• Journal of Energy Engineering
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• v.7 no.1
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• pp.24-34
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• 1998

In this research, effects of the types and amounts of binders and additives on desulfurization and regeneration reactivities of zinc titanate were investigated. Bentonite and kaolinite were used as binders and Mo-based, Ni-based, and Cu-based compounds were used as additives. A thermogravimetric analyzer (TGA) was utilized to investigate reactivities of desulfurization and regeneration for each sorbent. Two-cycle reactions of desulfurization-regeneration were performed in the TGA reactor. Results of XRD analysis showed that all sorbents had the crystalline phases of $Zn_2TiO_2$ and $Zn_2Ti_3O_8$ irrespective of the type and amount of binder and additive. Kaolinite-bound sorbents gave higher surface areas than bentonite-bound ones and the surface areas and pore volumes of sorbents increased with amount of binder increased. It was found that the most suitable temperatures for desulfurization and regeneration were 680$^{\circ}$C and 730$^{\circ}$C, respectively, and the sorbent prepared by the addition of 3 mol% CuO showed the best performance in terms of desulfurization and regeneration. Nio-added sorbents had good regenerability whereas $MoO_3-based$ sorbents showed poor performance. In cycle experiments in a fixed bed reactor 3 mol% CuO-added sorbents showed high reactivity.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.141-141
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• 2013

본 연구에서는 3차원 실장을 위한 TSV 충전 기술 중 Cu 전해도금에 대해 연구하였다. TSV에 Cu를 전해도금함에 있어서 도금액의 유기첨가제 유무에 따른 충전거동과 표면 도금 상태를 관찰하였다. 연구 결과 가속제, 억제제, 평활제로 구성 된 유기첨가제가 모두 첨가된 경우 도금 속가 가장 빨랐으며, 표면도 가장 고르게 형성된 것을 알 수 있었다.

• Korean Chemical Engineering Research
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• v.45 no.6
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• pp.560-565
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• 2007

Copper fine particles, ranging from $0.11{\mu}m$ to $0.64{\mu}m$ in average size, were prepared by a chemical reduction method using hydrazine ($N_2H_4$) as a reduction agent in waste copper solutions. The effect of the amount of hydrazine addition was investigated on the properties of the obtained powders. Also, the effect of the addition of dispersing agents [Polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP)] during particle synthesis was studied. The powders, obtained from 1 M waste copper solutions, showed the mixtures of Cu and $Cu_2O$ crystals at low hydrazine addition amounts of 0.8 mol and 1.0 mol, while those exhibited pure Cu crystals at adequate hydrazine addition amount of 0.12 mol. The average size of the Cu powders decreased with increasing the concentrations of hydrazine and dispersing agents. The addition of PVA to the solutions as a dispersing agent was more effective than that of PVP in preventing the aggregation of particles.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.191-191
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• 2015

반도체 소자 성능 향상을 위한 3차원 TSV배선 공정이 연구되었다. 전기도금을 이용한 TSV 공정 시 기존에는 황산 구리 수용액내에 억제제, 가속제, 평탄제등을 첨가한 복잡한 전해질이 사용되었지만 본 연구에서는 억제제만을 이용하여 Cu bottom-up filling에 성공하여 전해질의 조성을 단순화 시켰다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.68.2-68.2
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• 2017

인체접촉시 니켈도금의 알러지 반응을 억제하기 위한 대체 도금기술인 비 시안계 Cu-Sn 합금도금을 개발함에 있어서, 황산구리5수화물과 황산제일주석을 금속염으로 하여 황산 및 계면활성제, 유화제 등을 포함한 각종 유기첨가제를 포함하였고 특히 은백색조의 외관 색상과 안정적인 Cu-Sn 합금전착을 위해 2종의 착화제인 EDTP (Ethylenediaminetetrapropanol, $C_{14}H_{32}N_2O_4$)와 TEA (Triethanolamine)를 첨가한 비 시안계 Cu-Sn 합금 도금액을 도출하였다. Cu-Sn 합금도금 피막 조성의 균일화를 도모하기 위해서는 합금 도금액중의 Cu와 Sn 금속이온 농도를 일정하게 유지하는 것이 필요하다. 그러나 합금 도금액 중 2가 주석이온($Sn^{2+}$)은 수용액 중에서 4가 주석이온($Sn^{4+}$)으로 산화됨으로써 도금액 색상이 백탁이 되고 Stannic Hydroxide($Sn(OH)_4$, $SnO_2{\cdot}2H_2O$)이 생성되어 대량의 침전물이 침강하는 문제점이 발생되는 등시간 경과에 따른 도금액의 경시 변화가 발생되었다. 상기 침전물은 연속여과에 의해 제거 가능하나 합금 도금액 중 $Sn^{2+}$ 농도가 지속적으로 감소하게 된다. 이는 합금 도금액 중 금속이온 비율이 변동함으로써 합금도금 피막의 조성비를 일정하게 유지하는 것이 곤란해진다. 이에 $Sn^{4+}$ 침전물 생성을 방지하기 위한 산화방지제를 개발하고 또한 산화방지제의 첨가에 따른 도금 피막 외관에 미치는 영향을 평가하여 외관 개선을 위한 광택제를 개발하고자 한다. 본 연구의 결과를 토대로 니켈도금과 동등 이상의 기능 특성을 갖는 비 시안계 Cu-Sn 합금도금액을 개발하여 실용화하는 것을 목적으로 하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.42-43
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• 2005

본 연구에서는 Cu 슬러리에 부식방지제인 BTA를 첨가하여 슬러리내의 과수의 농도, pH 의 변화, 연마입자의 종류에 따라 연마거동에 미치는 영향과 각 chemical 변화에 따른 Cu surface의 변화를 살펴보았다. BTA (Benzotriazole, $C_6H_4C_3H$)를 첨가함으로써 본 연구에서 시행된 pH 와 과수의 변화에 상관없이 Cu-BTA film을 형성하여 Cu의 dissolution을 최대한 억제하는 것을 확인할 수 있었다. 또 그로인해 BTA를 첨가하지 않았을 때보다 얇은 passivation layer를 형성함을 알 수 있었고 contact angle도 더 높았다. 연마율의 경우에도 BTA가 첨가됨으로써 감소됨을 확인할 수 있었고 연마입자로 alumina particle을 사용한 경우에는 pH6, 과수 10vol%이상에서는 오히려 연마율이 증가하였다. fumed silica의 경우에는 hardness가 작아 mechanical적인 제거력이 낮아 BTA가 첨가되어도 연마율에는 큰 영향이 없었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.80-80
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• 2001

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.11a
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• pp.56-56
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• 2002

• Korean Chemical Engineering Research
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• v.54 no.6
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• pp.723-733
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• 2016

Intensive researches have been focused on the 3-dimensional packaging technology using through silicon via (TSV) to overcome the limitation in Cu interconnection scaling. Void-free filling of TSV by the Cu electrodeposition is required for the fabrication of reliable electronic devices. It is generally known that sufficient inhibition on the top and the sidewall of TSV, accompanying the selective Cu deposition on the bottom, enables the void-free bottom-up filling. Organic additives contained in the electrolyte locally determine the deposition rate of Cu inside the TSV. Investigation on the additive chemistry is essential for understanding the filling mechanisms of TSV based on the effects of additives in the Cu electrodeposition process. In this review, we introduce various filling mechanisms suggested by analyzing the additives effect, research on the three-additive system containing new levelers synthesized to increase efficiency of the filling process, and methods to improve the filling performance by modifying the functional groups of the additives or deposition mode.

• Clean Technology
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• v.26 no.3
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• pp.196-203
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• 2020

In this study, a Cu/hexaaluminate catalyst was prepared by a co-precipitation method, and then a binder was added to form a pellet. A catalyst in which Ni and Ru promoters were added to a Cu/hexaaluminate pellet catalyst was prepared. This study focused on examining the effect of the addition of Ni and Ru promoters on the properties of Cu/hexaaluminate catalysts and the decomposition reaction of ADN-based liquid monopropellants. Cu/hexaaluminate catalysts had few micropores and well-developed mesopores. When Ru was added as a promoter to the Cu/hexaaluminate pellet catalyst, the pore volume and pore size increased significantly. In the thermal decomposition reaction of ADN-based liquid monopropellant, the decomposition onset temperature was 170.2 ℃. Meanwhile, the decomposition onset temperature was significantly reduced to 93.5 ℃ when the Cu/hexaaluminate pellet catalyst was employed. When 1% or 3% of Ru were added as a promoter, the decomposition onset temperatures of ADN-based liquid monopropellant were lowered to 91.0 ℃ and 83.3 ℃, respectively. This means that the Ru promoter is effective in lowering the decomposition onset temperature of the ADN-based liquid monopropellant because the Ru metal has excellent activity in the decomposition reaction of ADN-based liquid monopropellant, simultaneously contributing to the increase of the pore volume and pore size. After the thermal treatment at 1,200 ℃ and decomposition of ADN-based liquid monopropellant were repeatedly performed, it was confirmed that the addition of Ru could enhance the heat resistance of the Cu/hexaaluminate pellet catalyst.