• 한국재료학회지
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• 제19권7호
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• pp.349-355
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• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

• 대한금속재료학회지
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• 제48권10호
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• pp.951-956
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• 2010

This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded $20mA/cm^2$ was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a $Cu^{2+}:H_2SO_4$ ratio of 50:100 g/l.

• 한국전기전자재료학회논문지
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• 제29권8호
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• pp.489-493
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• 2016

In this study, the effect of vanadium oxide ($V_2O_5$) content and pre-sintering atmosphere on sealing property of glass frit that consisted of $V_2O_5-BaO-ZnO-P_2O_5-TeO_2-CuO-Fe_2O_3-SeO_2$ was investigated by XPS (X-ray photoelectron spectroscopy). The content of V2O5 was changed to 15, 30, and 45 mol%, and the pre-sintering was carried out in air and $N_2$ condition, respectively. XPS analysis conducted before and after laser irradiation with identical sample. Before laser treatment, glass frits that were pre-sintered at air condition showed both $V^{4+}$ and $V^{5+}$, but the valence state was changed to $V^{5+}$ after laser irradiation when the glass frits contained 30 and 45 mol% $V_2O_5$; this change led to non-adhesive property. On the other hand, glass frits that were pre-sintered at $N_2$ condition exhibited only $V^{4+}$ and it showed fine adhesion irrespective of the $V_2O_5$ content. As a result, the existence of $V^{4+}$ seems to be a major factor for controlling the adhesive property of glass frit for laser sealing.

• 헤리티지:역사와 과학
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• 제53권2호
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• pp.242-253
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• 2020

나주 복암리 정촌 고분 1호 석실에서 화살통 장식 6점이 출토되었다. 유기물로 만들어진 화살통은 매장 상태에서 부식되어 없어지고 금속으로 만들어진 화살통 장식물만 남게 된다. 정촌 고분 화살통 장식은 형태적으로 2점씩 쌍을 이루며, 출토 위치에 따라 화살통 2점을 장식한 것으로 추정된다. 화살통 장식은 화살의 방입부(方立部)를 꾸며주는 대륜상금구와 방입부와 허리띠를 연결하는 배판(背板)을 장식하는 판상금구로 나누어진다. 1호 석실 목관2에서 출토된 화살통 장식은 대륜상금구만 확인되었으며 1호 석실 동남쪽에서 확인된 화살통 장식은 허리띠에 사용된 추정 대구, 판상금구, 대륜상금구가 확인되었다. 화살통 장식의 분석 결과, 철제 판에 금동 판을 접합한 철지금동장식제(鐵地金銅裝飾製)이며 표면을 정(釘)으로 점을 찍어 선과 문양을 만든 것을 알 수 있다. 성분 분석 결과(XRF), 금동 표면은 24~40wt% Au, 50~93wt% Cu가 검출되어 금도금 표면에 청동 부식물이 형성되었음을 확인하였다. 금도금 층의 SEM-EDS 분석 결과 광택을 내기 위한 작업선이 확인되었다. 또한 7~9wt% Hg가 검출되고 도금 층에 아말감 덩어리가 확인되어 아말감 도금한 것을 알 수 있었다. CT와 FT-IR 분석 결과 대륜상금구는 철제 판 아래 견직물이 2중으로 겹쳐 있으며 그 아래 옻칠편도 붙어 있었다. 이는 대륜상금구를 방입부에 부착할 때 직물을 덧대어 밀착력과 장식성을 높였으며, 옻칠 된 방입부 표면이 함께 떨어진 것으로 추정된다. 반면, 판상금구는 철제 판 아래 유기물이 두껍게 붙어 있다. 재질을 확정하기 어려우나 배판의 잔재로 보인다. 이러한 나주 정촌 고분 출토 화살통 장식의 특징은 4세기 후반~5세기 후반의 백제, 신라, 가야 문화권과 유사한 형식을 보여주며 당시 수준 높은 고대 금속 공예 제작 기술을 확인할 수 있었다.