• 전기화학회지
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• 제14권4호
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• pp.239-244
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• 2011

본 연구에서는 에틸렌글리콜을 사용한 polyol reduction 방법으로 나노크기의 $Fe_3O_4$와 CuO가 각각 그래핀에 분산된 $Fe_3O_4$/graphene, CuO/graphene 복합체를 합성하였으며, 이를 리튬이차전지의 음극활물질로 사용한 전극의 성능을 평가하였다. 합성된 복합체의 물리적 특성은 SEM, XRD, TGA 등으로 분석하였으며, 반쪽전지를 제조하여 충/방전, cyclic voltammetry, 교류 임피던스 등의 전기화학적 특성평가를 수행하였다. 그래핀 표면에 분산된 금속산화물 나노입자들에 의한 용량증가 및 전기적 네트워크 향상 등의 효과로 $Fe_3O_4$/graphene 및 CuO/graphene 복합체의 전극성능이 그래핀 전극보다 우수하였다. 복합체의 경우 30회 충/방전 후에도 600 mAh/g 용량을 유지하였다.

• 분석과학
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• 제20권5호
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• pp.406-412
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• 2007

분광 광도법을 이용하여 ${\beta}$-CD와 $[Cu(dien)(sub-py)]^{2+}$ 이온 간의 복합체 형성에 관한 연구를 하였다. ${\beta}$-CD와 $Cu^{2+}$ 착물이 복합체를 형성 할 때 ${\gamma}_{max}$은 리간드에 전자 주는기($CH_3$)가 치환 된 경우는 $^2T_2{\rightarrow}^2E$로 한 곳에서, 전자 끄는기(Cl)가 치환된 경우는 $^2T_2{\rightarrow}^2E$와 MLCT에 의하여 두 곳에서 나타났다. 형성상수는 온도가 올라가면 결합에너지의 감소로 작아졌다. 모든 반응은 엔트로피의 감소를 보였으나 큰 발열반응으로 자발적 반응이었다. 치환기 상수(${\sigma}_x$)에 따른 Hammett plot 결과 좋은 직선성(${\gamma}=0.996$)을 보여 형성상수를 정량적으로 설명할 수 있었다.

• 한국표면공학회지
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• 제56권5호
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• pp.335-340
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• 2023

Quinary component of 3㎛ thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5-7 nm in dia.) and a thin layer of amorphous Si₃N₄ phase.

• 한국재료학회지
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• 제17권10호
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• pp.509-515
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• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.

• Korean Chemical Engineering Research
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• 제48권1호
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• pp.33-38
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• 2010

구리 이온 농도를 측정하기 위하여 생체재료를 사용하여 마이크로플루이딕 시스템을 제작하였다. 은 전극에 세포막을 모방한 이중층 지질막(bilayer lipid membrane; BLM)을 피복하여 제2 구리 이온 농도를 감지하도록 하였다. 은 전극에 지지된 BLM은 그 안정성이 증대되었다. 은에 지지된 이중층 지질막(s-BLM)은 은 전선을 지질 (phosphatidylcholine; PC) 용액에 담갔다가 KCl 용액에 담글 때 자기조립 특성에 의하여 용이하게 형성할 수 있다. 이 지지된 이중층 지질막(s-BLM)은 $Cu^{2+}$의 농도와 s-BLM을 통과하는 전류 간의 상관 관계를 결정하기 위하여 사용되었다. 얻어진 상관관계는 선형을 보였으며 높은 재현성을 가졌다. $Cu^{2+}$ 농도가 $10{\sim}130{\mu}M$인 범위에서 $Cu^{2+}$ 농도와 전류의 상관관계를 나타내기 위하여 보정 곡선을 구축하였다. 이 보정 곡선을 미지 시료의 $Cu^{2+}$ 농도 측정에 사용하였다. 지지된 이중층 지질막이 구비된 마이크로플루이딕 시스템은 PDMS(polydimethyl siloxane)를 사용하여 전형적인 연질 포토리소그라피와 몰딩 기법으로 제작하였다. 집적된 마이크로플루이딕 시스템은 은 전선을 절단하지 않고도 은 표면을 활성화시키는 기능, 은 표면에 이중층 지질막을 피복하는 기능, KCl 완충 용액을 주입하는 기능, $Cu^{2+}$를 포함한 시료를 주입하는 기능, 시료 중의 $Cu^{2+}$ 농도를 측정하는 기능 등 다중 기능을 가지도록 하였다.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2002년도 추계학술발표회요약집
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• pp.72.1-72
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• 2002

• 한국안전학회지
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• 제8권3호
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• pp.56-63
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• 1993

In this study the ultrasound which has the properties of mixing, surface cleaning effect, increasing of the effective reaction surface area and increasing of the effective collision frequency, was used to enhance the recovering efficiency of Cu from the Cu-ion containning waste water. The ultrasonic reactor used in this study was dsigned and constructed for improving the disadvantage of the existing ultrasonic reactor From the experimental result and its analysis. we obtained following conclusions. 1. The ultrasound increased the rate of electrochemical deposition to 582.2% in maximum at the Condition of 0.1M-CuSO$_4$and 2.1V-overpotential. 2. This study gave the possibility of the scale-up of ultrasonic reactor and In particular, ultrasonic reactor would be effective in treatment of waste water contains a low concentration of Cu ion.

• 대한금속재료학회지
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• 제46권1호
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• pp.20-25
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• 2008

The ionic equilibira in mixed solutions of cuprous and cupric chloride were analyzed by considering chemical equilibria, mass and charge balance equations. The activity coefficients of solutes were calculated by using Bromley equation. Required thermodynamic constants and interaction parameters were evaluated from the data reported in the literature. The effect of NaCl and CuCl concentrations on the pH and potential of the mixed solutions was explained in terms of the variation in the concentration of solutes and in the activity of hydrogen ion. The calculated pH values of the mixed solutions agreed well with the measured values. However, the calculated values for the potential of the mixed solutions were lower than the measured values, indicating the necessity of considering the complex formation between cuprous and chloride ion, such as $Cu^2Cl{_4}^{2-}$ and $Cu_3Cl{_6}^{3-}$.

• 환경위생공학
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• 제14권1호
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• pp.80-87
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• 1999

According to the fact that algae, which is usually used as a biosorbent, contains chlorophyll, we used the chlorophyll as an adsorbent. In this study, chlorophyll is immobilized by agar, which was made of platan, oak, ginkgo and pine. We investigated the removing capacity of biosorbents to toxic heavy metals (Pb, CU, Cd, Zn) in the single ion solution. Then the experimental parameters were pH, reaction time and concentration of heavy metal ions.The optimum conditions for the adsorption of heavy metals were as follows : pH range was 4~5, reaction time was 40mon, and the highest ratio of the removing rate was 50~70 ppm. The order of the amount of Pb, Cu and Cd removed was specified as oak > ginkgo > pine > platan in these conditions and as pine > ginkgo > oak > platan at Zn. Fro the results of the desorption experiments, we found that the heavy metal with the highest ratio of desorption in the single ion adsorbent was Cu.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2005년도 추계학술발표대회 논문집
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• pp.75-78
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• 2005

Using a low-energy Ar+ ion-beam with and without reactive gases, polymers such as chemically stable poly(ether ether ketone) (PTFE) and poly(ether ether ketone) (PEEK) films were modified to have special surface features. The adhesion strength between the polymers and the copper was significantly improved because of both changes in the surface topography and chemical interactions due to polymer surface functionalization (oxidation and amination). The surface modification altered the failure mode from adhesive failure for the unmodified polymer/Cu interface to cohesive failure for the surface-modified polymer/Cu layer interface..