• Journal of Powder Materials
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• v.29 no.3
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• pp.233-239
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• 2022

Aluminum alloys are extensively employed in several industries, such as automobile, aerospace, and architecture, owing to their high specific strength and electrical and thermal conductivities. However, to meet the rising industrial demands, aluminum alloys must be designed with both excellent mechanical and thermal properties. Computer-aided alloy design is emerging as a technique for developing novel alloys to overcome these trade-off properties. Thus, the development of a new experimental method for designing alloys with high-throughput confirmation is gaining focus. A new approach that rapidly manufactures aluminum alloys with different compositions is required in the alloy design process. This study proposes a combined approach to rapidly investigate the relationship between the microstructure and properties of aluminum alloys using a direct energy deposition system with a dual-nozzle metal 3D printing process. Two types of aluminum alloy powders (Al-4.99Si-1.05Cu-0.47Mg and Al-7Mg) are employed for the 3D printing-based combined method. Nine types of Al-Si-Cu-Mg alloys are manufactured using the combined method, and the relationship between their microstructures and properties is examined.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.598-603
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• 2005

To develope new lead-free solders with the melting temperature close to that of Sn-37Pb$(183^{\circ}C)$, Sn-0.7Cu-5Pb-1Ga, Sn-0.7Cu-5Pb-1Ag, Sn-0.7Cu-5Pb-5Bi-1Ag, and Sn-0.7Cu-SBi-1Ag alloys were composed by adding low-netting elements such as Ga, Bi, Pb, and Ag to Sn-0.7Cu. Then the melting temperatures, microstructures, wettability, and adhesion properties of these alloys were evaluated. DSC analysis showed that the melting temperature of Sn-0.7Cu-SPb-1Ga was $211^{\circ}C$, and those of other alloys was in the range of $192\~200^{\circ}C$. Microstructures of these alloys after heat-treatment at $150^{\circ}C$ for 24 hrs were basically composed of coarsely- grown $\beta-Sn$ grains, and $Cu_6Sn_5$ and $Ag_3Sn$ intermetallic precipitates. Sn-0.7Cu-5Pb-1Ga and Sn-0.7Cu-5Pb-5Bi-1Ag showed excellent wettability, while Sn-0.7Cu-5Bi-1Ag and Sn-0.7Cu-5Pb-5Bi-1Ag revealed good adhesion strength with the Cu substrates. Among 4 alloys, Sn-0.7Cu-5Pb-5Bi-1Ag with the lowest melting temperature $(192^{\circ}C)$ and relatively excellent wettability and adhesion strength was suggested to be the best candidate solder to replace Sn-37Pb.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.106-114
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• 1992

Abstract-Quantitative surface analysis of Co-Ni and Au-Cu alloys by XPS and SIMS was studied. For Co-Ni alloy, quantitative XPS analysis could be done within 1-2% relative error with pure element standards without any correction. For Au-Cu, quantitative XPS analysis was not possible without any correction. But it could be done with standard alloys of various composition within 1-2% relative error. Without standard alloys, Au-Cu alloys could be analyzed by XPS within 10% relative error with pure element standards. For SIMS analysis of Co-Ni alloys, the relative secondary ion yields of Co+/Nit has linear relation with ratio of each composition so that quantitative SIMS analysis was possible for Co-Ni alloys. Preliminary results of XPS round robin test of VAMAS-SCA Japan Project are given.

• Journal of Korea Foundry Society
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• v.10 no.5
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• pp.426-434
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• 1990

Continuous casting of the Al-Cu-Ni ternary eutectic alloys was carried out by the upward continuous casting process. The morphology of the ternary eutectic growth and the stability of solid-liquid interface were investigated under various growth conditions. It was possible to get the planar solid-liquid interface at the condition of $G_L/R＝3.59{\times}10^3^{\circ}C\;sec/mm^2$ in Al-Cu-Ni ternary eutectic alloys. In Al-rich, Ni-rich and Cu-rich hypereutectics of Al-Cu-Ni ternary alloys, primary ${\alpha},\;{\tau}\;and\;{\theta}$ dendrites have grown as the leading phase ahead of the ternary eutectic composites.

• Journal of the Korean Society for Heat Treatment
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• v.16 no.5
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• pp.267-274
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• 2003

The effect of the thermo-mechanical treatment on the microstructural development and the electric conductivity of Cu-Ca alloys are studied for the thixoforming processed rotor of the induction motor The Cu-Ca alloys containing Ca less than 1.0wt% show the electrical conductivity higher than 80% IACS They also show broad melting range over $150^{\circ}C$ which is desirable for the thixoforming process The semi-solid microstructure of cast alloy changes from the dendrite structure to globular structure by prior deformation before reheating. The details of microstructural changes by the thermo-mechanical treatment are discussed.

• Journal of Magnetics
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• v.15 no.1
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• pp.32-35
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• 2010

The effects of Cu-addition and die-upset temperature on the texture in the die-upset Nd-lean $Nd_xFe_{93.5-(x+y)}-Cu_yGa_{0.5}B_6$ (x = 9-12, y = 0-2) alloys were investigated. The die-upset Cu-containing Nd-lean $Nd_{12}Fe_{81.5-y}-Cu_yGa_{0.5}B_6$ (y = 1, 2) alloys showed a considerable texture. Texture in the Nd-lean alloys developed through basal plane slip deformation. The Cu-addition reduced the melting point of grain boundary phase facilitating grain gliding during the die-upsetting, and providing a greater chance for the $Nd_2Fe_{14}B$ grains to meet the deformation conditions. Die-upsetting at higher temperature facilitated grain gliding and plastic deformation, thus enhancing texture.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.93-98
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• 2005

The purpose of this study is to investigate the characteristics of pb-free $Zn-(3\~6)\%Al-(1\~6)\%Cu$ solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. $Zn-4\%Al-(1\~3)\%Cu,\;Zn-5\%Al-(2\~4)\%Cu\;and\;Zn-6\%Al-(3\~5)\%Cu$ alloys satisfied the optimum melting range of 643 to 673k for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing hi content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic $\varepsilon$ phase(Zn-Cu), dendritic $\eta$ phase(Zn-Cu-Al), $\alpha(Al-Zn)-\eta$ eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased f phases. Also, the addition of Cu increased slightly the volume fraction of e, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but anelongation was linearly decreased.

• Journal of Korea Foundry Society
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• v.34 no.4
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• pp.130-135
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• 2014

Efforts have been made to develop new silicon-free aluminum casting alloys that possess high electrical and thermal conductivity. In this research Al-Fe-Cu-Mg alloys with various Cu and Mg contents were investigated for their various properties. As the Cu or Mg content was increased, the electrical conductivity gradually decreased, while the tensile strength of the Al-Fe-Cu-Mg alloy tended to be improved. It was found that fluidity was generally inversely proportional to the Cu content, but the alloys containing 1%Mg showed considerably low fluidity, regardless of the Cu content.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.21 no.1
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• pp.1-8
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• 2023

The major concern in the deep geological disposal of spent nuclear fuels include sulfide-induced corrosion and stress corrosion cracking of copper canisters. Sulfur diffusion into copper canisters may induce copper embrittlement by causing Cu₂S particle formation along grain boundaries; these sulfide particles can act as crack initiation sites and eventually cause embrittlement. To prevent the formation of Cu₂S along grain boundaries and sulfur-induced copper embrittlement, copper alloys are designed in this study. Alloying elements that can act as chemical anchors to suppress sulfur diffusion and the formation of Cu₂S along grain boundaries are investigated based on the understanding of the microscopic mechanism of sulfur diffusion and Cu₂S precipitation along grain boundaries. Copper alloy ingots are experimentally manufactured to validate the alloying elements. Microstructural analysis using scanning electron microscopy with energy dispersive spectroscopy demonstrates that Cu₂S particles are not formed at grain boundaries but randomly distributed within grains in all the vacuum arc-melted Cu alloys (Cu-Si, Cu-Ag, and Cu-Zr). Further studies will be conducted to evaluate the mechanical and corrosion properties of the developed Cu alloys.

• Journal of Korea Foundry Society
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• v.30 no.6
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• pp.205-209
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• 2010

This study evaluates the influence of strontium addition and holding time on mechanical properties for Al-10.5wt%Si-2wt%Cu secondary die-casting alloy and the measured electrical conductivity of modified alloys. A general improvement in the mechanical properties of the alloy was observed after adding the strontium. Ultimate tensile strength, elongation and electrical conductivity of modified alloys were improved by increasing strontium content and holding time. From these results, the optimal strontium content and holding time were identified on the mechanical properties of Al-10.5wt%Si-2wt%Cu secondary die-casting alloys.