• Journal of the Korean Ceramic Society
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• v.51 no.5
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• pp.477-480
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• 2014

An $Al_2O_3$-CuO-ZnO (ACZ) precursor powder was synthesized by a facial sol-gel process using a nonionic surfactant span 80 as the chelating agent to improve the surface area and morphology. When creating a hydrogen membrane, several kinds of properties are required, such as easy dissociation of hydrogen molecules, fast hydrogen diffusion, high hydrogen solubility, and resistance to hydrogen embrittlement. ACZ-Ni composite membranes (cermet) were prepared with this precursor and pure Ni powder via the hot press sintering (HPS) method. The ACZ powder was characterized by XRD, BET, and FE-SEM. Hydrogen permeation experiments were performed by Sievert's type of hydrogen permeation membrane equipment. The hydrogen permeability of ACZ/Ni 10 wt% and ACZ/Ni 20 wt% was obtained as 7.2 and $10molm^{-2}s^{-1}$ at RT, respectively. These values of the corresponding membranes were slightly increased with increasing pressures.

• Journal of Powder Materials
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• v.10 no.6
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• pp.443-447
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• 2003

Nano-sized $TiB_2$ was in situ synthesized in copper matrix through self-propagating high temperature synthesis (SHS) with high-energy ball milled Ti-B-Cu elemental mixtures as powder precursors. The size of $TiB_2$ particles in the product of SHS reaction decreases with time of preliminary mechanical treatment ranging from 1 in untreated mixture to 0.1 in mixtures milled for 3 min. Subsequent mechanical treatment of the product of SHS reaction allowed the $TiB_2$ particles to be reduced down to 30-50 nm. Microstructural change of $TiB_2$-Cu nanocomposite during spark plasma sintering (SPS) was also investigated. Under simultaneous action of pressure, temperature and electric current, titanium diboride nanoparticles distributed in copper matrix move, agglomerate and form a interpenetrating phase composite with a fine-grained skeleton.

• ETRI Journal
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• v.35 no.6
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• Journal of the Korean institute of surface engineering
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• v.42 no.1
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• pp.47-52
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• 2009

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

• Journal of Welding and Joining
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• v.17 no.5
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• pp.107-115
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• 1999

The objective of this research was to study the formation of the thick hardened layer with the addition of metal powder(Cu) and ceramics powders(TiC) on the aluminum 5083 alloys by plasma transferred arc process(PTA process) and to characterize the effect of overlaying conditions on the overlaid layer formation. This was followed by investigating the microstructures of the overlaid layers and mechanical properties such as hardness and wear resistance. The overlaid layer containing copper powder was alloyed and intermetallic compound($CuAl_2$) was formed. The overlaid layers with high melting point TiC powders, however, did not react with base metal. Wear resistance of the alloyed layer was remarkably improved by the formation of $CuAl_2$, precipitate phase, which prevented wear of base aluminum alloys and at higher wear speed, accelerated sliding of the counter part. Wear resistance of the composite layer was also remarkably improved because TiC powder act as a load barring element and Fe debris fragments detached from the counter part act as a solid lubricant on the contact surface.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.848-849
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• 2006

Bulk metallic glass (BMG) composites combining a $Cu_{54}Ni_6Zr_{22}Ti_{18}$ matrix with brass powders or $Zr_{62}A_{l8}Ni_{13}Cu_{17}$ metallic glass powders were fabricated by spark plasma sintering. The brass powders and Zr-based metallic glass powders added for the enhancement of plasticity are well distributed homogeneously in the Cu-based metallic glass matrix after consolidation. The BMG composites show macroscopic plasticity after yielding, and the plastic strain increased to around 2% without a decrease in strength for the composite material containing 20 vol% Zr-based amorphous powders. The proper combination of strength and plasticity in the BMG composites was obtained by introducing a second phase in the metallic glass matrix.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1084-1085
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• 2006

We studied formation of nanostructured $TiB_2$-Cu composites under shock wave conditions. We investigated the influence of preliminary mechanical activation (MA) of Ti-B-Cu powder mixtures on the peculiarities of the reaction between Ti and B under shock wave. In the MA-ed mixture the reaction proceeded completely while in the non-activated mixture the reagents remained along with the product . titanium diboride. The size of titanium diboride particles in the central part of the compact was 100-300 nm.

• Journal of the Korean Ceramic Society
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• v.27 no.3
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• pp.355-360
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• 1990

One of the possible ways to make a flexible wire of high-Tc superconductiong ceramics is the extrusion of a mixture slurry of superconducting powder with an appropriate polymer binder. The fabrication procedure for $YBa_2Cu_3O_{7-{\delta}}$ superconducting coils with this plastic mass is described. The major factors limiting the formation of extruded wire are the binder content, powder size, and entrapped gas in the mixture slurries. The optimum content of binder for both good flexbility and strength of wire was estimated to be 30wt%. The finer the powder size is, the more homogeneous structure the extruded wire has. The vacuum degassing before extrusion was necessary to remove the entrapped gas in as-extruded wire. The formability of wire depends greatly on the wire radius and binder content. After burning out the binder and the successive sintering, the contacts between the superconducting grains could be made. The resistivity vs. temperature behavior measured in the final wire showed the transition temperature of 90K with narrow transition width. However, the critical current densities of these wires are much lower in comparison to those of conventional bulk specimens.

• Journal of Powder Materials
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• v.4 no.2
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• pp.100-105
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• 1997

In this study the changes of the hardness and microstructures during aging at 120$^{\cire}C$ of an RS-P/M Al-5.6wt%Zn-2.0wt%Mg-1.3wt%Zr-1.0wt%Mn-0.25wt%Cu alloy were studied using a transmission electron microscopy. The hardness increased rapidly at early stage of aging and reached the maximun when the specimen was aged for 24 hr. The many irregular-shaped $Al_4Mn$ and rod-shaped $Al_6Mn$ dispersoids with 0.1-0.4 $\mu$m in length were observed in the as-extruded alloy. The dark particles with 2-3 nm in size were observed in aged specimen for 5hr and those are thought to be G.P.zones or precursor of $\eta'$ precipitates. In aged specimen for 24 hr, the $\eta'$ phases were distributed homogeneously within the matrix and the PFZ with 30-40 nm in width was observed along the grain boundary. With further aging, the width of PFZ increased and $\eta$ phases were also detected within the matrix.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.441-446
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• 2005

The copper oxide nano powders were synthesized by levitational gas condensation (LGC) method, and were applied to catalyst to fabricate 3,4-dihydropyrimidin-2-(1H)-one. Processes of adsorption of Biginelli reaction reagents on the copper nanooxide surface $Cu_2O{\circ}CuO$ were studied by IR-spectroscopy. It was shown that benzaldehyde coordination, acetoacetic ether on the oxide surface is carried out with participation of carbonyl fragments, urea by N-H bonds which affects positively on the reagents reactivity.