. Membrane rigidity and compactness were studied by the differential scanning calorimetry. The surface morphology of CS membranes was characterized by scanning electron microscopy. The sorption behaviour with respect to contact time, initial pH and initial metal ion concentration were investigated. The maximum adsorption capacity of CS-GA, CS-UF and CS-TF sorbents was found to be 1.03, 1.2 and 1.18 mM/g for $Cu^{2+}$ and 1.48, 1.55 and 2.18 mM/g for $Ni^{2+}$ respectively. Swelling experiments have been performed on the membrane networks at $30^{\circ}C$. Desorption studies were performed in acid media and EDTA and it was found that the membranes are reusable for the metal ion removal for three cycles. The developed membranes could be successfully used for the separation of $Cu^{2+}$ and $Ni^{2+}$ metal ions from aqueous solutions.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.458-464
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• Korean Journal of Materials Research
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• v.15 no.1
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• pp.42-46
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.5
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• pp.458-461
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• 2004

In order to improve the adhesion properties of copper, MPS(3-mercaptopropyltrimethoxysilane) organic film were employed. The plasma pretreatment in pure He or $He/O_{2}$ mixed gas environment greatly increased adhesion force. Adhesion force was measured by scratch test with nano indenter. Microstructures and surface roughness were observed with scanning electron microscope(SEM). The characteristics of MPS layer for pretreatment were studied with flourier transform infrared spectroscope(FT-IR) and contact angle tester. The heighest adhesion was achieved in the specimen pretreated with mixed plasma and NPS coating, which was 56mN. Other specimen showed lower value by $20{\%}$ to $30{\%}$. The roughness of substrate was not affected by the bonding strength of copper plating.

• Journal of the Optical Society of Korea
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• v.19 no.3
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Korean Journal of Ecology and Environment
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• v.38 no.3 s.113
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• pp.334-340
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• 2005

The chemical forms of Cd, Cu, Pb, and Zn were analysed by sequential extraction technique to evaluate the effects of drying and heating of dredged sediments from Lake Chungcho. The most abundant fraction of Cd, Cu, and Zn in the wet and untreated sediment was organic/sulfidic fraction that is state in reducing environment such as the bottom condition of Lake Chungcho, while Pb dominated in residual fraction. This means that the source of Cd, Cu, and Zn in the Chungcho lake sediment is related to the organic degradation and Pb to the erosion from surrounding rocks. With drying and oxidation by dredging, heating treatment, and disposal of the lake sediment, the chemical forms of studied metals changed greatly from organic/sulfidic fraction to adsorbed and reducible fractions which are more labile in oxygenated environment. Organic/sulfidic fraction of Cd, Cu and Pb in the wet sediment was transformed with drying and heating treatments to the labile ones like adsorbed and reducible fraction, but Zn to carbonate and reducible fraction. Heating of the sediment at $320^{\circ}C$ greatly increased the labile fraction of Cd and Cu, while that at $105^{\circ}C$ for Pb and Zn. It is believed that the increase in labile forms of heavy metals in the sediments by drying and heating is caused by the contact with oxygen during drying and heating and by the increase of pH of the pore water at the expense of organic/sulfidic fraction. It is concluded that the drying and oxidation currently used in the treatment of dredged sediment can increase labile forms of heavy metals in the sediment, and the potential of the metal availability from the sediment.