• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.123-126
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• 2006

In this study, bottom-up type powder processing and top-down type SPD (severe plastic deformation) approaches were combined in order to achieve full density of carbon nanotube (CNT)/metal matrix composites with superior mechanical properties by improved particle bonding and least grain growth, which were considered as a bottle neck of the bottom-up method using the conventional powder metallurgy of compaction and sintering. ECAP (equal channel angular pressing), the most promising method in SPD, was used for the CNT/Cu powder consolidation. The powder ECAP processing with 1, 2, 4 and 8 route C passes was conducted at room temperature.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 추계학술발표대회 논문집
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• pp.39-42
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• 2004

Carbon nanofiber/Cu composite powder has been fabricated by electroless plating process. Microstructural evolution of the composite powder after heat treatment under vacuum, hydrogen and air environment was investigated. A dispersed carbon nanofiber coated by copper was produced at the as-plated condition. Carbon nanofiber is coated uniformly and densely with the plate shaped copper particles. The copper plates on the carbon nanofiber aggregate during the thermal exposure at elevated temperature in vacuum and hydrogen in order to reduce surface energy. The thermal exposure of the composite powder in air at $400^{\circ}C$ for 3 hours leads to the spherodization of the composite powder owing to oxidation of copper.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.786-787
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• 2006

The magnetic inductance of nanocrystalline $Fe_{73}Si_{16}B_7Nb_3Cu_1$ and an amorphous FeSiB powder sheet has been investigated to identify RFID performance. The powder was mixed with binder and solvent and tape-casted to form films. Results show annealing significantly influenced on the inductance of the material. The surface oxidation of the particles was the main reason for the reduced inductance. The maximum inductance of $Fe_{73}Si_{16}B_7Nb_3Cu_1$ alloy was about $88{\mu}H$ at 17.4 MHz, about 65% greater compared to the FeSiB alloy. The higher inductance in the nanocrystalline alloy indicates it may be used as a potential replacement of current RFID materials.

• 한국분말재료학회지
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• 제21권3호
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• pp.196-201
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• 2014

In this study, nanocrystalline Cu-Ni bulk materials with various compositions were cold compacted by a shock compaction method using a single-stage gas gun system. Since the oxide layers on powder surface disturbs bonding between powder particles during the shock compaction process, each nanopowder was hydrogen-reduced to remove the oxide layers. X-ray peak analysis shows that hydrogen reduction successfully removed the oxide layers from the nano powders. For the shock compaction process, mixed powder samples with various compositions were prepared using a roller mixer. After the shock compaction process, the density of specimens increased up to 95% of the relative density. Longitudinal cross-sections of the shock compacted specimen demonstrates that a boundary between two powders are clearly distinguished and agglomerated powder particles remained in the compacted bulk. Internal crack tended to decrease with an increase in volumetric ratio of nano Cu powders in compacted bulk, showing that nano Cu powders has a higher coherency than nano Ni powders. On the other hand, hardness results are dominated by volume fraction of the nano Ni powder. The crystalline size of the shock compacted bulk materials was greatly reduced from the initial powder crystalline size since the shock wave severely deformed the powders.

• 대한금속재료학회지
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• 제47권11호
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• pp.728-733
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• 2009

Cu based amorphous ($Cu_{54}Zr_{22}Ti_{18}Ni_{6}$) powders were deposited onto Al 6061 substrates by cold spray process with different powder preheating temperatures (below glass transition temperature: $350^{\circ}C$, near glass transition temperature: $430^{\circ}C$ and near crystallization temperature: $500^{\circ}C$). The microstructure and macroscopic properties (hardness, wear and corrosion) of Cu based amorphous coating layers were also investigated. X-ray diffraction results showed that cold sprayed Cu based amorphous coating layers of $300{\sim}350{\mu}m$ thickness could be well manufactured regardless of powder preheating temperature. Porosity measurements revealed that the coating layers of $430^{\circ}C$ and $500^{\circ}C$ preheating temperature conditions had lower porosity contents (0.88%, 0.93%) than that of the $350^{\circ}C$ preheating condition (4.87%). Hardness was measured as 374.8 Hv ($350^{\circ}C$), 436.3 Hv ($430^{\circ}C$) and 455.4 Hv ($500^{\circ}C$) for the Cu based amorphous coating layers, respectively. The results of the suga test for the wear resistance property also corresponded well to the hardness results. The critical anodic current density ($i_{c}$) according to powder preheating temperature conditions of $430^{\circ}C$, $500^{\circ}C$ was lower than that of the sample preheated at $350^{\circ}C$, respectively. The higher hardness, wear and corrosion resistances of the preheating conditions of near $T_{g}$ and $T_{x}$, compared to the properties of below $T_{g}$, could be well explained by the lower porosity of coating layer.

• 한국분말재료학회지
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• 제7권3호
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• pp.154-160
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• 2000

In order to enhance sinterability of W-Cu composites used for heat sink materials, mechanical alloying process where both homogeneous mixing of component powders and fine dispersion of minor phase can be easily attained was employed. Nanostructured W-Cu powders prepared by mechanical alloying showed W grain size ranged of 20-50 nm and were able to be efficiently sintered owing to the fine particle size as well as uniform distribution of Cu phase. The thermal properties such as electrical resistivity, coefficient of thermal expansion and thermal conductivity were evaluated as functions of temperature and Cu content. It was found that the coefficient of thermal expansion could be controlled by changing Cu content. The measured electrical resistivities and thermal diffusivities were also varied with Cu content. The thermal conductivities calculated from the values of resistivities and diffusivities showed similar tendency as a function of temperatures. However, this is in contradiction with thermal conductivities of pure W and Cu which decrease with increasing temperature.

• 한국자기학회지
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• 제4권1호
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• pp.48-51
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• 1994

$^{63}Cu$ 핵사중극공명을 이용하여 자기적으로 정렬된 $YBa_{2}Cu_{3}O_{7}$ 고온초전도체 시료의 비등방성을 조사하였다. 정렬된 시료에서는 RF 자기장이 c-축에 수직으로 가해질 때만 공명신호가 검출되었다. 자기적으로 정렬된 시료와 정렬되지 않은 시료로부터 측정된 공명차이로부터 $YBa_{2}Cu_{3}O_{7}$의 자기적 비등방성을 관측할 수 있었다.

• 한국자기학회지
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• 제9권4호
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• pp.217-222
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• 1999

공업적으로 세라믹공정에 많이 사용되고 있는 습식 볼밀링으로 NiCuZn ferrite 제조과정 중 혼입되는 불순물의 양을 조사 검토하였다. NiO, CuO, ZnO 및 Fe2O3의 화학조성을 변화시켜 25 vol%로 혼합하고 스테인레스 볼밀로 습식방법을 이용하여 18시간 분쇄한 후 건조시켜 $700^{\circ}C$ 3시간 하소하였다. 하소한 분말을 다시 상기와 같은 방법으로 65시간 스테인레스 볼밀로 최종 분쇄하여 저온소결용 NiCuZn ferrite(NCZF) 소재를 제조하였다. NCZF 연자성 소재를 만드는 동안 혼합 분쇄과정에서 혼입되는 불순물의 스테인레스 스틸의 양은 산화철 및 산화니켈의 함량에 많은 영향을 받았고, 하소 후의 분쇄과정에서 혼입되는 불순물의 양은 결정화된 정도에 따라 영향을 받았다. 전자기적 특성을 갖는 화학조성의 조절을 위하여, 출발원료의 함량에 따라 분쇄과정에서 혼입되는 스테인레스 스틸의 함량을 도출하는 형식을 유도하였다.

• 한국분말재료학회지
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• 제12권6호
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• pp.406-412
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• 2005

This work is to present a new synthesis of metallic glass (MG)/metallic glass (MG) composites using gas atomization and spark plasma sintering (SPS) processes. The MG powders of $Cu_{54}Ni_6Zr_{22}Ti_{18}$ (CuA) and $Ni_{59}Zr_{15}Ti_{13}Nb_7Si_3Sn_2Al_1$(NiA) as atomized consist of fully amorphous phases and present a different thermal behavior; $T_g$ (glass transition temperature) and $T_x$ (crystallization temperature) are 716K and 765K for the Cu base powder, but 836K and 890K for the Ni base ones, respectively. SPS process was used to consolidate the mixture of each amorphous powder, being $CuA/10\%NiA\;and\;NiA/10\%CuA$ in weight. The resultant phases were Cu crystalline dispersed NiA matrix composites as well as NiA phase dispersed CuA matrix composites, depending on the SPS temperatures. Effect of the second phases embedded in the MG matrix was discussed on the micro-structure and mechanical properties.

• 한국분말재료학회지
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• 제21권5호
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• pp.349-354
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• 2014

This study is a basic research for repair material production which manufactured a Cu repair coating layer on the base material of a Cu plate using kinetic spray process. Furthermore, the manufactured material underwent an annealing heat treatment, and the changes of microstructure and macroscopic properties in the Cu repair coating layer and base material were examined. The powder feedstocks were sphere-shaped pure Cu powders with an average size of $27.7{\mu}m$. The produced repair coating material featured $600{\mu}m$ thickness and 0.8% porosity, and it had an identical ${\alpha}$-Cu single phase as the early powder. The produced Cu repair coating material and base material displayed extremely high adhesion characteristics that produced a boundary difficult to identify. Composition analysis confirmed that the impurities in the base material and repair coating material had no significant differences. Microstructure observation after a $500^{\circ}C/1hr$. heat treatment (vacuum condition) identified recovery, recrystallization and grain growth in the repair coating material and featured a more homogeneous microstructure. The hardness difference (${\Delta}H_v$) between the repair coating material and base material significantly reduced from 87 to 34 after undergoing heat treatment.