• 한국재료학회지
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• 제20권2호
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• pp.90-96
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• 2010

The recirculating electrochemical flow reactor developed at UCLA has been employed to fabricate nanostructured GMR multilayers. For comparison, Ni/Cu multilayers have been electrodeposited from a single bath, from dual baths and from the recirculating electrochemical flow reactor. For a magnetic field of 1.5 kOe, higher GMR (Max. -5%) Ni/Cu multilayers with low electrical resistivity (< $10\;{\mu}{\Omega}{\cdot}cm$) were achieved by the electrochemical flow reactor system than by the dual bath (Max. GMR = -4.2% and < $20\;{\mu}{\Omega}{\cdot}cm$) or the single bath (Max. GMR = -2.1% and < $90\;{\mu}{\Omega}{\cdot}cm$) techniques. Higher GMR effects have been obtained by producing smoother, contiguous layers at lower current densities and by the elimination of oxide film formation by conducting deposition under an inert gas environment. Our preliminary GMR measurements of Ni/Cu multilayers from the electrochemical flow reactor obtained at low magnetic field of 0.15 T, which may approach or exceed the highest reported results (-7% GMR) at magnetic fields > 5 kOe.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1298-1299
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• 2006

In the present work, the influence of the ball-milling time, milling atmosphere and weight ratio of ball to powder on characteristics of $WO_3-CuO$ was studied. Results show that, the grain sizes of the $WO_3$ and CuO in the ball-milled powder mixture were significantly decreased with increasing the milling time. Those of each oxide ball-milled in Argon and Hexane atmosphere for 30 and 20 hour were about 98 and 84 nm, respectively. After milling of 20 hour in Hexane as PCA, the powder had a homogeneously mixed structure and the average size of $WO_3-CuO$ powders was determined to about 230nm.

• 한국결정성장학회지
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• 제13권4호
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• pp.172-175
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• 2003

We have investigated effects of the lattice mismatch between the LPE films and the substrates. We have grown $La_{2-x}Sr_{x}CuO_{4}$(x=0.1 to 0.15) single crystalline films on single crystalline substrates having different lattice parameter ratio c/a e.g., $La_{2-x}Sr_{x}Cu_{1-y}Zn_{y}O_{4},\;La_{2-x}Ba_{x}CuO_{4},\; LaSrAlO_{4}\;and\;La_{2-x}Sr_{x}Cu_{1-y}Al_{y}O_{4}$ etc., using the IR-LPE technique. The superconducting properties of the grown films were found to vary significantly depending on the lattice mismatch with different substrates.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1427-1429
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• 2003

The $ZnNb_2O_6$ ceramics with 3wt% CuO were prepared by the conventional mixed oxide method. The ceramics were sintered at the temperature of $1000^{\circ}C{\sim}1075^{\circ}C$ for 3hr. in air. The structural properties were investigated with sintering temperature by XRD and SEM. Also, the microwave dielectric properties were investigated with sintering temperature. Increasing the sintering temperature, the peak of second phase($Cu_3Nb_2O_8$) was increased. In the case of $ZnNb_2O_6$+CuO(3wt%) ceramics sintered at $1025^{\circ}C$ for 3hr, the dielectric constant, quality factor were 21.73, 19.276, respectively.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.83-84
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• 2006

Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smooths the composition gradient. Perspectives to control this migration are discussed.

• 한국재료학회지
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• 제29권2호
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• pp.65-72
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• 2019

Dual porous structures are observed for the first time on a metallic Cu surface underneath anodic Cu oxide by the application of an anodizing voltage to Cu in oxalic acid. The as-prepared porous Cu surface contains macropores of less than $1{\mu}m$ diameter and mesopores of about tens of nanometers diameter with circular shapes. The size and density (number of pores/area) of the macropores are dependent on the applied voltage. It is likely that the localized dissolution (corrosion) of Cu in oxalic acid under the anodizing voltages is responsible for the formation of the mesopores, and the combination of a number of the mesopores might create the macropores, especially under a relatively high anodizing voltages or a prolonged anodizing time. The variations of pore structure (especailly macropores) with applied voltage and time are reasonably explained on the basis of the proposed mechanism of pore formation.

• 한국분말재료학회지
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• 제16권6호
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• pp.389-395
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• 2009

A Si-CuO-graphite composite was prepared by a mechanical alloying (MA) method. The Si-CuO composite has a mixture structure, where CuO is homogeneously dispersed in Si. Also, $Cu_2O$ and $Cu_3Si$ phases were formed during MA and heat treatment. Graphite with the Si-CuO composite was mixed in the same mill for 30 minutes with weight ratio of Si-CuO composite and graphite as 1:1. The Si-CuO composite was homogeneously covered with graphite. SiC phase was not formed. Electrochemical tests of the composite have been investigated, and the first charge and discharge capacities of the material were about 870mAh/g and 660mAh/g, respectively. Those values are about 76% of the first cycle efficiency. The cycle life of the composite showed that the initial discharge capacity of 660 mAh/g could be maintained up to 92% after 20 cycles.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.148-148
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• 2016

디스플레이 시장이 rigid에서 flexible로 변화하기 시작하면서 유연 투명전극 소재에 대한 수요가 증가하고 있다. 투명전극으로 대표되는 Indium Tin Oxide(ITO)는 고투과 저저항의 장점을 가지지만 유연성이 떨어져 이를 대체 할 투명전극 소재로 Metal mesh, Ag nano-wire, CNT, Graphene, Conductive polymer 등에 대한 응용 연구가 활발히 진행되고 있다. 본 연구에서는 Metal mesh 용 Cu thin film 형성을 위해 플라즈마 표면처리 기술로 플라스틱 기판과 Cu 박막 사이의 밀착력을 향상시키고자 공정 연구를 수행하였다. 고품질의 Cu thin film 제작을 위해 양산용 roll to roll 장비를 이용하였고, 선형이온소스를 적용하여 플라즈마 표면처리를 수행하였다. 이후 마그네트론 스퍼터링을 통해 Ni buffer layer 및 Cu 박막 증착 공정을 in-situ로 진행하였다. 이러한 공정을 통해 제작한 Cu thin film의 밀착력을 평가하기 위해 cross cut test(ASTM D3359)를 수행하였다. 그 결과 플라스틱 기판과 Cu 금속 박막 사이의 밀착력이 0B에서 5B까지 향상된 것을 확인하였고, 플라즈마 표면처리 공정을 통해서 저항 또한 감소되는 결과를 얻을 수 있었다. 본 연구를 통해 polyethylene terephthalate(PET)뿐만 아니라 polyimide(PI) 기판 상에서도 플라즈마 표면처리를 통해 금속 박막의 밀착력이 향상되는 결과를 확인하였으며, flexible copper clad laminate (FCCL) 같은 유연 정보 소자 분야에 응용 가능할 것으로 기대된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.315.1-315.1
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• 2014

The use of cellulose papers has recently attracted much attention in various device applications owing to their natural advantageous properties of earth's abundance, bio-friendly, large-scale production, and flexibility. Conventional metal oxides with novel structures of nanorods, nanospindles, nanowires and nanobelts are being developed for emerging electronic and chemical sensing applications. In this work, both ZnO (n-type) nanorod arrays (NRAs) and CuO (p-type) nanospindles (NSs) were synthesized on cellulose papers and the p-n junction property was investigated using the electrode of indium tin oxide coated polyethylene terephthalate film. To synthesize ZnO and CuO nanostructures on cellulose paper, a simple and facile hydrothermal method was utilized. First, the CuO NSs were synthesized on cellulose paper by a simple soaking process, yielding the well adhered CuO NSs on cellulose paper. After that, the ZnO NRAs were grown on CuO NSs/cellulose paper via a facile hydrothermal route. The as-grown ZnO/CuO NSs on cellulose paper exhibited good crystalline and optical properties. The fabricated p-n junction device showed the I-V characteristics with a rectifying behaviour.

• 한국세라믹학회지
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• 제32권9호
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• pp.1056-1064
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• 1995

95Pb(Mg1/3Nb2/3)O3-5PbTiO3 (hereinafter designated as 95PMN-5PT) system was prepared by the columbite-precursor method with 2 mol% excess PbO to compensate the PbO loss during thermal process. The amount of CuO was 1~10 mol%, and the effects of CuO addition on the dielectric properties of this system have been investigated. From the microstructures, XRD analysis and dielectric measurements, the solubility limit of CuO in 95PMN-5PT was found to be around 3 mol%. Lattice parameter and Curie temperature were found to be decreased as the amount of CuO increased up to the solubility limit. This result confirmed that the Cu2+-ions substituted the Pb2+-ions. It was revealed that the addition of CuO on 95PMN-5PT promoted the sinterability and properties. The room temperature dielectric constant, the loss factor and the specific resistivity of the specimens processed with optimum conditions were 23000, 1%, and 8$\times$1011Ω.cm, respectively.