• Tribology and Lubricants
• /
• v.25 no.6
• /
• pp.404-408
• /
• 2009

In this paper, the relationship between the material removal rate and the interfacial mechanical properties at particle-surface contact situation, which can be seen in an abrasive machining process using micro/nano-sized particles, was discussed. Friction and stiffnesses were measured experimentally on an atomic force microscope (AFM) by using colloidal probes which have a silica colloid particle in place of tip to simulate a particle-flat surface contact in an abrasive machining process. From the experimental investigation and theoretical contact analysis, the interfacial contact properties such as lateral stiffness of contact, friction, the material removal rate were presented with respect to some of material surfaces and the relationship between the properties as well.

• Transactions of Materials Processing
• /
• v.22 no.3
• /
• pp.143-149
• /
• 2013

A new finite element model for the hydrostatic extrusion of a biaxial bar is introduced. In this model, a penalty contact algorithm, which is adopted to replace the traction boundary conditions due to the fluid in the container of the extruder, is incorporated into a consistent penalty finite element formulation for the viscoplastic deformation of a work piece during hydrostatic extrusion. Two parameters, introduced in the penalty contact algorithm in this study, a critical penalty contact pressure $P_0$ and a critical penalty contact distance $D_c$, are carefully examined for various process conditions. The proposed finite element model is applied to the hydrostatic extrusion of a Cu-clad Al bar. The extrusion loads and thickness ratios of the clad materials by the proposed model are compared in detail to values from experiments reported in the literature. Finally, it is concluded that the proposed finite element model is useful in practical implementations.

• Journal of Surface Science and Engineering
• /
• v.53 no.1
• /
• pp.29-35
• /
• 2020

In this study, five different specimen preparation methods were introduced and their advantages and disadvantages were presented. One of them, an epoxy mounting method has advantages of constant exposure area, ease of surface preparation without touching the specimen surface during polishing or cleaning, use of small amount of material and ease of specimen reuse by polishing or etching. However, in order to eliminate unexpected errors resulting from preferable reaction at the specimen/epoxy interface and contact resistance between the specimen and copper conducting line for electrical connection, it is recommended to cover the wall side of the specimen with porous anodic oxide films and to remain the contact resistance lower than 1 ohm. The increased contact resistance between the specimen and Cu conducting line appeared to result in increases of anodizing voltage and solution temperature during anodizing by which thickness and hardness of anodizing film on Al2024 alloy were drastically decreased and color of the films became more brightened.

• Journal of the Korean Society for Precision Engineering
• /
• v.18 no.7
• /
• pp.161-166
• /
• 2001

The prototype of a tactile sensor with $4\times 4$ taxels using PVDF was fabricated. The electrode patterns of the thin Cu tape are attached to the 28${\mu}{\textrm}{m}$ thickness PVDF using conductive adhesive and covering the sensor using polyester film for insulation. The structure of the sensor is flexible and the fabrication procedure is easy relatively. Also the output characteristics of the sensor was nearly linear with 8% deviation. The signals of a contact pressure to the tactile sensor are sensed and processed through A/D converter, DSP system and personal computer. The reasonable performance for the detection of contact shape and force distribution was verified through the experiment.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.608-613
• /
• 2007

Fine pitch microprobe arrays are microneedle-like probes for inspecting the pixel of LCD panel. They are usually made of multilayers of metallic, nonmetallic, or combination of the two. In this study, the microprobe arrays were fabricated using the process applied for MEMS fabrication technology and they consist of BeCu, BeNi, or Si. Their contacting probing force and deflection were measured using the laser equipment. The design requirement are 5gf of a minimum contact force and $150{\mu}m$ of a maximum deflection. A lot of microprobe shape are possible satisfying the requirement. A double cantilever-type microprobe having needles on both ends were applied for this study. Several candidate were chosen using the topology and shape optimization technique subjected to the design requirements. Finite element results and experimental results were compared and both gave good correlation.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.3
• /
• pp.25-30
• /
• 2015

SAC-coated Cu specimens were fabricated by novel pad finish process using a phenomenon that metal nanoparticles less than 20 nm in diameter melted at a temperature lower than the melting point of bulk metal, and their wettabilities were evaluated. The thickness of SAC305 layer coated at low temperature of $160^{\circ}C$ using SAC305 ink was extremely thin as the level of several nanometers. It was analyzed by Auger electron spectroscopy that $Cu_6Sn_5$ intermetallic layer with a thickness of 10~100 nm and $Cu_3Sn$ intermetallic layer with a thickness of 50~150 nm were sequentially formed under the SAC305 coating layer. The thickness of formed intermetallic layers was thicker in electroplated Cu than rolled Cu, which attributed to improved surface roughness in the electroplated Cu. The improved surface roughness induces the contact, melting, and reaction of a larger number of SAC305 nanoparticles per the unit area of Cu specimen. In the wetting angle test using SAC305 solder balls, the Cu coated with SAC305 through the low temperature process presented evidently low wetting angles than those in non-coated Cu, indicating that only a few nanometer-thick SAC305 coating layer on Cu could also cause the enhancement of wettability.

• Journal of the Korean Chemical Society
• /
• v.29 no.2
• /
• pp.137-143
• /
• 1985

Construction of a liquid membrane type of cupric ion selective electrode and its application to the potentiometric titration have been studied. A liquid ion-exchange membrance was prepared by extracting Cu(II) in aqueous solution into 1-(2-pyridylazo)-2-naphthol/nitrobenzene. A Ag/AgCl internal reference electrode was dipped into the aqueous reference solution of $1.00 {\times} 10^{-3}M\;Cu(NO_3)_2$ buffered with HAc-NaAc buffer solution, which was in contact with the nitrobenzene extract. The electrode showed the nernstian response to Cu(II) in the concentration range from $1.00{\times} 10^{-6}$ to $1.00{\times} 10^{-3}$M. The most suitable ion-exchanger concentration in the liquid membrane was $1.00{\times} 10^{-4}$M. The selectivity coefficients of the electrode for the various metal cations were investigated. The electrode was applied to the potentiometric titration of Cu(II) with EDTA.

• Journal of Electrochemical Science and Technology
• /
• v.6 no.3
• /
• pp.106-110
• /
• 2015

This study investigates Cu(II) complexes of cyclam, propylene cross-bridged cyclam (PCB-cyclam), and propylene cross-bridged cyclam diacetate (PCB-TE2A) as homogeneous electrocatalysts for CO₂ reduction in comparison with Ni(II)-cyclam. It is found that Cu(II)-cyclam can catalyze CO₂ reduction at the potential close to its thermodynamic value (0.75 V vs. Ag/AgCl) in tris-HCl buffer (pH 8.45) on a glassy carbon electrode. Cu(II)-cyclam, however, suffers from severe demetalation due to the insufficient stability of Cu(I)-cyclam. Cu(II)-PCB-cyclam and Cu(II)-PCB-TE2A are revealed to exhibit much less demetalation behavior, but poor CO₂ reduction activities as well. The inferior electrocatalytic ability of Cu(II)-PCB-cyclam is ascribed to its redox potential that is too high for CO₂ reduction, and that of Cu(II)-PCB-TE2A to the steric hindrance preventing facile contact with CO₂ molecules. This study suggests that in addition to the redox potential and chemical stability, the stereochemical aspect has to be considered in designing efficient electrocatalysts for CO₂ reduction.

• Applied Chemistry for Engineering
• /
• v.9 no.7
• /
• pp.956-960
• /
• 1998

Cu-Zn and Cu-Zn-Ti catalysts for the steam reforming of methanol were prepared. This reaction was carried out at atmospheric pressure, $250^{\circ}C$, steam/methanol molar ratio 1.5, and contact time 0.1 g-cat.hr/mL-feed. In case of the catalyst with 3 mol% of $TiO_2$, the activity was superior to that of catalysts without $TiO_2$. The reaction products were mainly hydrogen and carbon dioxide. It was found that catalytic activity was not related to specific surface area but affected by metallic copper area which was measured by $N_2O$ decomposition and increased with the addition of $TiO_2$ content. XPS and XRD showed that the oxidation state of zinc was not changed during reaction, but oxidation states of copper existed in Cu(0) or Cu(I).

• Korean Journal of Materials Research
• /
• v.9 no.2
• /
• pp.173-180
• /
• 1999

Thermally evaporated ZnTe films were investigated as a back contact material for CdS/CdTe solar cells. Two deposition methods, coevaporation and double-layer methods, were used for Cu doping in ZnTe films. ZnTe layers (0.2$\mu\textrm{m}$ thick) were deposited either on glass or on CdS/CdTe substrates without intentional heating of the substrates. Post-deposition annealing was performed at 200,300 and $400^{\circ}C$ for 3,6 and 9 minutes, respectively. Band gap of 2.2eV was measured for both undoped and doped films and a slight change in the shape of absorption spectra was observed in Cu-doped samples after annealing at $400^{\circ}C$. The resistivity of as-deposited ZnTe decreased from 10\ulcorner~10\ulcornerΩcm down to 10\ulcornerΩcm as Cu concentration increased from 0 to 14 at.%. There was not a noticeable change in less of annealing temperature up to $300^{\circ}C$ whereas films annealed at $400^{\circ}C$ revealed hexagonal (101) orientations as well. Some of Cu-doped ZnTe revealed x-ray diffraction (XRD) peaks related with Cu\ulcornerTe(x=1.75~2). Grain growth was observed from about 20nm in as-deposited films to 50nm after annealing at $400^{\circ}C$ by scanning electron microscopy (SEM). Cu distribution in ZnTe films was not uniform according to Auger electron spectroscopy (AES) measurements.