• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.909-911
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Journal of the Korean institute of surface engineering
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• v.40 no.1
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• pp.16-22
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• 2007

Recently, mesoporous metallic materials are becoming more and more important in various applications like catalysts, electrochemical detectors, batteries, and fuel cells because of their high surface area. Among the various methods for manufacturing mesoporous structure, surfactant templating method followed by electroplating has been tried in this study. A mesoporous metallic film was prepared by electrodeposition from electroplating solution mixed with surfactant template. Nonionic type lyotropic liquid crystalline surfactant, Brij56, and nickel acetate based solution were selected as a template material and electroplating solution, respectively. To determine the content of surfactant forming a hexagonal column structure, the phase diagram of electroplating solution and surfactant mixture has been exploited by polarized optical microscopy equipped with heating and cooling stage. Nickel films were electroplated on Cu foil by stepwise potential input method to alleviate the concentration polarization occurred during the electroplating process. TEM and XRD analyses were performed to characterize the size and shape of mesostructures in manufactured nickel films, and electrochemical characterization was also carried out using cyclic voltammetry.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.123.1-123.1
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• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.294-294
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• 2010

CdS는 $CuInSe_2$계, CdTe계 이종접합 태양전지의 junction partner로 많이 이용되어 왔다. CdS는 전극으로 쓰일 뿐만 아니라 빛을 투과시키는 창문층으로 사용되어 높은 변환 효율을 나타낸다. 이종접합 태양전지에서 창문층은 가시광 영역에서 광투과율이 높고, 전기적으로 비저항이 낮아야 에너지 손실 없이 태양광을 광흡수층까지 투과시킬 수 있다. CdS 박막은 CBD법(solution growth technique), 진공증착법(vacuum evaporation), 스퍼터법(sputtering), 스프레이 열분해법(spray pyrolysis), 전착법(electrodeposition)에 의해 제조되고, 그 중 용액성장법(solution growth technique)이라고도 불리는 CBD법(chemical bath deposition)을 이용하여 CdS 박막을 제조하였다. CBD법은 다른 방법에 비해 제조 과정이 비교적 간단할 뿐만 아니라 제조 단가가 저렴하고, 넓은 면적의 박막 제조가 가능하며 재현성도 우수하다는 장점이 있다. CdS 박막을 제조하기 위한 cadmuim 이온공급원으로는 $CdSO_4$를 사용하였고 sulfur 이온공급원으로는 $SC(NH_2)_2$를 사용하였다. CBD법에서 박막의 물성에 영향을 미칠 수 있는 요인인 sulfur 이온공급원과 cadmium 이온공급원의 비, 용액의 온도, pH를 변화시켜 CdS 박막을 제조하였다. 각각의 조건에 의해 제조된 CdS의 박막의 두께는 Tencor P-1을 이용하여 측정되었고, UV-Visible spectrometer를 이용하여 파장에 따른 광투과율을 측정하였다. CdS 박막의 결정 구조를 조사하기 위해 X선 회절분석(XRD ; X-ray diffraction)을 하였고, AFM(Atomic Force Microscope)으로 표면 특성을 관찰하였다.

• Journal of the Korean institute of surface engineering
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• v.27 no.5
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.248-255
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• 2009

A micro thermoelectric device was processed by electroplating the n-type Bi-Te nanowires and ptype Sb-Te nanowires into an alumina template with 200 nm pores. Power generation characteristics of the micro devices composed of the Bi-Te nanowires, the Sb-Te nanowires, and both the Bi-Te and the Sb-Te nanowires were analyzed with applying a temperature difference of $40^{\circ}C$ across the devices along the thickness direction. The n-type Bi-Te and the p-type Sb-Te nanowire devices exhibited thermoelectric power outputs of $3.8{\times}10^{-10}W$ and $4.8{\times}10^{-10}W$, respectively. The output power of the device composed of both the Bi-Te and the Sb-Te nanowires decreased to $1.4{\times}10^{-10}W$ due to a large electrical resistance of the Cu electrode connecting the Bi-Te nanowire array with the Sb-Te nanowire array.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.443-443
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• 2014

CIS 박막을 제조하기 위한 방법으로 셀렌화(selenization)방식, MOCVD방식, 동시진공증발(co-evaporation)방식, 전착(electrodeposition)방식 등이 있으나, 이러한 방식을 이용하여 CuInSe2 박막을 제조하는 경우 어떤 방법으로든 다원화합물의 조성 및 결정성을 조절하기가 매우 어려운 단점이 있었다. 기판의 온도를 일정 온도로 유지하도록 하고, 증발원을 가열하여 이에 내포된 물질(이원화합물 또는 단일원소)을 증발시켜 기판에 증착이 이루어지도록 하거나, 기판의 온도를 승온시키고 구리 이원화합물을 내포한 증발원을 가열해 물질을 증발시켜 기판에 증착이 이루어지도록 하는 방법으로 기판에 박막이 형성되도록 한다. 기판의 대면적화로 인해 균일한 박막의 형성이 어려워지고 있으며, 이중 15% 이상의 고효율을 보인 방법은 3-stage process를 이용한 동시진공증발방식으로, Cu, In, Ga, Se 등의 각 원소를 동시에 진공 증발시키면서 조성을 조절하여 태양전지에 적절한 전기적, 광학적 특성을 가지는 Cu(In,Ga)Se2 (CIGS)박막을 증착시키는 방법이다. 일반적으로, 실험실에서 연구되고 있는 장비의 구조는 증발원이 아래에 장착되어서 상향 증착되는 방식이다. 본 연구에서 사용된 장비는 하향 증발원이 측면에 장착되어서 하향 증착되는 방식으로 구성하였다. 증착되는 면방향으로, 적외선온도계(pyrometer)가 설치된 시창(viewport)의 오염 등으로 인하여, 지속적인 공정이 이루어지기 힘든 점을 개선하여 증착기판의 후면에 적외선 온도계를 설치하여 기판의 온도변화를 감지하여 공정에 반영할 수 있도록 하였다. 본 연구에서는 하향식 진공 증발원, 기판후면 온도모니터링모듈 등을 개발 장착하여, CIGS 박막을 제조하였으며, 버퍼층은 moving 스퍼터링법으로 ZnS를 증착하였고, 투명전극층은 PLD(Pulsed Laser Deposition)를 이용하여 제조하였다. 가장 높은 광변환효율을 보인 Al/ZnO/CdS/Mo/SLG박막시료는 유효면적 $0.45cm^2$에 광변환효율 15.65 %, Jsc : $33.59mA/cm^2$, Voc : 0.64 V, FF : 73.09 %를 얻을 수 있었으며, CdS를 ZnS로 대체한 Al/ZnO/ZnS/Mo/SLG박막시료는 유효면적 $0.45cm^2$에 광변환효율 12.45 %, Jsc : $33.62mA/cm^2$, Voc : 0.59 V, FF : 62.35 %를 얻을 수 있었다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.2
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• pp.87-90
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• 2008

Co-Pt alloy thin films were galvanostatically electrodeposited on Ru (30 nm)/Ta (5 nm)/Si (100) substrates from a amino-citrate based electrolyte. We used Ru(0002)-oriented buffer layers to control the crystallinity and orientation of the Co-Pt alloy thin films. The effect of solution temperature on the microstructure and magnetic properties of the Co-Pt alloy thin film was investigated. The samples were characterized by EDS, FESEM, XRD diffractometer using Cu $K{\alpha}$ radiation. The magnetic properties of these films were analyzed by a VSM and torque magnetometer. The Co-Pt alloy thin films were exhibited very high out-of-plane coercivity and squareness of the multilayer were 6527 Oe and 0.93, respectively, without heat treatment.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.79-90
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• 2007

Prototype of $800{\ell}$ vacuum web coater (Vic Mama) consisting of ion source with low energy less than 250 eV for high speed surface modification and 4 magnetron sputter cathodes was designed and constructed. Its performance was evaluated through fabricating the adhesiveless flexible copper clad laminate (FCCL). Pumping speed was monitored in both upper noncoating zone pumped down by 2 turbo pumps with 2000 l/sec pumping speed and lower surface modification and sputter zone vacuumed by turbo pumps with 450 1/sec and 1300 1/sec pumping speed respectively. Ion current density, plasma density, and uniformity of ion beam current were measured using Faraday cup and the distribution of magnetic field and erosion efficiency of sputter target were also investigated. With the irradiation of ion beams on polyimide (Kapton-E, $38{\mu}m$) at different fluences, the change of wetting angle of the deionized water to polyimide surface and those of surface chemical bonding were analyzed by wetting anglometer and x-ray photoelectron spectroscopy. After investigating the deposition rate of Ni-Cr tie layer and Cu layer was investigated with the variations of roll speed and input power to sputter cathode. FCCL fabricated by sputter and electrodeposition method and characterized in terms of the peel strength, thermal and chemical stability.