• 공업화학
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• 제33권6호
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• pp.630-635
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• 2022

멜라민 스펀지를 열처리하여 제조된 질소함유 탄소 스펀지에 산화구리(CuO)를 무전해 도금하여 기판없이 작동하는 일산화질소(NO) 가스 센서를 제조하였다. 탄소 스펀지 표면의 CuO 함량은 도금 시간이 증가함에 따라 증가하였으나, NO 가스 흡착을 유도한다고 알려져 있는 질소의 함량은 CuO 표면 함량이 증가함에 따라 감소하였다. 미처리 탄소스펀지는 NO 가스에 대하여 18 min에 최대 저항 변화(5.0%)를 나타내었다. 반면에, CuO가 도금된 샘플(CuO30s-CS)은 8 min만에 최대 18.3%의 저항변화를 보였다. 이러한 NO 가스 감지 능력 향상은 CuO로 인하여 탄소 스펀지의 정공 캐리어 수 증가 및 전자전달 촉진에 기인하는 것으로 판단된다. 그러나, 60 s 동안 CuO 무전해 도금된 탄소 스펀지의 NO가스 감지 저항은 1.9%로 오히려 감소하였다. 이는 탄소 스펀지 표면에 CuO로 완전히 도금되어 NO 가스 흡착 능력이 떨어져 저항변화가 감소한 것으로 판단된다. 따라서, CuO가 도금된 탄소 스펀지는 빠르고 우수한 저항변화 특성을 가지고 있어 유용한 NO 가스 센서로 사용할 수 있으나, CuO가 탄소 스펀지 표면을 완전히 도금해서는 안 된다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.221-225
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• 2009

A solar thermal collector is a solar collector specifically intended to collect heat: that is, to absorb sunlight to provide heat. A flat plate is the most common type of solar thermal collector, and is usually used as a solar hot water panel to generate solar hot water. A flat plate collector consists basically of an insulated metal box with a glass or a plastic cover and a dark-colored copper absorber plate. Solar radiation is absorbed by the copper absorber plate and transferred to water that circulates through the collector in copper tubes. Ultrasonic welding is an industrial technique whereby high-frequency ultrasonic acoustic vibrations are locally applied to work pieces being held together under pressure to create a solid-state weld. In this study, we developed solar collector ultrasonic welding machine with digital controlled power supply and tested various welding conditions such as welding pressure, welding amplitude, welding speed. Welding speed was considered in 2~12m/min. The width of ultrasonic welds was increased with welding amplitude by 2.2~2.5mm. The fracture load of ultrasonic welds showed 20% higher than domestic products.

• 한국지반공학회논문집
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• 제15권6호
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• pp.57-69
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• 1999

오염된 연약지반에 편재하중이 작용하는 경우에 있어서 지반의 소성화에 따른 지지력 결정을 위하여 기존의 이론적인 배경을 고찰하고, 이러한 오염된 연약지반에서 편재하중에 의한 지반의 지지력과 변형에 대한 거동을 연구하기 위하여 모형실험을 통한 실측치를 이용하여 서로 비교.분석하였다. 모형실험은 모형 재하장치인 토조와 재하틀 및 재하판을 제작하여 토조안에 함수비를 일정하게 유지한 상태에서 자연지반의 시료와 오염물질을 점진적으로 증가시킨 지반시료에 일정한 시간간격으로 편재하중을 증가시키면서 침하량과 측방변위량 및 융기량 등을 관찰하였다. 그 결과 한계하중은 실험값이 $Tschebotarioff(q_{cr}=3.0_{Cu)$의 제안값과 $Meyerhof(q_{cr}=(B/2H+\pi/2_{Cu})$의 제안값에 근접하여 $q_{cr}=2.78_{Cu$값을 나타냈고, 극한하중은 Prandtl의 제안값에 근접하여 $q_{ult}=4.84_{Cu}$의 값을 나타냈다

• 한국환경보건학회지
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• 제23권3호
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• pp.1-6
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• 1997

This research was conducted in the laboratory to investigate an alternative of Copper(Cu) removal from an heavymetal wastewater using the electrochemical precipitation(ECP) process. The ECP unit consisted of an electrolytic cell made of Titanium plate and Steel plate representing anode and cathode. The DC power source applied to the ECP unit had electrical potential(E) of 50$\pm$ 1V, respectively. The synthetic wastewater used in the experiments contained Cu in the 10 mg/l concentration and the electrode separation were 2, 3, 4 cm and the initial pH were 3, 6, 9, 12, and electrolytic concentration were 0.005, 0.0125, 0.025, 0.0375 mole, and the real heavymetal wastewater used in the experiments. From the experiment for removal efficiency according to pH variation, the low pH area doesn't give the coagulation effect by Ti(OH)$_4$ because process interfere with the coagulation and oxidation reaction, therefore the optimum pH was 4-7. The removal rate was 97.75% after the lapse of 30 minutes when copper concentration and electrolytic concentration were respectively 10 mg/l and 0.025 mole. The removal rate was 96.41% after the lapse of 30minutes when the real heavymetal wastewater used. The optimum consumption of power showed 27KWh/m$^3$ when copper concentration, electrolyte concentration and cell potential were respectively 10 mg/l, 0.025 mole and 50$\pm$ 1 Volt.

• International Journal of Advanced Culture Technology
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• 제3권2호
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• pp.132-137
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• 2015

The purpose of this paper was to investigate the effects of solution treatment time and Sr-modification on the microstructure and property of the Al-Si piston alloy. It was found that as-cast microstructures of unmodified and Sr-modified Al-Si alloys consisted of a coarse acicular plate of eutectic Si, $Cu_3NiAl_6$ and $Mg_2Si$ phases in the ${\alpha}$-Al matrix but different in size and morphology. Both size and inter-particle spacing of Si particles were significantly changed by increasing of the solution treatment time. After a short solution treatment, the coarse acicular plate of the eutectic Si appears to be fragmented. Fully modified microstructure of Sr-modified alloy can reduce the solution treatment time to shorter compared to unmodified alloy. The maximum of a peak hardness value is found in the very short solution treatment of both Al-Si piston alloys. Compared to 10 h solution treatment, the solution treatment of 2-4 h is sufficient to achieve appropriate microstructures and hardness. The short solution treatment is very useful to increase the productivity and to reduce the manufacturing cost of the Al-Si piston alloys.

• 동아시아식생활학회지
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• 제10권6호
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• pp.507-513
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• 2000

This study was conducted to investigate the shelf life of beef stored in antimicrobial pottery during 12days storage at 4'C and Five kinds of antimicrobial potteries were prepared with antimicrobial materials such as TiO$_2$, Ag (NO$_3$)$_2$, Cu(NO$_3$)$_2$ and Zn(NO$_3$)$_2$. In changes of color during storage, Hunter's L- and b-value of beef were not changed, but Hunter's a-value was low significantly. The pH of beef meats were low at 6 days, but were added from 6 days. TBA value of beef in "A" pottery containing TiO$_2$ 1% and "C" Pottery containing TiO$_2$ 0.5%, Cu(NO$_3$)$_2$ were lower than "B", "D" and "I" pottery. VBN contents of beef in "A", "B", "C", "D" and "I" Pottery stored during 12 days were 9.8, 12.5, 9.3, 11.9 and 13.7mg%, respectively. In changes of total plate count of beef during storage at 4$^{\circ}C$, the antimicrobial activity of "A" and "C" pottery were superior.g storage at 4$^{\circ}C$, the antimicrobial activity of "A" and "C" pottery were superior.ttery were superior.

• 한국자기학회지
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• 제5권5호
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• pp.416-420
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• 1995

An attempt has been made to investigate the mechanism of magnetic alignment in the magnets produced by upset forging the $Pr_{20}Fe_{74}B_{4}Cu_{2}$ cast bulk alloy. Upset forging of the cast alloy was carried out for 20 sec to an 80 % thickness reduction (strain rate : $4{$\times}10^{-2}s^{-1}$) in an open die configuration at varying temperatures in the range $600^{\circ}-900^{\circ}C$. It has been found that the upset forging process at temperatures above $800^{\circ}C$ can achieve a magnetic alignment to a great extent from copper-containing Pr-Fe- B-type cast ingot. The growth manner of the ferromagnetic $Pr_{2}Fe_{14}B$ matrix grain in Pr-Fe-B-type alloys was studied by examining the morphology change of the matrix grain in sintered body, and it was found that the matrix grains grew in anisotropic manner such that the grain grew more rapidly along the a- or b-axis than along the c-axis. This anisotropic grain growth led to the plate-like shape of the matrix grain. The magnetic alignment during the upset forging was attributed to grain boundary gliding of the plate-like grains, and the geometry of the grains in the cast ingot and the presence of a large amount of the praseodymium-rich grain boundary phase were thought to play a key role in the achievement of magnetic alignment.

• 한국재료학회지
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• 제29권11호
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• pp.709-714
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• 2019

In order to observe the microstructure and morphology of porous titanium -oxide thin film, deposition is performed under a higher Ar gas pressure than is used in the general titanium thin film production method. Black titanium thin film is deposited on stainless steel wire and Cu thin plate at a pressure of about 12 Pa, but lustrous thin film is deposited at lower pressure. The black titanium thin film has a larger apparent thickness than that of the glossy thin film. As a result of scanning electron microscope observation, it is seen that the black thin film has an extremely porous structure and consists of a separated column with periodic step differences on the sides. In this configuration, due to the shadowing effect, the nuclei formed on the substrate periodically grow to form a step. The surface area of the black thin film on the Cu thin plate changes with the bias potential. It has been found that the bias of the small negative is effective in increasing the surface area of the black titanium thin film. These results suggest that porous titanium-oxide thin film can be fabricated by applying the appropriate oxidation process to black titanium thin film composed of separated columns.

• 대한기계학회논문집A
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• 제39권5호
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• pp.467-471
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• 2015

최근까지, 전자제품에 사용되는 솔더는 납성분이 남아 있으며, 전자부품 및 시스템의 무연 (Pb-free) 솔더에 대한 관심은 반도체 및 전자산업에서 증가하고 있다. 본 논문에서 사용된 솔더접합부는 Sn-37Pb, Sn-4Ag 및 Sn-4Ag-0.5Cu/Ni 기판 이다. 인공시효처리는 $150^{\circ}C$에서 각각 0hr, 100hr, 200hr, 400hr, 600hr 그리고 1000hr 동안 수행되었으며, SP 시험을 이용해 $30^{\circ}C$와 $50^{\circ}C$에서 접합강도를 평가했다. 전단강도는 인공시효시간과 온도가 증가함에 따라 전반적으로 감소하였다. 무연솔더는 Sn-37Pb 보다 총파괴 에너지가 높았으며, Sn-4Ag-0.5Cu/Ni 접합부는 고온에서 기계적 물성치가 가장 우수하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.