• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.5
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• pp.204-210
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• 2005

Alternating current (AC) losses of two Bi-2223 ([Bi, Pb]: Sr: Ca: Cu: O = 2:2:2:3) tapes [(Tape I, un-twist-pitch) and the other with a twist-pitch of 10 mm (Tape II)] were measured and compared. These samples, produced by the powder-in-(Ag) tube (PIT) method, are multi-filamentary. Also, it's produced by non-twist and different twist pitch (8, 10, 13, 30, 50 and 70 mm). The critical current measurement was carried out under the environment in liquid Nitrogen and in zero-field by 4-probe method. Susceptibility measurements were conducted while cooling in a magnetic field. Flux loss measurements were conducted as a function of ramping rate, frequency and field direction. The AC flux loss increases as the twist-pitch of the tapes decreased, in agreement with the Norris Equation. Neutron-diffraction measurements have been carried out investigate the crystal structure, magnetic structures, and magnetic phase transitions in Bi-2223([Bi, Pb]:Sr:Ca:Cu:O)

• 보존과학연구
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• s.14
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• pp.45-76
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• 1993

Au-Cu alloyed coating layer were found by Hg-amalgam process and it seemed to be used Cu-amalgam process similar to Au-amalgam. Coated layer is dense and unique, Thickness of layer was 1.5 to $18.0\mum$ which had 95.3 to 99.8% purity of gold Matrix metal mostly cosists of forged copper alloy which had high purity and ferrite ($\alpha$) strusture. It showed excellent refining technical level at that time. Aowever, the nail, ferrous matrix used for strength needed, composed of silver foil packed and gold layer for adherence between ferrous matrix and gold layer

• Journal of Surface Science and Engineering
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• v.31 no.2
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• pp.73-80
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• 1998

The aim of this study is to develop sintered stainless steels (SSS) with good mechanical strength, wear resistance, and corrosion resistance by nitrogen ion implantation on the Culated SSS surface. Stainless steel compacts containg Cu (2-10 wt%) were prepared by electroless Cu-pating method which results in the increased3 homogenization in alloying powder. Nitrogen ion implantation was carried out by using N2 gas as the ion source. Nitrogen ions were embedded by an acceleratol of 130keV with doese $3.0\times10^{17}\;ions/\textrm{cm}^2$ on the SSS at $25^{\circ}C$ in$2\times10^{-6}$ torr vacuum. The nitrogen ion implanted SSS obtained from anodic ploarization curves revealed higher corrosion potential than that of nitrogen ion unimplante one. And nitrogen ion implanted 316LSSS had good resistance to pitting corrosion due to the synergistic effect of Mo and N, and the inhibition of $NH_4\;^+$<\TEX>, against $CI^-$<\TEX>.

• ETRI Journal
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• v.33 no.4
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• pp.637-640
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• 2011

A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

• Bulletin of the Korean Chemical Society
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• v.27 no.1
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• pp.53-58
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• 2006

A powder of destructive adsorbent was prepared by impregnating Mn and Cu on the surface of amorphous aluminosilicate. It catalytically dimerized tert-butyl mercaptan into di-tert-butyl disulfide on its surface. Turnover of the dimerization was strongly dependent on the surface morphology of the adsorbent, which could be altered by modification of aluminosilicate support. During the process of impregnation, which involved heat treatment at 500 ${^{\circ}C}$, the shape of the pore was preserved, though large fraction of micropores were eliminated. The reactive sites on the surface were poisoned as dimerization products strongly adhered on them. Therefore, high surface area was not always desirable. When the surface was heavily populated with “inkbottled” pores with a narrow entrance in uniform size, heavy poisoning of the reactive sites turned the destructive adsorbents almost useless.

• Korean Chemical Engineering Research
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• v.58 no.2
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• pp.301-306
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• 2020

We investigated the individual biosorption removal of lead, copper, and nickel ions from aqueous solutions using Chara sp. algae powder in a batch mode. The impact of several parameters, such as initial concentration of the metal ions, contacting time, sorbent dose, and pH on the removal efficiency, was investigated. The maximum removal efficiency at optimum conditions was found to be 98% for Pb(II) at pH = 4, 90% for Cu(II) at pH = 5, and 80% for Ni(II) at pH = 5. The isotherm study was done under the optimum conditions for each metal by applying the experimental results onto the well-known Freundlich and Langmuir models. The results show that the Langmuir is better in describing the isotherm adsorption of Pb(II) and Ni(II), while the Freundlich is a better fit in the case of Cu(II). Similarly, a kinetic study was performed by using the pseudo-first and second-order equations. Our results show that the pseudo-second-order is better in representing the kinetic adsorption of the three metal ions.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1976-1978
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• 2002

micro CPL 제작을 위한 LICA 및 MEMS 공정을 개발하였으며 양산화를 위한 새로운 방법으로 ${\mu}$MIM(micro Metal Injection Molding) 기술을 제안하였다. 먼저 LIGA 기술을 이용하여 Cu 도금 구조물로 이루어진 micro CPL 구조물을 제작하였다. 각각 상판과 하판 구조물로 나누어 제작하였으며 상, 하판 Cu 구조물을 brazing 방법을 이용하여 접합하였다. 또한 micro CPL 내부에서 일어나는 냉매의 흐름 및 상변화(liquid ${\leftrightarrow}$ vapor) 거동을 관찰할 수 있는 새로운 개념의 Si/glass 투명 micro CPL을 제작하였다. 상기 공정을 이용하여 냉각 능력이 10w/$cm^2$ 이상인 micro CPL을 제작하였다. 상기 연구 결과를 바탕으로 양산화를 위한 새로운 정밀복제기술인 ${\mu}$MIM(Micro Metal Injection Molding) 공정을 개발하였다. LISA 공정으로 제작된 정밀 금형을 core금형으로 사용하였고 $1{\mu}m$ 이하의 W-Cu(10%) powder와 binder가 혼합된 흔합분말을 이용하여 micro channel 구조물(선폭 $100{\mu}m$)의 성형 복제에 성공함으로서 양산화를 향한 기반기술을 확립하였다.

• Progress in Superconductivity
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• v.4 no.1
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• pp.90-93
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• 2002

The sintering process of BSCCO 2223 tapes is a complex process that is very sensitive to parameters, such as temperature, oxygen partial pressure, heating and cooling rate and holding time. During the first heat treatment, 2212 phase of precursor powder is partially transformed into 2223 phase and some residual secondary phases, such as $(Bi,Pb)_2$$Sr_2$CuO／sub y／(2201), $(Ca,Sr)_2$CuO／sub y／(2/1AEC), (Ca,Sr)／sub 14／Cu／sub 24／O／sub 41／(14／24 AEC) etc. The secondary phases are difficult to be removed from the BSCCO 2223 matrix on the heat treatment. These secondary phases degrade the critical current density. In order to minimize the amount and size of alkaline earth cuprate(AEC) particles step heat treatment is applied during the first heat treatment under the varying atmosphere. Experimental results showed that by adapting the step heat treatment process, the amount and particle size of the secondary phases in the final tapes are decreased. Consequently, the BSCCO 2223grain texture and Jc properties are improved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.547-548
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• 2006

In order to realize the commercial application of HTSC materials, it is necessary to develop the fabrication process of high Tc oxide superconductor materials with desired shape and for practical application and high critical current density as well as good mechanical strength which can withstand high lorenz force generated at high magnetic field. Much studies have been concentrated to develop the fabrication technique for high critical current density but still there are a lot of gap which should be overcome for large scale application of HTSC materials at liquid nitrogen temperature. Recently some new fabrication techniques have been developed for YBaCuO bulk superconductor with high mechanical strength and critical current density. In this project, the establishment of fabrication condition and additive effects of second elements were examined so as to improve the related properties to the practical use of YBaCuO superconductor, and we reported the production of the YBaCuO high Tc superconductor by the pyrolysis method.

• Journal of Welding and Joining
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• v.31 no.6
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• pp.65-70
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• 2013

In joining Alumina to copper plate by Mo-Mn metallizing process, the effects of the composition of metallizing paste on the bonding strength were investigated. The bonding strength increased with increasing Mn amount in the paste up to 20% but followed by the decrease with addition of Mn. The maximum bonding strength reached 50MPa at 20%Mn when heated to $1550^{\circ}C$ for 60minute. The addition of Si to the metallizing powder increased the bonding strength of the joint by enhancing the mechanical bonding between the Alumina and the metallizing layer due to the decrease of layer viscosity with the addition of $SiO_2$. It is thought that MnO reacted with $Al_2O_3$ to yield $MnAl_2O_4$ spinel, forming a joint.