• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1193-1196
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• 2009

Low resistivity interconnection and high-mobility channel are required to realize ultrahigh-definition LCDs such as 4k ${\times}$ 2k TVs. We evaluated fully Cu-based gate and Source/Drain interconnections, consisting of stacked pure-Cu/Cu-Mn layers for TFT-LCDs, and found the underlying Cu-Mn alloy film has superior adhesion to glass substrates and CVD-SiOx films. It was also confirmed that wet etching of the Cu/Cu-Mn films without residues and low contact resistance with both channel IGZO and pixel ITO films can be obtained. It is thus considered that the stacked Cu/Cu-Mn structure is one of candidates to replacing conventionally pure-Cu/refractory metal.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.48-48
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• 2005

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.114-115
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• 2003

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.58-58
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• 2003

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.138.2-138
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• 1998

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.37-43
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• 2001

Polyvinylidenefluoride and Polytetrafluoroethylene have been irradiated by 1 keV Ar+ ion beam in an $O_2$ environment. Hydrophilic functional groups (such as -(C-O)-,-(C=O)-,-(C=O)-O- and so on) were formed on fluoropolymers. Contact angles of water to PVDF were reduced from $75^{\circ}$ to $31^{\circ}$. Re-increase of contact angle was originated from carbonization phase in case of high dose irradiation above $1{\times}10^{16} Ar^+cm^2$. Contact angles to PTFE decreased at low dose irradiation and were exaggerated to about $140^{\circ}$ due to cone type surface at high dose irradiation. Hydrophilic functional groups have played an important role on adhesion between metal and fluoropolymers by acid-base interaction and chemical bond formation. Adhesion of Pt/PVDF was enhanced by acid-base interaction because Pt is inert metal. Chemical bond formation between Cu and PTFE could enlarge the adhesion strength of Cu/PTFE.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.1
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• pp.23-28
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• 2010

The cylindrical magnetron sputtering has not been widely used, although this system is useful for only certain types of applications such as fiber coatings. This paper presents electrode configurations which improved the complicacy of the target assembly by using the positive voltage power supply. It is a modified type which has a target constructed with a large cylindrical part, a conical part and a small cylindrical part. When positive voltage was applied to an anode, a stable glow discharge was established and a high deposition rate was obtained. The substrate bias current was monitored to estimate the effect of ion bombardment. As a result, it was found that the substrate current was large. With cylindrical and conical cathode magnetron sputter deposition on the surface of the substrate to prevent re-sputtering, ion impact because it can increase the effectiveness with excellent ductility and adhesion of Ti film deposition can be obtained. We board at the front end of the ground resistance of $5\;k{\Omega}$ attached to the substrate potential can be controlled easily, and Ti film deposition with excellent adhesion can be obtained. Microstructure and morphology of Ti films deposited on pure Cu wires were investigated by scanning electron microscopy in relation to preparation conditions. High level ion bombardment was found to be effective in obtaining a good adhesion for Cu wire coatings.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.109-114
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• 2021

We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effective in terms of reduction and surface roughness. The interfacial adhesion energy was measured by DCB test and it was observed to decrease as the bonding temperature decreased, resulting in bonding failure at bonding temperature of 200℃. In case of wet treatment, strong Cu-Cu bonding was observed above bonding temperature of 250℃.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.47-47
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• 2004

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.55-58
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• 1996

A new type CuN/Cu/CuN thin film electrode material with high adhesion to glass was developed by the dc reactive planar magnetron sputtering system for the PDP(Plasma Display Panel). The adhesive force of the CuxN thin film was in the range of 20∼40(N) under the conditions of the N$_2$ partial pressure of 15%, discharge current of 70mA, discharge voltage of 450v and substrate bias voltage of -100V. The adhesive force was depended on the N$_2$ partial Pressure, discharge current and substrate bias voltage.