• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.45-48
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• 2003

BiSrCaCuO thin films were fabricated by atomic layer-by-layer deposition using an ion beam sputtering method. 10 wt% and 90 wt% ozone mixed with oxygen were used with ultraviolet light irradiation to assist oxidation. At early stages of the atomic layer by layer deposition, two dimensional epitaxial growth which covers the substrate surface would be suppressed by the stress and strain caused by the lattice misfit, then three dimensional growth takes place. Since Cu element is the most difficult to oxidize, only Sr and Bi react with each other predominantly, and forms a buffer layer on the substrate in an amorphous-like structure, which is changed to $SrBi_2O_4$ by in-situ anneal.

• Journal of the Korean Vacuum Society
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• v.2 no.3
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• pp.294-298
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• 1993

CuGaSe2 단결정을 고순도(99.9999%)의 Cu, Se 원소를 화학조성비로 칭량한 후 Se을 3mole% 과잉으로 첨가하여 합성된 ingot를 사용하여 iodine(99.9999%)을 수송매체로 한 화학수송법으로 성장시켰다. 성장된 단결정은 검정색을 띠고 있었으며, 10K에서 optical energy gap이 1.755eV로 주어졌다. Ar-ion laser로 여기시켜 측정한 photoluminescence(PL) 스펙트럼으로부터 1.667eV, 1.085eV, 1.025eV에 위치한 세 개의 PL peak를 얻었다. Thermally stimulated current(TSC) 측정에서 0.660eV, 0.720eV의 deep donor level을 관측하였으며, PL peak intensity의 thermal quenching으로 구한 activation energy는 0.010eV이었다. CuGaSe2 단결정에서 PL mechanism은 edge emission 및 donor-acceptor pair recombination임을 규명했다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.1
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• pp.128-131
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• 2007

YBaCuO superconducting ceramic thick films were fabricated by chemical process. YBaCuO films have been successfully grown on $SrTiO_3$ substrates without a template layer. The films show poor or non superconductivity although they have excellent crystalline properties. ion channeling measurement made it clear that the strain in the films due to strong chemical bonding between the substrate and epilayer remains, resulting in the poor superconductivity. The X ray diffraction pattern of the YBaCuO thick films contained 90K phase. The self template method have resolved this problem. We obtained high-Jc as-grown YBaCuO on $SrTiO_3$ (100).

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.8
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• pp.966-971
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• 1988

AES was used to study oxygen adsorption due to the oxygen exposure at 300\ulcorner temperature and segregation of impurities due to annealing on polycrystal copper surface. The intensity of peak of CuM2, 3VV and CuL3 VV increased with annealing time and the peak of CKLL increased after Ar ion bombardment. The effect of oxygen adsorption on copper surface at 300\ulcorner was verified by the decreased of peak of CuM2, 3VV and CuL3 VV as oxygen exposure increase. The binding energy of copper atoms gradualy shifts from 0.7eV to 1.5eV of copper atoms gradually shifts from 0.7eV to 1.5eV after a oxygen exposure. After the oxygen exposure, the width at half the height of CuM2, 3VV is larger 2V*C/S by the effect of chemical liaison of the copper aton with oxygen atom.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1230-1233
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• 2004

Ozone is useful oxidizing gas for the fabrication of oxide thin films. Accordingly researching on oxidizing gas is required. In order to obtain high quality oxide thin films, higher ozone concentration is necessary. In this paper oxidation property was evaluated relation between oxide gas pressure and inverse temperature(CuO reaction). The obtained condition was formulated by the fabrication of Cu metal thin film by co-deposition using the ion Beam Sputtering method. Because the CuO phase peak appeared at the XRD evaluation of the CuO thin film using ozone gas, this study has succeeded in the fabrication of the CuO phase at $825^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.110-113
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• 2005

Ozone is useful oxidizing gas for the fabrication of BSCCO thin films. In order to obtain high quality oxide BSCCO thin films, higher ozone concentration is necessary. The growth rates of the films was set in the region from 0.17 to 0.27 nm/min. MgO(100) was used as a substrate. In this paper oxidation property was evaluated relation between oxide gas pressure and inverse temperature(CuO reaction). The obtained condition was formulated by the fabrication of Cu metal thin film by co-deposition using the Ion Beam Sputtering method. Because the CuO phase peak appeared at the XRD evaluation of the CuO thin film using ozone gas, this study has succeeded in the fabrication of the CuO phase at $825^{\circ}C$.

• Bulletin of the Korean Chemical Society
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• v.34 no.4
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• pp.1061-1064
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• 2013

A known $Hg^{2+}$ selective rhodamine B derivatised probe 1 was reinvestigated as a colorimetric and fluorescent probe for $Cu^{2+}$ through changing the applied solvent media. Probe 1 exhibited good selectivity and sensitivity to $Cu^{2+}$ in $CH_3CN-H_2O$ (7:3, v/v, HEPES 10 mM, pH 7.0) solution with a detection limit of $9.74{\times}10^{-7}$ M. The $Cu^{2+}$ sensing event was proved to be irreversible through hydrolysis of 1 to release rhodamine B.

• Journal of Surface Science and Engineering
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• v.4 no.1
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.2
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• pp.97-101
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• 2003

New Pt/Ti and hi/Ti double-metal structures have been investigated for the application of a diffusion barrier between Cu and Si in deep submicron integrated circuits. Pt/Ti and Ni/Ti were deposited using E-beam evaporator at room temperature. The performance of Pt/Ti and Ni/Ti structures as diffusion barrier against Cu diffusion was examined by charge pumping method, gate leakage current, junction leakage current, and SIMS(secondary ion mass spectroscopy). These evaluation indicated that Pt/Ti(200${\AA}$/100${\AA}$) film is a good barrier against Cu diffusion up to 450$^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04a
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• pp.35-38
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• 2004

Ozone is useful oxidizing gas for the fabrication of oxide thin films. Accordingly researching on oxidizing gas is required. In order to obtain high quality oxide thin films, higher ozone concentration is necessary. In this paper oxidation property was evaluated relation between oxide gas pressure and inverse temperature(CuO reaction). The obtained condition was formulated by the fabrication of Cu metal thin film by co-deposition using the Ion Beam Sputtering method. Because the CuO phase peak appeared at the XRD evaluation of the CuO thin film using ozone gas, this study has succeeded in the fabrication of the CuO phase at $825^{\circ}C$.