• 한국재료학회지
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• 제5권6호
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• pp.627-632
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• 1995

고출력 IC회로의 방열재료 및 전기접점재료로 이용되고 있는 W-Cu복합재료를 기계적합금화법으로 제조하였다. 기계적합금화한 분말을 300MPa로 폭 16mm, 높이 4mm의 원반형으로 제조하였다. 소결은 120$0^{\circ}C$에서 140$0^{\circ}C$까지 수소분위기에서 행하였다. 이렇게 제조된 시편의 절단된 면을 연마하여 SEM으로 관찰하였다. 균질한 W-Cu복합재료를 10시간 기계적합금화를 행한 후에 얻을 수 있었고, 133$0^{\circ}C$에서 1시간 소결한 시편의 경우 거의 99%에 가까운 치밀한 조직을 얻을 수 있었다. 또한 기계적합금화시간이 증가함에 따라서 Fe의 혼입은 직선적으로 증가하였으며, 이로 인한 금속간화합물상의 형성은 W입자 성장을 방해하고 경도를 증가시켰다.

• 한국분말재료학회지
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• 제13권1호
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• pp.57-61
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• 2006

The present work illustrates the use of water-soluble cupric salts as ingredients of binder for injection molding of $W-10 wt\%$ Cu. Parts produced are dense, homogeneous and have good surface finish, compared to those produced using conventional binder system. This new binder system provides also process-simplification benefit. $CuCl_2\;and\;Cu(NO_3)_2$ with the purity of $98\%$ was selected for this study. Rapid sintering process involving thermal decomposing was successful in densification for 1h. Final density that is about $93\%$ of theoretical value could be obtained, and are distinguishable from conventionally processed W-Cu composites.

• 한국전기전자재료학회논문지
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• 제31권2호
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• pp.90-93
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• 2018

This aim of this study was to develop a process for creating bulk single-crystal YBaCuO superconductors in a high magnetic field. To support the bulk unidirectional growth of $YBa_2Cu_3O_{7-y}$, $SmBa_2Cu_3O_{7-y}$ seeds were planted inside YBaCuO composites and samples were produced by melting, enabling the growth of two YBaCuO superconductors. Due to the magnetism generated inside the superconductor of the upper sample, the magnetization inside the superconducting single crystals was evenly distributed, the sharpness of the induced magnetic force was improved, and the superconducting magnetization were significantly improved. This approach is widely applicable for the production of superconducting wires and current leads used for DC power breakers.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.119-122
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• 2006

In this study, bottom-up type powder processing and top-down type SPD (severe plastic deformation) approaches were combined in order to achieve full density of 1 vol.% carbon nanotube (CNT)-metal matrix composites with superior mechanical properties by improved particle bonding and least grain growth, which were considered as a bottle neck of the bottom-up method using the conventional powder metallurgy of compaction and sintering. ECAP (equal channel angular pressing), the most promising method in SPD, was used for the CNT-Cu powder consolidation. The powder ECAP processing with 1, 2, 4 and 8 route C passes was conducted at room temperature. It was found by mechanical testing of the consolidated 1 vol.% CNT-Cu that high mechanical strength could be achieved effectively as a result of the Cu matrix strengthening and improved particle bonding during ECAP. The ECAP processing of powders is a viable method to achieve fully density CNT-Cu nanocomposites.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.50-53
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• 2003

Carbon nannofiber reinforced Cu matrix composite has potential applications for electrically conducting materials having high strength and electrical conductivity. In this study, we have developed fabrication technology of the nanocomposites using a liquid pressing process. The process is to use the low pressure for infiltration of Cu melt into carbon nanofiber mat as the Cu melt is pressurized directly. The minimum pressure required for infiltration was calculated from force balance equation, permeability measurement and compaction behavior of carbon nanofiber. Also, the melting temperature and the holding time have been optimized.

• 한국주조공학회지
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• 제10권5호
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• pp.426-434
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• 1990

Continuous casting of the Al-Cu-Ni ternary eutectic alloys was carried out by the upward continuous casting process. The morphology of the ternary eutectic growth and the stability of solid-liquid interface were investigated under various growth conditions. It was possible to get the planar solid-liquid interface at the condition of $G_L/R＝3.59{\times}10^3^{\circ}C\;sec/mm^2$ in Al-Cu-Ni ternary eutectic alloys. In Al-rich, Ni-rich and Cu-rich hypereutectics of Al-Cu-Ni ternary alloys, primary ${\alpha},\;{\tau}\;and\;{\theta}$ dendrites have grown as the leading phase ahead of the ternary eutectic composites.

• 열처리공학회지
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• 제17권5호
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• pp.293-298
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• 2004

For the application of heat sink device, the green sheets of powder of W-XCu and Mo-XCu composites were fabricated by tape casting technique. The mixing ratio of powder and binder was 6:4. The green sheet was shrinked up to 10~20% after sintering and the maximum relative density was above 95%. Thermal conductivity and Thermal expansion systematically increased with increasing Cu contents. The maximum thermal conductivity of W-20wt.%Cu was about 206[W/mK].

• 한국재료학회지
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• 제12권8호
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• pp.656-660
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• 2002

It was investigated that $Al_2$$O_3$/Cu nanocomposite powder could be optimally prepared by dispersion and reduction of Cu oxide, and suitably consolidated by employing pulse electric current sintering (PECS) process. $\alpha$-$Al_2$$O_3$ and CuO powders were used as elemental powders. In order to obtain $Al_2$O$_3$ embedded by finely and homogeneously dispersed CuO particles, the elemental powders were high energy ball milled at the rotating speed of 900 rpm, with the milling time varying up to 10 h. The milled powders were heat treated at $350^{\circ}C$ in H$_2$ atmosphere for 30 min to reduce CuO into Cu. The reduced powders were subsequently sintered by employing PECS process. The composites sintered at $1250^{\circ}C$ for 5 min showed the relative density of above 98%. The fracture toughness of the $Al_2$$O_3$/Cu nanocomposite was as high as 4.9MPa.$m^{1}$2//, being 1.3 times the value of pure $Al_2$$O_3$ sintered under the same condition.

• 전기학회논문지
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• 제66권11호
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• pp.1600-1604
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• 2017

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.

• 한국주조공학회지
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• 제17권5호
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• pp.480-487
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• 1997

Particle reinforced metal matrix composites(MMCs) via a centrifugal spray-cast deposition(CSD) process were fabricated by injecting second phase particles($Al_2O_3$<40${\mu}m$, W<17.3${\mu}m$) into copper melt on the atomizing disc. Compositing modes were investigated by combining microstructures and mathematical modeling between Cu droplets and the reinforced particles injected. The $Cu/W_P$ powders were shown that the W particles penetrate and get embedded in the Cu droplets. It is considered that the W particles composite preferentially in Cu melt on the atomizing disc. On the other hand, the $Al_2O_3$, particles did not penetrate into the Cu droplets on the atomizing disc but get attached in surface of Cu droplets during the flight. It is considered that the compositing may be attained in the flight distance which the relative velocity between Cu droplet and $Al_2O_3$, particle is maximum. The microstructure of the $Cu/W_P$ and the $Cu/(Al_2O_3)_p$ composite preform was strongly influenced by compositing modes of droplets, and after subsequent deposition it was comprised as it is called the dispersed type and the cell type of microstructure, respectively.