• Title/Summary/Keyword: Cu Oxide

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Novel Bumping Material for Solder-on-Pad Technology

  • Choi, Kwang-Seong;Chu, Sun-Woo;Lee, Jong-Jin;Sung, Ki-Jun;Bae, Hyun-Cheol;Lim, Byeong-Ok;Moon, Jong-Tae;Eom, Yong-Sung
    • ETRI Journal
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    • v.33 no.4
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    • pp.637-640
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    • 2011
  • A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

Fabrication of CdS Solar Cells Prepared by Chemical Pyrolysis Deposition (화학적 열분해방법에 의한 CdS 태양전지의 제작)

  • 고정곤;김홍복;허윤성
    • Journal of the Korea Safety Management & Science
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    • v.4 no.2
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    • pp.199-207
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    • 2002
  • The polycrystalline CdS of large scale were grown by chemical pyrolysis deposition for $Cu_2$S/CdS heterojunction solar cells. For high quality CdS polycrystalline thin films, the chemical solution was deposited on indium tin oxide(ITO) glasses at the temperature of 50$0^{\circ}C$ for 15 second and annealed at 35$0^{\circ}C$ for 20 minute or 50$0^{\circ}C$ for 30 second. To fabricate high efficiency solar cells, optical and electrical properties, morphology by SEM and x-ray diffraction on polycrystalline CdS thin films were investigated. From the I-V characteristics of $Cu_2$S/CdS heterojunction, the open circuit voltage, $V_{oc}$ was 0.7 V and the short circuit current, $I_{sc}$ was 4.2 mA. We found that the fill factor(FF) was 0.5 and the efficiency was 2.5%.

Magnetic Characteristics of BiPbSrCaCuO Oxide Superconductor (BPSCCO 자기 효과)

  • Lee, Sangl-Heon;Lee, Sung-Gap;Lee, Young-Hie
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.252-254
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    • 2003
  • A magnetic field sensor is fabricated with superconducting ceramics system. The sensor at liquid nitrogen temperature shows the increase in electrical resistance by applying magnetic field. Actually, the voltage drop across the sensor is changed from zero to a value more than $100{\mu}V$ by the applied magnetic field. The change in electrical resistance depends on magnetic field. The sensitivity of this sensor is 2.9 ohm/T. The increase in electrical resistance by the magnetic field is ascribed to a modification of the Josephson junctions due to the penetrating magnetic flux into the superconducting material.

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A Study on Formation of Single-phase Film in the Bi-2212 Superconducting Thin Films Substrate Temperature and Oxide Gas Pressures (기판온도와 산화가스압에 따른 Bi-2212 초전도 박막의 단상막 형성에 관한 연구)

  • Yang, Seung-Ho;Lee, Hee-Kab;Park, Yong-Pil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.484-485
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    • 2007
  • BiSrCaCuO superconducting thin films have been fabricated by co-deposition using the faraday cup. Despite setting the composition of thin film Bi2212, Bi(2201, 2212, 2223) phase were appeared. It was confirmed the obtained field of stabilizing phase was represented in the diagonal direction of the right below end in the Arrhenius plot of temperature of the substrate and $PO_3$, and it was distributed in the rezone.

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Determination of the Failure Paths of Leadframe/EMC Joints

  • Lee, H.Y.;Kim, S.R.
    • Journal of the Korean institute of surface engineering
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    • v.33 no.4
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    • pp.241-250
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    • 2000
  • Popcorn cracking phenomena frequently occur in thin plastic packages during the solder reflow process, which are definitely affected by poor adhesion of Cu-based leadframe to epoxy molding compounds (EMCs). In the present work, in order to enhance the adhesion strength, a brown-oxide treatment on the Cu-based leadframe was carried out and the adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using sandwiched double-cantilever beam (SDCB) specimens. After the adhesion tests, fracture surfaces were analyzed by SEM, AES, EDS and AFM to make the failure path clear. Results showed that failure path was closely related to the oxidation time and the interfacial fracture toughness.

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Fabrication of Bulk High-Tc Superconductor (벌크형 고온 초전도 합성)

  • Lee, Sang Heon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.34 no.5
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    • pp.333-336
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    • 2021
  • Oxide YBCO bulk superconductors are manufactured using the melt process. Because seed crystal growth method utilizes a slow-spreading layer-by-layer reaction, a long-term heat treatment is required to manufacture a single-crystal specimen of several cm. In this study, the melt process method was applied to compensate for the shortcomings of the seed crystal growth method. The thickness of the upper and lower pellets of the YBCO bulk was molded to 40 mm, and YBCO superconductor was produced by heat treatment. The measurement results of capture magnetism was in line with the literature. This results in a relationship that the higher the growth of Y211 particle in the YBCO, the higher the superconducting properties. We analyzed the YBCO superconductor, focusing on the Y2BaCuO5 particle distribution.

Dielectric and Piezoelectric Properties of (K,Na)NbO3 Ceramics with the amount of K4CuNb8O23 Addition (K4CuNb8O23 첨가에 따른 (K,Na)NbO3 세라믹스의 유전 및 압전특성)

  • Seo, Byeong-Ho;Yoo, Ju-Hyun;Mah, Suk-Burm;Jeong, Yeong-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.11
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    • pp.930-934
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    • 2009
  • In this study, in order to develop excellent lead-free composition ceramics for piezoelectric transformer, ($K_4CuNb_8O_{23}$) added $(K_{0.5}Na_{0.5})(Nb_{0.96}Sb_{0.04})O_3$ ceramics were fabricated using conventional mixed oxide method and their piezoelectric and dielectric properties were investigated as a fu+EY50nction of the amount of KCN addition. With increasing the amount of KCN addition, density and mechanical quality factor(Qm), electromechanical coupling factor (Kp) were increased up to 1.2 mol% and then decreased. At the 1.2 mol% KCN added specimen, mechanical quality factor (Qm), electromechanical coupling factor (Kp), density and dielectric constant (${\varepsilon}r$) showed the optimal values of 781, 0.445, $4.42\;g/cm^3$ and 443, respectively, for piezoelectric transformer application.

The Microwave Dielectric Properties Of $ZnNb_2O_6$ Ceramics With Addition (첨가물에 따른 $ZnNb_2O_6$ 세라믹스의 마이크로파 유전특성)

  • Kim, Jung-Hun;Kim, Ji-Heon;Lee, Sung-Gap;Bae, Sun-Ki;Lee, Young-Hie
    • Proceedings of the KIEE Conference
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    • 2003.10a
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    • pp.101-103
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    • 2003
  • The $ZnNb_2O_6$ ceramics with 5wt% CuO and $B_2O_3$(1,3,5wt%) were prepared by the conventional mixed oxide method. The ceramics were sintered at the temperature of $950^{\circ}C{\sim}1025^{\circ}C$ for 3hr. in air. The structural properties were investigated with sintering temperature and $B_2O_3$ addition by XRD and SEM. Also, the microwave dielectric properties were investigated with sintering temperature and $B_2O_3$ addition. Increasing the sintering temperature, the peak of second phase ($Cu_3Nb_2O_6$) was increased. But no significant difference was observed as the $B_2O_3$ addition, In the $ZnNb_2O_6$ ceramics with 5wt% CuO and 5wt% $B_2O_3$ sintered at $975^{\circ}C$ for 3hr, the dielectric constant, quality factor, temperature coefficient of the resonant frequency were 19.30, 14,662GHz, $+4.18ppm/^{\circ}C$, respectively.

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Heavy metals leaching behavior and ecological risks in water and wastewater treatment sludges

  • Wuana, Raymond A.;Eneji, Ishaq S.;Ugwu, Ezekiel C.
    • Advances in environmental research
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    • v.6 no.4
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    • pp.281-299
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    • 2017
  • Single (0.005 M DTPA), sequential (six-step) and kinetic (0.05 M EDTA) extractions were performed to assess Cd, Cr, Cu, Ni, Pb, and Zn mobilization and their potential ecological risks in Abuja (Nigeria) water (WTS) and wastewater (WWTS) treatment sludges. Total metal levels (mg/kg) in WTS and WWTS, respectively were: Cd(3.67 and 5.03), Cr(5.70 and 9.03), Cu(183.59 and 231.53), Ni(1.33 and 3.23), Pb(13.43 and 17.87), Zn(243.45 and 421.29). DTPA furnished metal extraction yields (%) in WTS and WWTS, respectively as: Cd(11 and 6), Cr (15 and 7), Cu(17 and 13), Ni(23 and 3), Pb(11 and 12), and Zn(37 and 33). The metals were associated with the soluble/exchangeable, carbonate, Mn/Fe-oxide, organic matter and residual forms to varying degrees. Kinetic extractions cumulatively leached metal concentrations akin to the mobilizable fractions extracted sequentially and the leaching data fitted well into the Elovich model. Metal mobilities were concordant for the three leaching procedures and varied in the order:WTS>WWTS. Calculated ecological risk indices suggested moderate and considerable metal toxicity in WTS and WWTS, respectively with Cd as the worst culprit. The findings may be useful in predicting heavy metals bioavailability and risks in the sludges to guide their disposal and use in land applications.

Effect of CeO2 Coating on the Grain Growth of Cu Particles (CeO2 코팅을 통한 Cu 입자의 입성장 억제 효과에 관한 연구)

  • Yoo Hee-Jun;Moon Ji-Woong;Oh You Keun;Moon Jooho;Hwang Hae Jin
    • Journal of Powder Materials
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    • v.12 no.6 s.53
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    • pp.413-421
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    • 2005
  • Copper is able to work as a current collector under wide range of hydrocarbon fuels without coking in Solid oxide fuel cells (SOFCs). The application of copper in SOFC is limited due to its low melting point, which result in coarsening the copper particle. This work focuses on the sintering of copper powder with ceria coating layer. Ceria-coated powder was prepared by thermal decomposition of urea in $Ce(NO_3)_3\cdot6H_2O$ solution, which containing CuO core particles. The ceria-coated powder was characterized by XRD, ICP, and SEM. The thermal stability of the ceria-coated copper in fuel atmosphere $(H_2)$ was observed by SEM. It was found that the ceria coating layer could effectively hinder the grain growth of the copper particles.