• Journal of the Korean Electrochemical Society
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• v.11 no.3
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• pp.159-164
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• 2008

We investigated chloride ion effects on anodic dissolution of copper using potentiodynamic method, cyclic voltammtery, chronoamperometry and chronocoulometry. The anodic dissolution reaction of copper in NaCl solution under argon atmosphere is $Cu+2Cl^{-}{\rightleftharpoons}{CuCl_2}^{-}+e^-$ and chloride ion adsorption process in copper surface can be explained by Temkin isotherm.

• Journal of the Korean Ceramic Society
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• v.32 no.10
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• pp.1093-1102
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• 1995

Water-soluble phosphate glasses containing Ag or Cu ion were prepared through melting process. Then the powdered glass samples were dissolved in D.I. water at room temperature with changing the dissolution time. In terms with the glass composition, dissolution characteristics, bactericidal effects and cytotoxicities were investigated. Dissolved amounts increased uniformly with dissolution time, and the dissolution rate was higher for ternary glass than for binary glass and with less metal oxide amount. And the dissolution rate of the glass with Ag ion was higher than that with Cu ion, and the bactericidal effect of the glass with Ag ion was also greater. Solution with more than 25 ppm of Ag was observed to have strong cytotoxicity to L929, and solutions of lower Ag concentration or with Cu seemed to have little cytotoxicity.

• Journal of Korean Society of Environmental Engineers
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• v.22 no.3
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• pp.547-556
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• 2000

A study have been conducted for the adsorption and desorption characteristics of Cu ion using manganese nodule as adsorbent. For 100 ppm Cu ion solution, the adsorbed amount of Cu ion was more than 90 % at equilibrium state. Adsorption was equilibrated in 42 hours the adsorption reaction was shown to be first order reaction. For the desorption reaction of Cu ion in the region of solution pH 3.5~9.5, the desorption was completed in the acidic region, but it has been decreased as the pH was raised. Also, the desorption rate was higher in the acidic region compared with alkaline region. The desorbed amount was decreased as the reaction temperature increased, therefore, the desorption reaction was thought to be exothermic. Also, several thermodynamic properties were calculated based on experimental results and compared with theoretically driven values. To see the effect of complexing agent on the desorption of Cu ion, EDTA was introduced and the des orbed amount increased in the presence of EDTA.

• Bulletin of the Korean Chemical Society
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• v.12 no.5
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• pp.499-504
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• 1991

EPR spectra of the high $T_c$ superconductor $YBa_2Cu_3O_{7-y}$ (YBCO) doped with $Pd^{2+} or Zn^{2+}$ have been measured at several temperatures and dopant concentrations. The spectral intensity of $YBa_2({Cu_{1-x}}{Pd_x})_3O_{7-y}$ is proportional to the dopant concentration. The behavior of $YBa_2(Cu_{1-x}Zn_x)_3O_{7-y}$ is quite different: the spectral intensity remains almost constant up to x=0.10 and then increases rapidly above x=0.10. The results are interpreted in terms of localized and antiferromagnetically spin-paired d holes in both CuO chain and planes. The $Pd_{2+}$ ion substitutes on the CuO chain consisting of "CuOCu dimers", and a $Cu_{2+}$ ion with an unpaired spin is gene rated for each $Pd_{2+}$ ion substituted. On the other hand, $Zn_{2+}$ substitutes on the CuO planes, and all or most of the spins in the two-dimensional plane manage to pair up in the region of low dopant concentration. When the dopant concentration exceeds a certain limit, it becomes more difficult for the spins to find partners, and the number of unpaired spins increases rapidly with increasing dopant concentration. The $Zn_{2+}$ ion is more effective than the $Pd_{2+}$ ion in suppressing the superconductivity of YBCO. This is attributed to the fact that $Zn_{2+}$ substitutes on the CuO planes which are mainly responsible for the superconductivity, while $Pd_{2+}$ substitutes on the CuO chain which is of secondary importance in the superconductivity.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.1
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• pp.32-44
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• 2002

Selective catalytic reduction of nitric oxide by methane in the presence of excess oxygen was investigated over copper and cobalt ion-exchanged ZSM-5 zeolites. Copper ion-exchanged ZSM-5(Cu-ZSM-5) has the limitations for commercial applications to lean-bum gasoline and diesel engines due to low thermal stability and resistance to water vapor and sulfur dioxide. But cobalt ion-exchanged ESM-5(Co-ZSM-5) is more active at high temperatures and also stable to water vapor and sulfur dioxide for catalytic reduction of nitric oxide by methane. The catalytic activity of Cu-ZSM-5 for NO reduction increases with increasing temperatures, reaches the maximum conversion of 23.0% at 350\"C. and then decreases with higher temperatures. In the meantime catalytic activities of Co-ZSM-5 show the maximum conversion of 25.8% at $500^{\circ}C$ Therefore Co-ZSM-5 catalysts have higher thermal stability at high temperatures. Catalytic activities of both zeolites were remarkably enhanced with the existence of oxygen in the exhaust. It is noted that the catalytic activity of Cu-ZSM-5 decreases with the increasing concentration of methane while the catalytic activity of Co-ZSM-5 decreases with increasing contents of methane in the exhaust. This may imply the existence of different paths of NO reduction by methane in the presence of excess oxygen fur Cu-ZSM-5 and Co-ZSM-5 catalysts. For binary metal ionexchanged ZSM-5, the primary ion-exchanged metal may be masked by secondary ion-exchanged component, which plays the important role for catalytic activities of binary metal ion-exchanged ZSM-5, Therefore CuCo-ZSM-5 catalysts show the similar volcano-shaped curves to Cu-ZSM-5 catalysts between the activity and temperature. It Is interesting that the activities of CoCu-ZSM-5 catalysts indicate almost no dependence on the concentration of methane in the exhaust.aust.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.334-334
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• 2011

We applied N-ion bombardment and heat treatment to the Cu thin films deposited on aluminum oxide layer for the enhancement of adhesion. With e-beam evaporation method. $1,000{\AA}$ thick Cu pre-bombardment layer was deposited on the aluminum oxide surface and then N-ion beam was bombared in order to mix the atoms at the film/substrate interface. Additional $4,000{\AA}$-thick Cu film was the coated. Subsequently, the ion mixide Cu on aluminum oxide was annealed at $200^{\circ}C$ and $300^{\circ}C$ in vacuum.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.546-549
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• 1993

The correlation between electrical conduct ion and dielectric relaxation properties of copper ion conducting glasses is discussed. The glasses were prepared in the system $CuI-Cu_2S-Cu_2O-MoO_3$ using rapid quenching technique. These glasses have high ionic conductivities at room temperature in the range of $10^{circ}$[S/m], and the conductivities increase with increasing CuI content. The activation energies for conduction are 0.26-0.57 eV. The dielectric relaxation times are 1-10uS, and the activation energy for ion jumping are 0.18-0.41eV. It is shown that the tendency of conduction properties depending on composition of the glass is similar those of dilectric relaxation.

• Analytical Science and Technology
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• v.8 no.4
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• pp.529-534
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• 1995

The metal ion selective resins were prepared by surface template polymerization using monooleyl phosphoric acid (1), oleyl methyl phosphoric acid (2) or oleyl ethyl phosphoric acid (3) as an amphiphilic host surfactant. The $Cu^{2+}$-imprinted resins prepared in the presence of $Cu^{2+}$ adsorbed $Cu^{2+}$ much more effectively than did their reference resins. On the other hand, the $Cu^{2+}$-imprinted resins showed much less binding ability to $Zn^{2+}$. The template-dependent selectivity should be ascribed to a favorable placement of the surface-anchored metallophilic groups for multidentate coordination to specific metal ion.

• Bulletin of the Korean Chemical Society
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• v.15 no.5
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• pp.341-346
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• 1994

The frameworks of $(Cu(NH_3)_3OH^+)_x(NH_4^+)_{12-x}-A{\cdot} zH_2O$ which were prepared by the ion-exchange of zeolite A with ammoniac cupric nitrate solution are more stable than those of $Cu_xNa_{12-2x} -A$ obtained by the ion exchange with aqueous cupric nitrate solution are more stable than those of $Cu_xNa_{12-2x} -A$ obtained by the ion exchange with aqueous cupric nitrate solution. An energetic calculation was made on the relatively stable $(CuOH^+)_2(NH_4^+)_{10}-A{\cdot} 2H_2O$ prepared by the partial evacuation of $(Cu(NH_3)_3OH^+)_2(NH_4^+)_{10}-A{\cdot} zH_2O$. The mean stabilization energies of water, OH-, and $NH_4^+$ ions are -30.23 kcal/mol, -60.24 kcal/mol, and -16.65 kcal/mol, respectively. The results of calculation were discussed in terms of framework stability. The $(Cu(NH_3)_3OH^+)_2(NH_4^+)_{10}-A{\cdot} zH_2O$ zeolite shows two step deammoniation reactions. The first deammoniation around 210 $^{\circ}$C (third DSC peak) was attributed to the decomposition of $[Cu(NH_3)_3OH^+]$ ion and the second one around 380 $^{\circ}$C (fourth DSC peak) was ascribed to the decomposition of $NH_4^+$ ion. The activation energies of the first and second deammoniation reactions were 99.75 kJ/mol and 176.57 kJ/mol, respectively.

• Journal of the Korean Chemical Society
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• v.37 no.8
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• pp.723-729
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• 1993

Cu(II) ion-responsive chemically modifed electrodes (CMEs) were constructed by incorporating 1-(2-pyridylazo)-2-naphthol (PAN) into a conventional carbon-paste mixture of graphite powder and Nujol oil. Cu(II) ion was chemically deposited on the surface of the PAN-chemically modified electrode in the absence of an applied potential by immersion of the electrode in a buffer solution (pH 3.2) containing Cu(II) ion, and then reduced at a constant potential in 0.1 M KNO$_3$. And a well-defined voltammetric peak could be obtained by scanning the potential to the positive direction. The electrode surface could be regenerated with exposure to acid solution and reused for the determination of Cu(II) ion. In 5 deposition / measurement / regeneration cycles, the response could be reproduced with 6.1${\%}$ relative standard deviation. In case of using the differential pulse voltammetry, the calibration curve for Cu(II) was linear over the range of 2.0 ${times}$ 10$^{-7}$ ∼ 1.0 ${times}$ 10$^{-6}$ M. And the detection limit was 6.0 ${times}$ 10$^{-8}$ M. Studies of the effect of diverse ions showed that Co, Ni, Zn, Pb, Mg and Ag ions added 10 times more than Cu(II) ion did not influence on the determination of Cu(II) ion, except EDTA and oxalate ions.