• Advances in nano research
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• 제16권5호
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• pp.501-508
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• 2024

In this study, nanotoxicity tests were made by exposure of Artemia salina to copper (Cu 60-80 nm) and copper oxide (CuO 40 nm) nanoparticles (NPs) at different concentrations (0.2, 1, 5, 10, 25, and 50 mg/L). The LC₅₀ value of Cu (60-80 nm) NPs on the A. salina individuals at the beginning (0), 24^th, 48^th and 72^nd hours and elimination period was 52.37 mg/L while the LC₅₀ value of CuO (40 nm) NPs was 55.39 mg/L. The results of UV-Vis absorbance values showed that all statistical data revealed that maximum effect was observed between 24-30 hours and 25 ppm absorbance concentration was more effective. The multiple R, correlation coefficient (R2) and adjusted R2 values of Cu NP for the suitable Quadratic model were, respectively; 92.96 %, 86.42 % and 76.71 % while they are 98.31 %, 96.64 % and 94.25 % for CuO NP. Also, the data, was indicated effect size significantly changed based on the type and size of NP. Considering the microscope results, it was clearly noticed that A. salina organisms took the NPs in to their body. The accumulation in the gut of A. salina was observed and the images were taken with phase contrast microscope for both of NPs. The highest decrease for survival rates of A. salina individuals exposed to Cu NP was observed in the 10 ppm concentration (43.47 %) and in the 5 ppm concentration (46.20 %) for CuO NP. The results revealed that Cu and CuO NPS showed different toxic effects and that Cu NPs were more toxic than CuO.

• 한국분말재료학회지
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• 제27권3호
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• pp.193-197
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• 2020

Porous Cu-14 wt% Co with aligned pores is produced by a freeze drying and sintering process. Unidirectional freezing of camphene slurry with CuO-Co₃O₄ powders is conducted, and pores in the frozen specimens are generated by sublimation of the camphene crystals. The dried bodies are hydrogen-reduced at 500℃ and sintered at 800℃ for 1 h. The reduction behavior of the CuO-Co₃O₄ powder mixture is analyzed using a temperature-programmed reduction method in an Ar-10% H₂ atmosphere. The sintered bodies show large and aligned parallel pores in the camphene growth direction. In addition, small pores are distributed around the internal walls of the large pores. The size and fraction of the pores decrease as the amount of solid powder added to the slurry increases. The change in pore characteristics according to the amount of the mixed powder is interpreted to be due to the rearrangement and accumulation behavior of the solid particles in the freezing process of the slurry.

• 한국분말재료학회지
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• 제11권2호
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• pp.143-148
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• 2004

In the present study, $TiO_2$ imbedded composite powders have been successfully prepared from the (Cu. Zn)/$TiO_2$ composite salt solution. The composite (Cu, Zn)/$TiO_2$ powders were formed by drying the solution at 200~$600^{\circ}C$ in the hydrogen atmosphere. Photocatalytic characteristics was evaluated by detecting the decomposition ratio of aniline blue with UV-visible spectrophotometer(Shimazu Co., UV-1601). Phase analysis of (Cu, Zn)/$TiO_2$ composite powders was carried out by XRD and DSC, and powder size was measured with TEM. The mean particle size of composite powders was about 100mm. As the reduction temperature increases, a few zinc sulfide and oxide phases was formed and copper oxide phase was reduced. The decomposition ratio of aniline blue was about 80％ under the UV irradiation by the TiO$_2$ phase in the composite (Cu, Zn)/$TiO_2$ powders and similar decomposition ratio of 80％ was obtained at the UV lightless condition by virtue of Cu and Zn compounds.

• 한국응용과학기술학회지
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• 제16권4호
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• pp.307-311
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• 1999

Interfacial properties of electrode and organic thin layer is one of the most important factor in performing a Light Emitting Diodes(LED). Phthalocyanine copper was used as a buffer layer to improve interface characteristic, so that device efficiency was improved. In this study, LEDs were fabricated as like structures of Indium-Tin-Oxide (ITO) / N,N' -Diphenyl-N,N'-di(m-tolyl)-benzidine (TPD) / 8-Hydroxyquinoline aluminum(Alq) / Aluminum(Al) and Indium-Tin-Oxide(ITO) / N,N'-Diphenyl-N,N' -di(m-tolyl)-benzidine(TPD) / 2-(4-Biphenylyl)-5(4-tert-butyl-phenyl)-1,3,4-oxadiazole(PBD) / Aluminum(Al). In these devices, CuPC was layered at electrode/organic layer interface. As position is changing and thickness is changing, devices showed characteristic luminescence efficiency and luminescence inensity respectively. We showed in this study that luminescence efficiency was improved with CuPC layer in LEDs. The efficiency of device with layer CuPC is higher than that of 2 layer CuPC. However, the luminescence of 2 layer CuPC device got higher value.

• Journal of Welding and Joining
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• 제35권3호
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• pp.7-14
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• 2017

The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by three-point bending test. Both Sn-0.7Cu and SAC305 solders produced the internal $SnO_2$ oxides. Corrosion occurred between the solder and water film near flexible circuit board/copper component. For the SAC305 solder with Ag content, furthermore, octahedral corrosion products were formed near Ag3Sn. For the SAC305 and Sn-0.7Cu solders, the amount of internal oxide increased with the HAST time and the amount of internal oxides was mostly constant regardless of Ag content. The size of the internal oxide was larger for the Sn-0.7Cu solder. Despite of different size of the internal oxide, the fracture time during three-point bending test was not significantly changed. It was because the bending crack was always initiated from the three-point corner of the chip. However, the crack propagation depended on the oxides between the flexible circuit board and the Cu chip. The fracture time of the three-point bending test was dependent more on the crack initiation than on the crack propagation.

• 대한화학회지
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• 제60권4호
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• pp.239-244
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• 2016

안정된 구조로 알려진 산화구리 클러스터(Cu_nO_n, n = 1 - 8)를 이용하여 구리 원자를 규소 원자로 치환하여 Cu_mSiO_m+1 (m = 0 - 7)의 안정된 구조를 최적화하였다. B3LYP/LANL2DZ의 이론수준에서 계산하였으며 중성과 하전된 안정된 구조를 계산하였다. 구리원자를 규소 원자로 치환으로 인한 구조적 변화를 위해 결합길이, 결합각, 그리고 Mulliken 전하를 계산하였다. 클러스터의 상대적 안정성을 구하기 위해 second differences in energy를 계산하였고 전기적 특성을 연구하기 위해 이온화 에너지와 전자친화도 계산을 수행하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• 한국주조공학회지
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• 제18권5호
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• pp.439-449
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• 1998

Formation of oxide inclusions in the molten aluminium alloys during solidification is investigated. The oxidation tendency of both Al-4.5wt%Cu and Al-7wt%Si alloys is increased with melt temperature, particularly over $700^{\circ}C$. However, an Al-5wt%Mg alloy exhibits a decreasing mode over $800^{\circ}C$. The oxidation behavior with holding time shows the S curve shape for all of the alloys. It is shown that the mechanism of oxidation of Al-5wt%Mg alloy has a two step process different from that of Al-4.5wt%Cu and Al-7wt%Si alloys. The species and morphology of oxide inclusions in each alloy is also shown. The microstructure was more coarsened during solidification when the melt contains a large amount of oxide inclusion than when it doesn't. This result can be explained in terms of both the hindrance of heat extraction by oxide film formed on the aluminium melt and the difference of heat capacity between the aluminium melt and oxide inclusion during solidification.

• 대한의생명과학회지
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• 제14권2호
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• pp.105-113
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• 2008

The objective of this study was to evaluate the influence of surface modifications on the bonding characteristics and cytotoxicity of specific titanium porcelain bonded to milling titanium and cast titanium. Milling titanium and cast titanium samples were divided into 8 test groups. These groups are as follow: i) sandblasted with particles of different size of $220{\mu}m\;and\;50{\mu}m$, ii) different sequences of sandblasting treatment and etching treatment, iii) etched with different etching solutions, and iv) preheated or not. The surface characteristics of specimens were characterized by the test of mean roughness of surface and SEM. The bond strength of titanium-ceramic systems was measured by using three-point bending test and SEM. The results show that the mean roughness of surface of sample sandblasted with $220{\mu}m$ aluminum oxide increased and bond strength were higher than sample sandblasted with $50{\mu}m$ aluminum oxide. The mean roughness of surface decreased, but the bond strength increased when the samples sandblasted with $220{\mu}m$ aluminum oxide were preheated. The sample sandblasted with $220{\mu}m$ aluminum oxide after oxidized with occupational corrosive agent I (50% NaOH, 10% $CuSO_4{\cdot}5H_2O$) and II (35% $HNO_3$, 5% HF) showed higher bond strength than sample oxidized with 30% $HNO_3$ after sandblasted with $220{\mu}m$ aluminum oxide. Group NaCuNF220SP (milling Ti: 35.3985 MPa, casting Ti: 37.2306 MPa) which was treated with occupational corrosive agent I (50% NaOH, 10% $CuSO_4{\cdot}5H_2O$) and II (35% $HNO_3$, 5% HF), followed by sandblasting with $220{\mu}m$ aluminum oxide and preheating at $750^{\circ}C$ for 1 hour showed the highest bond strength and significant differences (P<0.05). The method for modifying surface of titanium showed excellent stability of cells.

• 한국수소및신에너지학회논문집
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• 제18권2호
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• pp.140-150
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• 2007

Thermochemical 2-step methane reforming, involving the reduction of metal oxide with methane to produce syngas and the oxidation of the reduced metal oxide with water to produce pure hydrogen, was investigated on ferrite-based metal oxide mediums. The mediums, CoFZ, CuFZ, or MnFZ, were composed of the mixture of M(M=Co, Cu or Mn)-substituted ferrite as an active component and $ZrO_2$ as a binder, respectively. The WZ medium, composed of the mixture of $WO_3$ and $ZrO_2$, was also prepared to compare. With an addition of $ZrO_2$, the surface area of the mediums was slightly increased and the sintering of active components was greatly suppressed during the reduction. The higher reactivity of the reduced mediums for water splitting was confirmed by the temperature programmed reaction. From the results of the thermochemical 2-step methane reforming, the reactivity of $CH_4$ reduction and water splitting with ferrite-based metal oxide mediums was relatively higher than that with WZ, and the order of reactivity of the mediums was MnFZ>CoFZ>CuFZ>WZ.