• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1997.04a
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• pp.12-12
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• 1997

• Journal of Powder Materials
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• v.1 no.2
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• pp.174-180
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• 1994

Electrical contact property of the W-20wt%Cu contact materials manufactured by liquid phase sintering of nanocomposite W-Cu powders was investigated and discussed in terms of microstructural development during performance test. Nanocomposite powders were prepared by hydrogen reduction of ball milled W-Cu oxide mixture. They underwent complete densification and microstructural homogenization during liquid phase sintering. As a consequence, the W-Cu contacts produced from nanocomposite powders showed superior contact property of lower arc erosion and stable contact resistance. This might be mostly due to the fact that the arc erosion by evaporation of Cu liquid droplets and surface cracking remarkably became weakened. It is concluded that the improvement of anti-arc erosion of the composite specimen is basically attributed to microstructural homogeneity.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.950-951
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• 2006

[ $Mg_{55}Y_{15}Cu_{30}$ ] metallic glass powders were prepared by the mechanical alloying of pure Mg, Y, and Cu after 10 h of milling. The thermal stability of these $Mg_{55}Y_{15}Cu_{30}$ amorphous powders was investigated using the differential scanning calorimeter (DSC). $T_g$, $T_x$, and ${\Delta}T_x$ are 442 K, 478 K, and 36 K, respectively. The as-milled $Mg_{55}Y_{15}Cu_{30}$ powders were then consolidated by vacuum hot pressing into disk compacts with a diameter and thickness of 10 mm and 1 mm, respectively. This yielded bulk $Mg_{55}Y_{15}Cu_{30}$ metallic glass with nanocrystalline precipitates homogeneously embedded in a highly dense glassy matrix. The pressure applied during consolidation can enhance thermal stability and prolong the existence of amorphous phase within $Mg_{55}Y_{15}Cu_{30}$ powders.

• Journal of Powder Materials
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• v.3 no.1
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• pp.33-41
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• 1996

Nanostructured Cu-Pb powders were synthesized by mechanical alloying process. The variation of powder characteristics with mechanical alloying time was investigated by x-ray diffraction, differential scanning calorimetry, SEM and TEM. An electrical resistivity of the hot pressed specimens was also measured by using the nanovoltmeter. It was shown that mechanical alloying for 12 hours leads to a homogenization and a grain refinement to the nanometer scale under 20 nm. The mechanically alloyed Cu-Pb alloys represented the enhanced solid solubility of 10wt% Pb in the Cu matrix. The monotectic temperature of nanostructured Cu-Pb alloy decreased from equilibrium state of 955$^{\circ}C$ to 855$^{\circ}C$ due to reduced grain size effect. The analysis of electrical resistivity showed that the hot pressed MA Cu-5wt% Pb compact existed as a solid solution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.65-68
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• 1999

A well oriented Bi2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-O mixture powder on a copper plate and heat-treating at 820-88$0^{\circ}C$ for several minute in air. During the heat-treatment, the printing layer partially melted by reaction between the Cu-free precursor and CuO of the oxidizing copper plate. In the partial melting state, it is believed that the solid phase is Bi-free phase and Cu-rich phase and the composition of the liquid is around Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. Following the partial melting, the Bi2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. With decreasing the Bi composition in the precursor powder, the critical temperature(T$_{c}$) of the fabricated Bi2212 thick film increased to about 79 K.K.

• Journal of Powder Materials
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• v.30 no.4
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• pp.339-345
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• 2023

This study investigates the melting point and brazing properties of the aluminum (Al)-copper (Cu)-silicon (Si)-tin (Sn) alloy fabricated for low-temperature brazing based on the alloy design. Specifically, the Al-20Cu-10Si-Sn alloy is examined and confirmed to possess a melting point of approximately 520℃. Analysis of the melting point of the alloy based on composition reveals that the melting temperature tends to decrease with increasing Cu and Si content, along with a corresponding decrease as the Sn content rises. This study verifies that the Al-20Cu-10Si-5Sn alloy exhibits high liquidity and favorable mechanical properties for brazing through the joint gap filling test and Vickers hardness measurements. Additionally, a powder fabricated using the Al-20Cu-10Si-5Sn alloy demonstrates a melting point of around 515℃ following melting point analysis. Consequently, it is deemed highly suitable for use as a low-temperature Al brazing material.

• Journal of Powder Materials
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• v.25 no.4
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• pp.291-295
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• 2018

A conductive additive is prepared by dispersing multi-walled carbon nanotubes (MWCNTs) on Cu powder by mechanical milling and is distributed in epoxy to enhance its electrical conductivity. During milling, the MWCNTs are dispersed and partially embedded on the surface of the Cu powder to provide electrically conductive pathways within the epoxy-based composite. The degree of dispersion of the MWCNTs is controlled by varying the milling medium and the milling time. The MWCNTs are found to be more homogeneously dispersed when solvents (particularly, non-polar solvent, i.e., NMP) are used. MWCNTs gradually disperse on the surface of Cu powder because of the plastic deformation of the ductile Cu powder. However, long-time milling is found to destroy the molecular structure of MWCNTs, instead of effectively dispersing the MWCNTs more uniformly. Thus, the epoxy composite film fabricated in this study exhibits a higher electrical conductivity than 1.1 S/cm.

• Journal of Powder Materials
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• v.10 no.2
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• pp.136-141
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• 2003

In the present study, $TiO_2$ imbedded copper matrix powders have been successfully prepared from the ($CuSO_4+TiO_2+Zn$) composite salt solution. The composite $Cu/TiO_2$ powders were formed by drying the solution at $200{\sim}~400^{\circ}C$ in the hydrogen atmosphere. Photocatalytic characteristics was evaluated by detecting TOC (total organic carbon) amount with TOC analyzer (model 5000A Shimadzu Co). Phase analysis of $Cu/TiO_2$ composite powders was carried out by XRD, DSC and powder size was measured with TEM. The mean particle size of composite powders was about 100 nm and a few zinc and copper oxide phases was included. The reduction ratio of TOC amount was 60% by the composite $Cu/TiO_2$ powders under the UV irradiation for 8 hours.

• Journal of Powder Materials
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• v.18 no.6
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• pp.546-551
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• 2011

Ag spot-coated Cu nanopowders were synthesized by a hydrothermal-attachment method (HA) using oleic acid capped Ag hydrosol. Cu nano powders were synthesized by pulsed wire exploding method using 0.4 mm in diameter of Cu wire (purity 99.9%). Synthesized Cu nano powders are seen with comparatively spherical shape having range in 50 nm to 150 nm in diameter. The oleic acid capped Ag hydrosol was synthesized by the precipitation-redispersion method. Oleic acid capped Ag nano particles showed the narrow size distribution and their particle size were less than 20 nm in diameter. In the case of nano Ag-spot coated Cu powders, nanosized Ag particles were adhered in the copper surface by HAA method. The components of C, O and Ag were distributed on the surface of copper powder.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.36-37
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• 2006

This study aims to investigate the usage of nano-scale particles in a micro metal injection molding ($\mu$-MIM) process. Nanoscale particle is effective to improve transcription and surface roughness in small structure. Moreover, the effects of hybrid micro/nano particles, Cu/Cu and SUS/Cu were investigated. Small dumbbell specimens were produced using various feedstocks prepared by changing binder content and fraction of nano-scale Cu particle (0.3 and $0.13{\mu}m$ in particle size). The effects of adding the fraction of nano-scale Cu powder on the melt viscosity of the feedstock, microstructure, density and tensile strength of sintered parts were discussed.