• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.45-51
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• 2001

The effects of wettability and surface oxidation on the low temperature and ultra-fine solder bump formation have been studied. Difference sequences of near eutectic In-Ag and eutectic Bi-Sn solders were evaporated on Au/Cu/Cr or Au/Ni/Ti Under Bump Metallurgy (UBM) pads. Solder bumps were formed using lift-off method and were reflowed in Rapid Thermal Annealing (RTA) system. The solder bumps in which In was in contact with UBM in In-Ag solder and the solder bumps in which Sn was in contact with UBM in Bi-Sn solder showed better bump formability during reflow than other solder bumps. The ability to form spherical solder bumps was affected mainly by the wettability of solders to UBM pads.

• Proceedings of the KWS Conference
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• 1997.10a
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• pp.184-193
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• 1997

Aluminium and aluminium alloys have the high electrical and heat conductivity. It gives rise to difficulties for a choice of electrodes material for their contact electric welding. This paper describes the investigations performed to solve the above problem. The purpose of this investigation was to obtain dispersion-hardening alloys by the internal oxidation method, to optimize their contents and treatment modes, to produce electrodes of these alloys and to test them. The strengthing effect of alloys with oxide particles depends on their size stability at high temperatures. Despite of the fact, that oxides are the most stable of all the non-metallic phases their coagulation takes place. Based on the early results, we chose two types of alloys, first No. 1 Cu - 0,4%Al and second No. 2 Cu - 0,2%Be for production of electrodes. These alloys had not additional alloying elements. These alloys were prepared as 1 mm plates and flake-formed 200 m thick, and also No. 1 as a powder of size 100 mkm (received from Korea). The large samples for electrodes were produced by three methods : explosive welding method, dynamic one including the explosion compression of electrode blank and the quasi-dynamic method including the high-speed compression of dense briquest and the further hot extrusion of a rod.

• Tribology and Lubricants
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• v.11 no.5
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• pp.162-171
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• 1995

The application of reciprocating engine crankshaft bearings is of particular importance and interest among the plain bearing, not only because the sheer volume of intemal combustion engines now produced, but because the severe operating conditions they are subjected to. Demands for better performances of crankshaft bearings have provide an important impetus in the development of bearings and bearing materials. As engine design progresses toward higher outpt and higher efficiency, crankshaft bearings must perform under more seveve operating conditions. Higher load, temperature, and speed as well as lower viscosity oil are applied to the bearing sysem, resulting in a smaller minimum oil film thickness. This means more solid-solid contact between the shaft and bearing, and the bearing is exposed to more danger of seizure. Some engines may experience bearing seizure problems. However, understanding about the seizure behavior and mechanism is far from being enough. Seizure resistance of a bearing-shaft system will be affected by the properties of the shaft and bearing, especially their materials and surface texture. Commonly used engine bearing materials include Al-Pb-Si, Al-Sn-Si, Al-Sn, and Cu-Pb with Pb-Sn-Cu overlay. These materials have very different properties. They showed different behaviors dering seizure tests and seizure may occur with different mechanism for different bearing material. Shaft materials also affect the seizure resistance of the system. Surface texture of the bearing and shaft have apparent effects on the lubrication and solid-solid contact pattern, and therefore will affect the seizure behavior of the system. Bearings and shafts which are made of different materials and have different surface textures have been tested and analyzed. Their effects on seizure resistance are discussed and possible seizure mechanisms for different beatings are presented in this paper.

• Carbon letters
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• v.8 no.3
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• pp.199-206
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• 2007

The activated carbon produced from rubber wood sawdust by chemical activation using phosphoric acid have been utilized as an adsorbent for the removal of Cu(II) from aqueous solution in the concentration range 5-40 mg/l. Adsorption experiments were carried out in a batch process and various experimental parameters such as effect of contact time, initial copper ion concentration, carbon dosage, and pH on percentage removal have been studied. Adsorption results obtained for activated carbon from rubber wood sawdust were compared with the results of commercial activated carbon (CAC). The adsorption on activated carbon samples increased with contact time and attained maximum value at 3 h for CAC and 4 h for PAC. The adsorption results show that the copper uptake increased with increasing pH, the optimum efficiency being attained at pH 6. The precipitation of copper hydroxide occurred when pH of the adsorbate solution was greater than 6. The equilibrium data were fitted using Langmuir and Freundlich adsorption isotherm equation. The kinetics of sorption of the copper ion has been analyzed by two kinetic models, namely, the pseudo first order and pseudo second order kinetic model. The adsorption constants and rate constants for the models have been determined. The process follows pseudo second order kinetics and the results indicated that the Langmuir model gave a better fit to the experimental data than the Freundlich model. It was concluded that activated carbon produced using phosphoric acid has higher adsorption capacity when compared to CAC.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.8
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• pp.99-109
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• 2022

In this study, an electric resistance-heated surface friction spot-welding process was proposed and tested for the spot-welding ability of copper and aluminum dissimilar metal sheets using electric resistance heating and surface friction heating. This process has welding variables, such as the current value, energizing cycles, rotational speed, and friction time. The current value and energizing cycle can affect the resistance heat, and the rotational speed of the rotating pin and friction time influence frictional heat generation. Resistance heating before friction heating has a preheating effect on the Cu-Al contact interface and a positive effect on preventing friction heat loss during the friction stage. However, because resistance preheating can soften the copper sheet and affect the contact stress and friction coefficient, it has difficulties that may adversely affect frictional heat generation. Therefore, the optimal combination of welding variables should be determined through simulations and experiments of the spot-welding process to determine the effects of electric resistance preheating on the suggested process. Through this procedure, it is known that the proposed spot-welding process can improve the welding quality during the spot welding of Cu-Al sheets.

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.926-931
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• 1999

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

• Journal of the Korean Magnetics Society
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• v.14 no.1
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• pp.33-37
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• 2004

Cu$_{0.1}$Fe$_{0.9}$Cr$_2$S$_4$ has been studied with Mossbauer spectroscopy, x-ray diffraction, vibrating sample magnetometer (VSM), and magnetoresistance (MR) measurement. The crystal structure was determined to be a cubic spinel with lattice parameter a$_{0}$=9.9880 $\AA$. The MR measurements show a semiconductor behavior below 110 K and metal behaved above 100 K. The temperature dependence of magnetization of Cu$_{0.1}$Fe$_{0.9}$Cr$_2$S$_4$ was reported. In addition to a large irreversibility between the zero-field-cooling (ZFC) and the field-cooling (FC) magnetization at applied field H=100 Oe, a cusp-like anomaly was observed in both the FC and ZFC curves. It shifted toward the lower temperature region with increasing magnetic field, and then showed convex type maximum at 110 K, under the applied field of 5 kOe. The Mossbauer spectra were measured from 15 K to room temperature. The asymmetric line broadening was observed for the sample Cu$_{0.1}$Fe$_{0.9}$Cr$_2$S$_4$, and it was considered to be dynamic Jahn-Teller relaxation. The charge state of Fe ions was ferrous in character. The unusual reduction of magnetic hyperfine field below 110 K was interpreted in terms of cancellation effect between the mutually opposite orbital current field (H$_{L}$) and Fermi contact field (H$_{C}$).

• Journal of the Korean Vacuum Society
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• v.17 no.6
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• pp.518-522
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• 2008

The miniaturization of device size and multilevel interlayers have been developed by ULSI circuit devices. These submicron processes cause serious problems in conventional metallization due to the solubility of silicon and metal at the interface, such as an increasing contact resistance in the contact hole and interdiffusion between metal and silicon. Therefore it is necessary to implement a barrier layer between Si and metal. Thus, the size of multilevel interconnection of ULSI devices is critical metallization schemes, and it is necessary reduce the RC time delay for device speed performance. So it is tendency to study the Cu metallization for interconnect of semiconductor processes. However, at the submicron process the interaction between Si and Cu is so strong and detrimental to the electrical performance of Si even at temperatures below $200^{\circ}C$. Thus, we suggest the tungsten-carbon-nitrogen (W-C-N) thin film for Cu diffusion barrier characterized by nano scale indentation system. Nano-indentation system was proposed as an in-situ and nanometer-order local stress analysis technique.

• Fire Science and Engineering
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• v.18 no.4
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• pp.72-77
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• 2004

In this paper, we studied on the short-circuit process, surface structure, and component variation of vinyl cords. In the results of high speed imaging system (HSIS) analysis, as soon as wire covering was damaged by heat, the conductor of wire came in contact with the other conduct of wire, and the short-circuit occurred. Stereomicroscope and SEM analysis indicated that the source part of wire showed V-type form. The molten beads of load part were bigger than those of source part. In the results of EDX analysis, Cu and O were detected in the source part, whereas covering material (Cl, Ca), Cu and O were detected in the load part. The results will help us to find out the cause of electrical fire.

• Environmental Analysis Health and Toxicology
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• v.22 no.4
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• pp.339-348
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• 2007

A laboratory experiment was conducted to study the characteristics of leaching of Cr, Cu, and As from chromated topper arsenate (CCA)-treated wood. The wood species tested was hemlock spruce ($10\;cm\;{\times}\;10\;cm\;{\times}\;10\;cm\;tube$). The leaching experiment was conducted over 60 days using I L of leachants whose pHs were adjusted to 2.0, 3.7, and 1.6, respectively with nitric acid, and also using lake water, according to the OECD guideline. Each leachate was analyzed for Cr and Cu using flame-AAS, and for As using vapor generation-AAS. Three metals were loathed at the highest levels at pH 2.0 but almost at similar levels at the other conditions. Cumulative quantifies over 60 days of a leaching period were in order of As>Cu>Cr. As was predicted to leach with an increase in flux over a 10 year period, while Cr and Cu fluxes were predicted to decrease with time. This result suggest that arsenic can pose a health risk to humans over a long period of time, when CCA-treated wood is used for building facilities (e.g., playgrounds, residential purposes, etc.) with which humans frequently contact.