• Title/Summary/Keyword: Cu 첨가제

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Removal of Copper Ion with Iron-Oxide-Coated Sand (산화철 피복사에 의한 구리이온제거)

  • 곽명화;우성훈;김익성;박승조
    • Resources Recycling
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    • v.9 no.1
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    • pp.70-75
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    • 2000
  • The sand particle was coated with $Fe_3O_4$ and then $Fe_2O_3$ that adsorption capacity was more excellent than $Fe_3O_4$ was mostly found in 2nd step for preparation of iron-oxide-coated sand (IOCS). The copper removal rate was 74.9 percent by adding 30 gram per liter iron-oxide-coated sand from the solution with 5 mg/l Cu in 20 minute. Breakthrough time occurred in 23 hours and adsorption capacity 0.87$\cdot$Cu/g$\cdot$IOCS in case of breakthrough copper concentration was 1.0 mg/l in the continuous test.

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Formation of Copper Seed Layers and Copper Via Filling with Various Additives (Copper Seed Layer 형성 및 도금 첨가제에 따른 Copper Via Filling)

  • Lee, Hyun-Ju;Ji, Chang-Wook;Woo, Sung-Min;Choi, Man-Ho;Hwang, Yoon-Hwae;Lee, Jae-Ho;Kim, Yang-Do
    • Korean Journal of Materials Research
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    • v.22 no.7
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    • pp.335-341
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    • 2012
  • Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

A Study of Sliding Friction and Wear Properties for Bronze added $Cu_2S$ as Solid Lubricants (고체윤활제 $Cu_2S$첨가 소결청동의 미끄럼 마찰마모특성 연구)

  • Lee, Han-Young;Ikenaga, Akira
    • Tribology and Lubricants
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    • v.23 no.2
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    • pp.66-72
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    • 2007
  • [ $MoS_2$ ], is a well-known metal sulfide applied as solid lubricants and an additive to prolong the life of sintered bearings under severe conditions. However, the high price of $MoS_2$ limited its wide application. This study is aimed to investigate the possibility far application to solid lubricants for $Cu_2S$ as a substitute of $MoS_2$. Bronzes added $Cu_2S$ and $MoS_2$, are produced by powder metallurgy in this study, and then evaluated their friction and wear properties., as well as sintered bronze. The sliding wear test using pin-on-disc type machine, was conducted at several sliding speeds for three type test pieces sintered bronzes added $Cu_2S$ and $MoS_2$, and sintered bronze without lubricants. Addition of $Cu_2S$ to bronze leads to relatively good friction properties, although it is not so good as addition of $MoS_2$. However, the wear properies of sintered bronze added $Cu_2S$ are better than that of sintered bronze added $MoS_2$.

Development of Porous Sorbents for Removal of Hydrogen Sulfide from Hot Coal Gas -I. Additive Effect of Sorbents for the Removal of Hydrogen Sulfide- (고온석탄 가스에서 황화물의 제거하기 위한 다공성 흡착제의 개발-1. 황화수소가스 흡착제의 첨가물 효과-)

  • 이재복;류경옥
    • Journal of Environmental Health Sciences
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    • v.14 no.1
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    • pp.1-9
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    • 1988
  • 석탄유도가스에 포함된 황화수소를 제거시킬 흡착제를 개발하기 위하여 알칼리 토금속, 천이원소 및 아연의 이온반경보다 이온반경이 작은 금속산화물을 산화아연에 첨가시켜 다공성 흡착제를 제조하였다. 600$\circ$C에서 이들 첨가시료를 2.09vol.% 황화수소와 질소가스 혼합기체로 반응시켜 초기속도를 측정하고, 같은 온도에서 사용된 흡착제를 공기로 재생시켰다. 사용된 금속산화물 첨가 흡착제중에서 CaO, TiO$_2$, $Fe_2O_3$, CuO, $Ga_2O_3$ 및 Si$_2$O가 ZnO 흡착제의 초기속도를 증가시켜 첨가제로 사용할 수 있음을 보였다.

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Study of the Photodegradation Properties of Toluene using Photocatalysts Modified by Metal Matter (금속물질로 개질된 광촉매를 이용한 톨루엔 광분해특성 연구)

  • Jang, Hyun Tae;Cha, Wang Seog
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.11
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    • pp.6952-6957
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    • 2014
  • In photocatalysis, the addition of metal matter to $TiO_2$ can alter the surface properties. As such, the metal can increase the rate of the photodegradation reaction. In this study, a range of modified $TiO_2$ photocatalysts were prepared and tested to improve the activity of photodegradation at a batch-typed photoreactor. To obtain a good sol solution of the $TiO_2$ photocatalyst, several types of dispersion agents and stabilizers were investigated. The photocatalyst solutions were modified with isoproply alcohol as the dispersion agent and sodium silicate as the stabilizer. The effects of various metallic elements on enhancing the photocatalytic activity of $TiO_2$ on the degradation of toluene were examined. Palladium-added $TiO_2$ was found to be the best, whereas copper or tungsten-added also showed good results. In the case of palladium addition, the increase in removal efficiency was 25%. On the other hand, Fe-added $TiO_2$ showed a notable decrease in photocatalytic degradation. Additional doping of copper or tungsten on the $Pd/TiO_2$ had no positive effect on the photodegradation activity.

화학적 구조 설계를 통한 수계 Cu-In-S 잉크와 액상셀렌화 법의 개발을 통한 고효율의 CISSe 태양전지 제작

  • O, Yun-Jeong;Yang, U-Seok;Kim, Ji-Min;Mun, Ju-Ho
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.428-428
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    • 2016
  • Copper indium sulfide (selenide) (CuIn(S,Se)2,CISSe)는 1.0~1.5 eV의 Direct band gap과 105 cm-1이 넘는 큰 광 흡수 계수를 가지고 있어 박막 태양전지의 흡수층으로써 연구되어 왔다. 최근 대량생산 및 저가 공정에 용이하다는 측면에서 용액 공정 기반 CISSe 태양전지 연구가 크게 주목 받고 있다. 용액공정 기반 중 하이드라진을 사용 한 경우 매우 높은 효율을 기록하였으나, 하이드라진 자체의 유독성과 폭발성 때문에 분위기 제어가 필요하고 여전히 저가화 및 대면적 제작에 한계가 있다. 따라서 알코올 솔젤 기반 CISSe 태양전지 제작 연구가 많이 진행되었으나, 결정립 성장 및 칼코겐 원자를 공급하기 위해 불가피하게 황화/셀렌화 후속 열처리 공정을 요구한다. 후속 열처리 공정은 폭발성의 황화수소/황화셀레늄 기체 분위기 제어와 고가의 장비를 필요로 한다. 본 연구에서는 매우 안정적이며 저가 용매인 물과 아민계 첨가제를 이용하여 Cu, In 전구체와 S, Se 이 포함된 Cu-In-S 잉크와 Se잉크를 제작하였다. 잉크 내에 S, Se을 첨가 함으로써 추가적인 후속공정 없이 비활성 가스 분위기에서 고품질의 CISSe 박막 제작을 가능케 하였다. 또한 Se 잉크 증착 횟수에 따른 결정 구조, 광학적 성질의 차이에 주목하였다. 따라서 수계 잉크를 대기 중에서 스핀코팅으로 박막을 제작한 후, Hot plate에서 건조하여 균일한 박막을 제조하고, 제작된 박막을 tube furnace에서 환원 분위기 및 비활성 가스 분위기에서 열처리 진행하여 $1.3{\mu}m$ 두께의 고품질의 CISSe 흡수층을 제작하였다. 이러한 흡수층에 대해 XRD, SEM, EDS 분석을 진행하여, 결정성, 미세구조, 및 조성을 확인하였으며, 제작된 흡수층 위에 버퍼층/투명전극층을 차례로 증착하여 CISSe 태양전지를 제작하여 셀 성능 및 양자 효율 특성을 파악하였다. 또한 액상 Raman 분석을 통해 결정립 성장 과정 메커니즘을 제시하였다.

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Effect of Constituent Ration NiO, CuO and B-Bi-Zn Addition on the Permeabilities of Hexagonal-ferrite (NiO, CuO 조성비와 B-Bi-Zn 첨가가 Hexagonal-Ferrite의 투자율에 미치는 영향)

  • Jeong, Seung-U;Kim, Tae-Won;Jeon, Seok-Tae;Myeong, Tae-Ho;Myeong, Tae-Ho
    • Korean Journal of Materials Research
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    • v.10 no.6
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    • pp.430-436
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    • 2000
  • In this paper, we have studied the effect of constituent ratio NiO, CuO and doped with B-Bi-Zn on proper-ties(microstructure, density, shrinkage, permeability as a function of frequency, etc.) of hexagonal-ferrite for high fre- quency chip-inductor material about several GHz. The permeability were analyzed by impedance analyzer(100 kHz∼ 40 MHz) and network analyzed(30 MHz∼3 GHz). As a result of the characteristics. the B-Bi-Zn glass ceramic was used to lower the sintering temperature for additive as function of frequency from 100kHz to 1.8 GHz showed con-stant tends. The maximum imaginary value of complex permeability was observed near the resonance frequency of 2 GHz.

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The Effect of Dispersant in Slurry on Ru CMP behavior (Slurry내 분산 안정제가 Ru CMP 거동에 미치는 영향)

  • Cho, Byung-Gwun;Kim, In-Kwon;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.112-112
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    • 2008
  • 최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

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Effect of chemical in post Ru CMP Cleaning solutions on abrasive particle adhesion and removal (Post Ru CMP Cleaning에서 연마입자의 흡착과 제거에 대한 chemical의 첨가제에 따른 영향)

  • Kim, In-Kwon;Kim, Tae-Gon;Cho, Byung-Gwun;Son, Il-Ryong;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.529-529
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    • 2007
  • Ruthenium (Ru) is a white metal and belongs to platinum group which is very stable chemically and has a high work function. It has been widely studied to apply Ru as an electrode material in memory devices and a Cu diffusion barrier metal for Cu interconnection due to good electrical conductivity and adhesion property to Cu layer. To planarize deposited Ru layer, chemical mechanical planarization(CMP) was suggested. However, abrasive particle can induce particle contamination on the Ru layer surface during CMP process. In this study, zeta potentials of Ru and interaction force of alumina particles with Ru substrate were measured as a function of pH. The etch rate and oxidation behavior were measured as a function of chemical concentration of several organic acids and other acidic and alkaline chemicals. PRE (particle removal efficiency) was also evaluated in cleaning chemical.

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A study on the fixation of heavy metals with modified soils in the landfill liner (개량혼합토를 이용한 폐기물 매립지 차수층의 중금속 고정능력에 관한 연구)

  • 노회정;이재영
    • Journal of Soil and Groundwater Environment
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    • v.7 no.2
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    • pp.63-71
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    • 2002
  • The authors selected the modified soil method, and then performed the geotechnical and environmental laboratory test, and evaluated whether the modified soil liner could be accepted as a barrier layer in landfill. Unlike the results of the natural soil(CL), those of the hydraulic conductivity test of stabilized soil met the standard value. According to these results, the optimal mixing ratio of a mixture(cement : bentonite : stabilizing agent) was 90 : 60 : 1 with mass ratio(kg) for 1㎥ with soil, and it was possible to use poor quality bentonite. B\circled2 because of a little difference from results with high quality bentonite. B\circled1. The Cation Exchange Capacity(CEC) of the modified soil was increased about 1.5 times compared with the natural soil; however. the change of CEC with a sort of additives was not detected. In order to observe the change of the chemical components and crystal structures, the natural and the modified soils with the sorts of additives were measured by the XRF(X-Ray Flourescence Spectrometer) and SEM, but there was no significant change. The artificial leachate with the heavy meals ($Pb^{2+}$ , $Cu^{2+}$, $Cd^{2+}$ Zn$^{2+}$ 100mg/L) was passed through the natural soil and modified soils in columns. In the natural soil, Cd$^{2+}$ and $Zn^{2+}$ were identified, simultaneously the pH of outflow was lower, and then came to the breakthrough point. The removal efficiency of the natural soil was showed in order of following : $Pb^{2+}$$Cu^{2+}$ > $Zn^{2+}$ > $Cd^{2+}$ On the other hand, modified soils were not showed the breakthrough condition like the result of the natural soil. The modified soil with the lower quality bentonite, B\circled2(column3) was more stable with respect to chemical attack than that with the higher bentonite, B\circled1(column2) because the change range of outflow pH in columns was less than that of outflow pH in column2. In addition, the case of adding the stabilizing agent(column4) was markedly showed the phenomena.ena.