• Resources Recycling
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• v.12 no.1
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• pp.18-24
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• 2003

Reusing of electroless Ni-Cu-B waste solution was investigated in the plating time, plating rate, solution composition and deposit. Plating time of nickel-catalytic surface took longer than that of zincated-catalytic surface. Initial solution with 40% waste solution additive at batch type was possible to reusing of waste solution. Plating time of initial solution at continuous type took longer 6 times over than that of batch type. Plating time of 40% waste solution additive at continuous type took longer 2 times over than that of batch type. Component change of nickel-copper for electroless deposition was greatly affected by deposited inferiority and larger decreased plating rate.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.8
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• pp.1771-1776
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• 2011

In this paper, as an attempt to improve the preparation conditions of $YBa_2Cu_3Ox$ superconducting bulk samples, the properties of $YBa_2Cu_3Ox$ superconductor depending on the particle size of YBCO powder and $BaPbO_3$ as an additive have been investigated, and a study on the effects of additive to the density, grain alignment, and porosity of samples that affect the critical current of superconductor has been performed. In order to prepare superconductor, $YBa_2Cu_3Ox$ powder synthesized by sol-gel method, showing a size distribution of 0.2~1 ${\mu}m$ was used. The $BaPbO_3$ added to promote grain growth and to decrease porosities and weak links between grain boundaries of $YBa_2Cu_3Ox$ superconductors. In the samples prepared by sol-gel synthesized powder with 10, 20, and 30 wt% conductive $BaPbO_3$ additives, the sample with 20 wt% $BaPbO_3$ obtained the highest critical current of 4.74 A, showing 20 wt% higher critical current than that with solid state synthesized powder.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• Journal of the Korean Ceramic Society
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• v.39 no.12
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• pp.1119-1123
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• 2002

Nanostructured spinel NiZn ferrites were prepared by the sol-gel method from metal nitrate raw materials. Analyses by X-ray diffraction and scanning electron microscopy showed the average particle size of NiZn ferrite was under 50 nm. The single phase of NiZn ferrites was obtained by firing at 250${\circ}C$, resulting in nanoparticles exhibiting normal ferrimagnetic behavior. The nanostructured $Ni_{1-X}Zn_XFe_2O_4$ (x=0.0∼1.0) were found to have the cubic spinel structure of which the lattice constants ${\alpha}_2$ increases linearly from 8.339 to 8.427 ${\AA}$ with increasing Zn content x, following Vegard's law, approximately. The saturation magnetization $M_s$ was 48 emu/g for x=0.4 and decreased to 8.0 emu/g for higher Zn contents suggesting the typical ferrimagnetism in mixed spinel ferrites. Pure NiZn ferrite phase substituted by Cu was observed before using the additive but hematite phase was partially appeared at $Ni_{0.2}Zn_{0.2}Cu_{0.6}Fe_2O_4$. On the other hand, the hematite phase in this NiZn Cu ferrite was disappeared after using the additive of acethyl aceton with small amount. The saturation magnetization Ms of $Ni_{0.2}Zn_{0.8-y}Cu_yFe_2O_4$(y=0.2∼0.6) as measured was about 51 emu/g at 77K and 19 emu/g at room temperature, respectively.

• Journal of Powder Materials
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• v.20 no.3
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• pp.203-209
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• 2013

In this study, STS 316L powders with 3 wt.% Cu and 1 wt.% Sn known as corrosion-resistance reinforcement elements, are prepared to make different kinds of specimens, in which, 3 wt.% Cu and 1 wt.% Sn are added in different forms by mixing, alloying and fully alloying. After sintering in the same condition, the corrosion resistance, wear resistance and their mechanical properties of specimens are tested respectively. According to the comparison, STS 316L specimen sintered at $1270^{\circ}C$ showed the most excellent mechanical property: HRB 78 (hardness), 1130.7 MPa (RCS), 26.6% (Fraction Wear), It was similar with the specimen made of STS316L and fully alloyed Cu and Sn powders, meanwhile, the latter one appears the best corrosion resistance, 75hrs-salt immersion test results. In addition, the specimens with Cu and Sn powders additive showed relatively worse wear resistance in compared with STS316L specimen.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.274-278
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• 2002

The purpose of this study was to characterize the reaction of Cu surface with Cu slurry and CMP performance as a function of additives in CMP slurry. The polish rate of Cu was dependent on the kind of organic acids added in slurry. It was considered that polish rate of Cu was dependent on the concentration of carboxylates and mean particle size. When the etchant and oxidant were added in slurry, the highest removal rate and lower etch rate were measured at neutral pH. The addition of etchant, oxidant and pH adjustor played key roles of CMP ability in slurry. As the pH increased, polish rate of Cu was increased by the enhanced the mechanical effects due to effective dispersion of slurry particles. Alumina abrasives was more desirable for 1st step slurry because of high removal rate of Cu and high selectivity ratio among TaN and Cu.

• Journal of the Korean Ceramic Society
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• v.35 no.10
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• pp.1014-1019
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• 1998

As results of the study on the sinterbility of YIG at the low temperature using CuO as additive CuO com-pound which contain {{{{ { {Fe }_{2 }O }_{3 } }} was shown liquid in sintering process. YIG crystal dissolved into CuO compound liquid phase and then Y element which is considered no solubility in solid CuO compound moved to the grain during cooling. The abnormal grain growth up to 150${\mu}{\textrm}{m}$ at CuO 8.6mole% was shown due to shape accomdation reaction and local liquid distribution. The apparent density of YIG shows minimum at CuO 8.6 mole% due to abnormal grain growth and the saturation magnetization decrease dramatically at 32.5mole% due to orthoferrite formation.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.64-72
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• 2023

In this study, after transferring graphene on a Cu substrate and printing a Sn-3.0Ag-0.5Cu Pb-free solder paste on the Cu substrate, effects of the transferred graphene on formations and growths of intermetallic compound (IMC) at the interface between the Cu substrate and the solder were reported during processes of reflow soldering and isothermal aging for 1000 h with various temperatures (125, 150, and 175 ℃). Thicknesses of Cu₆Sn₅ and Cu₃Sn IMCs at the interfaces with graphene were decreased during the reflow soldering and isothermal aging processes compared to those without graphene. The transferred graphene layers also showed that the growth rate constant and square of growth rate constant which related to the growth mechanisms of Cu₆Sn₅ and Cu₃Sn IMCs with t he t emperature a nd t ime of t he i sothermal aging c ould dramatically decreased.

• Journal of the Korean Ceramic Society
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• v.40 no.5
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• pp.447-454
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• 2003

Samples were prepared by the solid-state reaction method. The nominal composition of the samples was B $i_{1.84}$P $b_{0.34}$S $r_{1.91}$C $a_{2.03}$C $u_{3.06}$ $O_{10+{delta}$ prepared from powder of B $i_2$ $O_3$, PbO, SrC $O_3$, CaC $O_3$, and CuO. They were pulverized, mixed with AgO, A $u_2$ $O_3$and MgO of 50 wt%. Finally, they were sintered at 820 to 85$0^{\circ}C$ in air. The structural characteristics, the microstructure of surface and the critical temperature with respect to the each samples were analyzed by XRD, $T_{c}$, SEM and EDS respectively. It was found that the the critical temperature of the silver oxide additive samples (99.58 K) is higher than those of gold or magnesium oxides additive samples, but all those values are lower than that of pure Bi-2223 phase. The microstructure of surface showed the tendency which the AgO additive samples become more minuteness than A $u_2$ $O_3$ and MgO additive samples.s.samples.s.

• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.4032-4038
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• 2023

Cu, which exhibits excellent corrosion resistance in underground environments, has been investigated as a canister material for use in the deep geological disposal of spent nuclear fuels. In this study, the technical viability of atmospheric plasma spraying for producing Cu-coated canisters was investigated. A high-purity Cu film (millimeter scale) was deposited onto a stainless-steel substrate using a plasma gun with a shroud structure. Potentiodynamic polarization studies revealed that the Cu film exhibited a sufficiently low corrosion rate in the groundwater electrolyte. In addition, no pitting corrosion was observed on the Cu film surface after accelerated corrosion studies. A prototype cylindrical Cu film was fabricated on a 1/20 scale on a stainless-steel tube to demonstrate the scalability of atmospheric plasma spraying in producing Cu-coated canisters.