• Title/Summary/Keyword: Cu Electrodeposition

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Mathematical Modeling on Electrodeposition of Compositionally Modulated Cu-Ni Alloy (전기화학적 방법에 의한 Cu-Ni 다층박막합금의 수학적 모델링)

  • 박경완;이철경;손헌준
    • Journal of the Korean institute of surface engineering
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    • v.27 no.4
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    • pp.223-233
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    • 1994
  • It is well known that compositionally modulated Cu-Ni alloy can be produced by an electrochemical method in Ni sulfate solution containing trace amount of Cu. a mathematical model is presented to describe the current distribution and weight percent of Cu in Ni layer on the rotating disk electrode. The model includes convective-diffusion equation, the Laplace's equation and various overpotentials, and is solved numerically. The thickness of Cu layer is almost uniform whereas the thickness of Ni layer as well as the Ni/Cu weight ratio are increased approaching to the edge of the disk. These results agree well with the experimental values. The ohmic potential drop is suggested as a major cause of a nonuniformity in Ni layer. The optimum plating condition for the fabrication of susperlattice is proposed based on the results of this study.

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The Enhanced Off-Diagonal Magneto-Impedance Effect in Cu/Ni80Fe20 Core-Shell Composite Wires Fabricated by Electrodeposition under Torsional Strain (비틀림 스트레인 하에서 전기도금으로 만든 Cu 코어/Ni80Fe20 쉘 복합 와이어에서 비대각 자기임피던스(Off-diagonal Magneto-Impedance) 효과의 증대)

  • Kim, Dong Young;Yoon, Seok Soo;Lee, Sang Hun
    • Journal of the Korean Magnetics Society
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    • v.27 no.4
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    • pp.135-139
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    • 2017
  • The magneto-impedance effect (MI effect) has been investigated in metal core/soft magnetic shell composite wires fabricated by electrodeposition of $Ni_{80}Fe_{20}$ on Cu wire (diameter $190{\mu}m$). The diagonal impedances $Z_{zz}$ and $Z_{{\theta}{\theta}}$ in cylindrical coordinate showed strong MI effect for the magnetic field applied along z-axis, while the off-diagonal impedance $Z_{{\theta}z}$ showed very weak MI effect. We have tried to develop the Cu $core/Ni_{80}Fe_{20}$ shell composite wire having strong MI effect in off-diagonal impedance by electrodeposion under torsional strain. The core/shell composite wire electrodeposited under torsional angles above $270^{\circ}$ showed significantly enhanced MI effect in the off-diagonal impedance. The maximum MI effect was observed in the composite wire electrodeposited under torsional angle of $360^{\circ}$. The developed method to enhance off-diagonal MI effect is expected to increase the applicability of the core/shell composite wire to magnetic sensor material.

A Study on the Kinetics of Copper Ions Reduction and Deposition Morphology with the Rotating Disk Electrode (RDE를 이용한 구리이온의 환원속도 및 전착형태에 관한 고찰)

  • Nam, Sang Cheol;Um, Sung Hyun;Lee, Choong Young;Tak, Yongsug;Nam, Chong Woo
    • Applied Chemistry for Engineering
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    • v.8 no.4
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    • pp.645-652
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    • 1997
  • Electrochemical characteristics and kinetic parameters of copper ion reduction were investigated with a platinum rotating disk electrode (RDE) in a diffusion controlled region. Reduction of Cu(II) in sulfate had one-step two-xelectron process, while the reduction of Cu(II) in chloride solution was involved two one-electron processes. The transfer coefficient of Cu(II) in sulfate solution was lowest, and the transfer coefficient of Cu(I) in halide solutions had the value of nearly one. In chloride solutions, electrodeposition rate of Cu(II) was about one hundred times faster than Cu(I). Diffusion coefficient increased in the order of Cu(II) in chloride solution, Cu(I) in the iodide, bromide, chloride solution, Cu(II) in sulfate solution. The calculated ionic radii and activation energy for diffusion decreased in the same order as above. Morphological study on the copper electrodeposition indicated that the electrode surface became rougher as both concentration and reduction potential increases, and the roughness of the surface was analyzed with UV/VIS spectrophotometer.

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Magnetic Properties of Thin Cu/Co Multilayers Made by Electrodeposition

  • Lee, Jung-Ju;Lee, Jin-Han;Hong, Kim-In
    • Journal of Magnetics
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    • v.10 no.3
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    • pp.118-121
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    • 2005
  • We have investigated the magnetic properties of electroplated thin Cu/Co multilayers by using electrolytes made of copper sulphate and cobalt sulphate and by applying alternating plating voltage. While the multilayers plated with pure electrolyte showed superparamagnetism, those plated with organic additives showed ferromagnetic behavior. These changes are attributed to the so-called 'self-annealing' effect and reduction of grain size caused by the organic additives.

Synthesis and Characterization of Cu Nanowires Using Anodic Alumina Template Based Electrochemical Deposition Method (양극산화 알루미나 주형 기반의 전해 증착법을 이용한 구리 나노선의 합성 및 특성 연구)

  • Lee, Young-In;Choa, Yong-Ho
    • Journal of Powder Materials
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    • v.19 no.5
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    • pp.367-372
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    • 2012
  • Single crystalline Cu nanowires with controlled diameters and aspect ratios have been synthesized using electrochemical deposition within confined nanochannels of a porous anodic aluminium oxide(AAO) template. The diameters of nano-sized cylindrical pores in AAO template were adjusted by controlling the anodization conditions. Cu nanowires with diameters of approximately 38, 99, 274 nm were synthesized by the electrodeposition using the AAO templates. The crystal structure, morphology and microstructure of the Cu nanowires were systematically investigated using XRD, FE-SEM, TEM and SAED. Investigation results revealed that the Cu nanowires had the controlled diameter, high aspect ratio and single crystalline nature.

Electrodeposition of p-type oxide Cu2O thin films and their doping properties (p-형 산화물 반도체 Cu2O 박막의 전기화학증착 및 도핑 연구)

  • Baek, Seung-Gi;Jo, Hyeong-Gyun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.107-107
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    • 2014
  • p형 자원 친화형 산화물 기반 능동형 층 성장에 대한 연구는 아직 개발 초기 단계이다. $Cu_2O$는 이러한 자원 친화형 저가 p형 산화물 중 하나로서 다양한 광학 응용분야에 있어 적용되고 있으며 특히 저가형 증착법인 전기증착법을 통해 형성시킨다면 가격 절감을 극대화 시킬 수 있다. 하지만 낮은 전도성으로 인해 전자소자에는 적용시키기 어렵다는 단점이 있기 때문에 본 연구팀은 5족 물질인 Antimony 를 $Cu_2O$의 p형 도펀트로 적용시켜 전기적 구조적 특성을 개선시키고자 하였다. 결과적으로 [111] 방향으로 높은 우선배향성을 갖고 전도성이 향상된 Sb-Cu2O 박막을 확인하였다.

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Effect of Current Density and Solution pH on Properties of Electrodeposited Cu Thin Films from Sulfate Baths for FCCL Applications (Sulfate 용액을 이용하여 전기도금 한 FCCL용 Cu 필름의 특성에 미치는 전류밀도와 pH의 영향)

  • Shin, Dong-Yul;Park, Doek-Yong;Koo, Bon-Keup
    • Journal of the Korean institute of surface engineering
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    • v.42 no.4
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    • pp.145-151
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    • 2009
  • Nanocrystalline Cu thin films for FCCL were electrodeposited from sulfate baths to investigate systematically the influences of current density, solution pH on current efficiency, residual stress, surface morphology, and microstructure of thin Cu films. Current efficiencies were measured to be approximately 100%, irrespective of the applied current density and solution pH. But these influenced residual stress, surface morphology, XRD pattern, and grain size of electrodeposited Cu thin film. The residual stress decreased with decreasing the surface roughness, but increased with increasing the fcc(111) peak strength of XRD patterns.

Development of catalyst-substrate integrated copper cobalt oxide electrode using electrodeposition for anion exchange membrane water electrolysis (전착법을 이용한 촉매-기판 일체형 구리 코발트 산화물 전극 개발 및 음이온 교환막 수전해 적용)

  • Kim, Dohyung;Kim, Geul Han;Choi, Sung Mook;Lee, Ji-hoon;Jung, Jaehoon;Lee, Kyung-Bok;Yang, Juchan
    • Journal of the Korean institute of surface engineering
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    • v.55 no.3
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    • pp.180-186
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    • 2022
  • The production of hydrogen via water electrolysis (i.e., green hydrogen) using renewable energy is key to the development of a sustainable society. However, most current electrocatalysts are based on expensive precious metals and require the use of highly purified water in the electrolyte. We demonstrated the preparation of a non-precious metal catalyst based on CuCo2O4 (CCO) via simple electrodeposition. Further, an optimization process for electrodeposition potential, solution concentration and electrodeposition method was develop for a catalyst-substrate integrated electrode, which indicated the highly electrocatalytic performance of the material in electrochemical tests and when applied to an anion exchange membrane water electrolyzer.