• Transactions of Materials Processing
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• v.23 no.7
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• pp.419-424
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• 2014

In order to improve efficiency, an outdoor unit using a refrigerant cooling method is designed into many air conditioner systems. The heat exchanger is composed of a Cu tube and an plate. The optimal design for the cold plate is very important because the efficiency of the heat transfer depends on the contact area between the Cu tube and the cold plate. The current study focused on the design of the cold plate to obtain a uniform contact between the Cu tube and the cold plate. Both FE(finite element) analysis and optimization were used in the design. The contact area between the tube and plate was predicted and improved by 16% through the press forming simulations. The springback after press forming was also reduced when the optimized design parameters were used. To verify the validity of the optimal cold plate design, a verification test was conducted. As a result, the performance of the heat exchanger improved by 34% when compared to benchmarked products.

• Korean Journal of Materials Research
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• v.17 no.8
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.65-68
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• 1999

A well oriented Bi2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-O mixture powder on a copper plate and heat-treating at 820-88$0^{\circ}C$ for several minute in air. During the heat-treatment, the printing layer partially melted by reaction between the Cu-free precursor and CuO of the oxidizing copper plate. In the partial melting state, it is believed that the solid phase is Bi-free phase and Cu-rich phase and the composition of the liquid is around Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. Following the partial melting, the Bi2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. With decreasing the Bi composition in the precursor powder, the critical temperature(T$_{c}$) of the fabricated Bi2212 thick film increased to about 79 K.K.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.69-72
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• 1999

A Well oriented Bi$_2$re$_2$CaCu$_2$O$\sub$8/(Bi2212) superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape using method in which Cu-free BSCO powder mixture was printed on copper plate and heat-treated. And we examined the mechanism for the rapid formation of Bi2212 superconducting films from observing the surface microstructure with heat-treatment time. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Following the partial melting, the Bi$_2$Sr$_2$CaCu$_2$O$\sub$8/ superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. It was confirmed that the phase colony from the phase diagram of Bi$_2$O$_3$-(SrO+CaO)/2-CuO system is similar to the observed result.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.366-369
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• 2003

High T$_{c}$ superconducting lines will be applied as key materials in the areas of power transmission line; magnetic levitation of vehicle; magnetic separation; magnetic energy storage and marine propulsion. A combination method of electrophoresis deposition and zone-melting for preparation of YBaCuO tape is proposed. The submicron particle powder of YBaCuO made by sol-gel method is used in the electrophoresis process. A 40~50${\mu}{\textrm}{m}$ thickness of YBaCuO film on Ag plate could be deposited in about three minutes. After deposition the film is rolled and heat treated in order to increase the density and the adhesion of the film to the Ag plate. Silver(Ag) and lead oxide(PbO) were added in the YBaCuO powder in order to reduce its melting point. The YBaCuO coating with controlled Ag and PbO contents was preliminarily zone-melted at about 945$^{\circ}C$.>.

• Journal of information and communication convergence engineering
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• v.1 no.2
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• pp.63-66
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• 2003

High $T_c$ superconducting lines will be applied as key materials in the areas of power transmission line; magnetic levitation of vehicle; magnetic separation; magnetic energy storage and marine propulsion. A combination method of electrophoresis deposition and zone-melting for preparation of YBaCuO tape is proposed. The submicron particle powder of YBaCuO made by sol-gel method is used in the electrophoresis process. A 40∼50 ${\mu}\textrm{m}$ thickness of YBaCuO film on Ag plate could be deposited in about three minutes. After deposition the film is rolled and heat treated in order to increase the density and the adhesion of the film to the Ag plate. Silver(Ag) and lead oxide(PbO) were added in the YBaCuO powder in order to reduce its melting point. The YBaCuO coating with controlled Ag and PbO contents was preliminarily zone-melted at about $945^{\circ}C$.

• Journal of environmental and Sanitary engineering
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• v.16 no.2
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• pp.47-55
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• 2001

We investigated to find the optimum operation condition of electrolysis which have an influence on removal efficiency of heavy metals. When we experimented the testing wastewaters containing each 250mg/L of Cu and Ni ions, we got the variables like as pH, amount of electrolyte(NaCl), different species of electrode, electrode gap, electric strength, the number of electrodes, after fastening positive electrode plate with Al, Fe, Ti and negative electrode plate with Stainless Steel plate.

• Journal of Korean Academy of Oral and Maxillofacial Radiology
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• v.29 no.2
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• pp.397-405
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• 1999

Purpose: To clarify the usefulness and the limitation of Digora system/sup (R)/ by evaluating the physical characteristics as the quantitative image on Image Plate(Ip). Materials and Methods: Radiograms were taken by Heliodent MD(Siemens Co.. Germany) with the image plate for adult. Cu-step wedge as reference material. and three pieces of dry mandibular bone. Image analysis was performed by single color enhancement. density measurement with histogram. The relationship between the exposure conditions and the distribution of the pixel values of the image. the variation of pixel values of each step of Cu-step wedge at two different area and Cu-equivalent value of three pieces of dry mandibular bone measure by the conversion equation. Results: There was no linear relationship between the exposure condition and the average pixel value of the image. of which the distribution was not even. The pixel value differences between the center portion and the periphery were ranged from 60 to 70 in vertical plane and from 15 to 26 in horizontal plane. Two plot profile formed at two different areas of the Cu-step wedge were different. The measured Cu-equivalent values showed the discrepancy among the times of measurement. Conclusion: As above results. Image Plate(Ip) of Digora system/sup (R)/ showed the limitation as the quantitative image. The physical property of IP was expected to need to be compensated for the quantitative evaluation of the bone or others

• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.419-424
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• 2011

Carbon nanotubes (CNTs) were directly synthesized on a copper (Cu) plate as a current collector by the catalytic thermal vapor deposition method for an electric double-layer capacitor (EDLC) electrode. The diameters of vertically aligned CNTs grown on the Cu plate were 20~30 nm. From cyclic voltammetry (CV) results, the CNTs/Cu electrode showed high specific capacitance with typical profiles of EDLCs. Rectangularshaped CV curves suggested that the CNTs/Cu electrode could be an excellent candidate for an EDLC electrode. The specific capacitances were in a range of 25~75 F/g with a scan rate of 10~100 mV/s and KOH electrolyte concentration 1~6 M, and were maintained up to 1000 charge/discharge cycles due to strong adhesion between the Cu substrate and the CNTs.

• Corrosion Science and Technology
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• v.16 no.5
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• pp.247-256
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• 2017

The feasibility of using hydrazine for inhibiting pitting corrosion in copper sprinkler tubes was investigated by examining microscopical and structural evolution of corrosion by-products with SEM, EDS, and XRD. Hydrazine removed dissolved oxygen and reduced CuO and $Cu_2O$ as well. The stable phase was changed from CuO to $Cu_2O$ or Cu depending on hydrazine concentration. Hydrazine concentration of 500 ppm could convert all CuO corrosion by-products to $Cu_2O$. In a tightly sealed acryl tube filled with aqueous solution of 500 ppm hydrazine, octahedral $Cu_2O$ particles were formed while plate-like structures with high concentration of Cu, O, N and C were formed near a corrosion pit. The inside structure of a corrosion pit was not altered by hydrazine aqueous solution. Uniform corrosion of copper was almost completely stopped in aqueous solution of 500 ppm hydrazine. Corrosion potential of a copper plate was linearly dependent on log (hydrazine concentration). The concept of stopping pitting corrosion reaction by suppressing oxygen reduction reaction could be verified by applying this method to a reasonable number of real sprinkler systems before full-scale application.