• Bulletin of the Korean Chemical Society
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• v.34 no.3
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• pp.768-772
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• 2013

Layered mixed metal hydroxy double salts (HDS) with the formulas $(Cu_{0.75}Ni_{0.25})_2(OH)_3NO_3$ ((Cu, Ni)-HDS) and $Cu_2(OH)_3NO_3$ ((Cu, Cu)-HDS) were prepared via slow hydrolysis reactions of CuO with $Ni(NO_3)_2$ and $Cu(NO_3)_2$, respectively. The crystal structures, morphologies, bonding natures, and magnetic properties of (Cu, Ni)-HDS and (Cu, Cu)-HDS were characterized with X-ray diffraction (XRD), scanning electron microscopy (SEM), Fourier transformation infrared spectroscopy (FT-IR), thermogravimetric analysis (TGA), and a superconducting quantum interference device (SQUID). Even though (Cu, Ni)-HDS has a similar layered structure to that of (Cu, Cu)-HDS, the bonding nature of (Cu, Ni)-HDS is slightly different from that of (Cu, Cu)-HDS. Therefore, the magnetic properties of (Cu, Ni)-HDS are significantly different from those of (Cu, Cu)-HDS. The origin of the abnormal magnetic properties of (Cu, Ni)-HDS can be explained in terms of the bonding natures of the interlayer and intralayer structures.

• Korean Journal of Materials Research
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• v.21 no.10
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• pp.550-555
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• 2011

A high-quality CIGS film with a selenization process needs to be developed for low-cost and large-scale production. In this study, we used $Cu_2In_3$, CuGa and $Cu_2Se$ sputter targets for the deposition of a precursor. The precursor deposited by sputtering was selenized in Se vapor. The precursor layer deposited by the co-sputtering of $Cu_2In_3$, CuGa and $Cu_2Se$ showed a uniform distribution of Cu, In, Ga, and Se throughout the layer with Cu, In, CuIn, CuGa and $Cu_2Se$ phases. After selenization at $550^{\circ}C$ for 30 min, the CIGS film showed a double-layer microstructure with a large-grained top layer and a small-grained bottom layer. In the AES depth profile, In was found to have accumulated near the surface while Cu had accumulated in the middle of the CIGS film. By adding a Cu-In-Ga interlayer between the co-sputtered precursor layer and the Mo film and adding a thin $Cu_2Se$ layer onto the co-sputtered precursor layer, large CIGS grains throughout the film were produced. However, the Cu accumulated in the middle of CIGS film in this case as well. By supplying In, Ga and Se to the CIGS film, a uniform distribution of Cu, In, Ga and Se was achieved in the middle of the CIGS film.

• Asian-Australasian Journal of Animal Sciences
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• v.19 no.8
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• pp.1174-1178
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• 2006

An experiment was conducted to investigate the effects of dietary supplementation of copper chelates in the form of methionine, chitosan and yeast on the performance of laying hens. Four hundred ISA Brown layers, 84 wks old, were assigned to 4 treatments: control, 100 ppm Cu in methionine chelate (Met-Cu), 100 ppm Cu as chitosan chelate (Chitosan-Cu) and 100 ppm Cu as yeast chelate (Yeast-Cu). Each treatment had five replicates of 20 hens. Hen-day and hen-housed egg production and egg weight were significantly (p<0.05) increased by Met-Cu supplementation. The increase by Chitosan-Cu and Yeast-Cu supplementation was not significant. Contrast of the control vs. Cu chelates showed egg weight was significantly (p<0.05) increased by Cu chelate supplementation. Soft-shell egg production was significantly (p<0.05) reduced by supplementation of Cu chelates. Met-Cu treatment showed the lowest incidence of soft egg production. Gizzard erosion index was increased by Cu chelate supplementation. Crude fat in liver, total cholesterol in yolk and Cu content in liver and yolk were not significantly influenced by Cu chelate supplementation. It was concluded that dietary supplementation of 100 ppm Cu as Met-Cu significantly increased egg production and egg weight. Cu-Met chelate was also effective in reducing soft-shell egg production but increased gizzard erosion index.

• Clean Technology
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• v.8 no.3
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• pp.111-117
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• 2002

Catalytic decomposition and reduction of NO have been carried out on copper loaded mordenites in a packed bed flow reactor. For the decomposition of NO, $Cu^{\circ}/HM$ exhibited higher activities than CuO/HM at high copper content, which may be related to the difference in the amount of $Cu^{2+}$ ions and the reducibility of CuO between $Cu^{\circ}/HM$ and Cuo/HM. However, $Cu^{\circ}/HM$ showed higher reduction activities than CuO/HM at low copper content. This result may be dependent on the difference in the amount of high-reducibility CuO between $Cu^{\circ}/HM$ and CuO/HM.

• Progress in Superconductivity
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• v.11 no.1
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• pp.67-71
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• 2009

The effect of Cu substitution on the structural and superconducting properties of the $(Ru_{1-x}Cu_x)Sr_2(Eu_{1.34{\cdot}}Ce_{0.66})Cu_2O_z$ system with x = 0, 0.25 and 0.5 prepared under ambient pressure have been investigated. The X-ray diffraction patterns indicated that the Ru ions are replaced by the Cu ions. It is found that the Cu substitution for Ru significantly reduces the ferromagnetic component of field-cooled magnetic susceptibility, but results in a small change in diamagnetic onset transition temperature of zero-field-cooled magnetic susceptibility. In contrast to the Ru $Sr_2(Eu_{1.34{\cdot}}Ce_{0.66})Cu_2O_z$, bulk Meissner effect is observed in the field-cooled magnetization measurements of the Cu doped samples. The experimental results are discussed in connection with the spontaneous vortex phase interpretation.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.16 no.4
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• pp.166-171
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• 2006

[ $Cu_2O$ ] and Cu have been synthesized from the layered organic-inorganic hybrid, $Cu_2(OH)_3(CH_3COO){\cdot}H_2O$, assisted by microwave irradiation. $Cu_2O$ is formed in aqueous glucose solution, while metallic Cu is formed in ethylene glycol by reduction of $Cu_2(OH)_3(CH_3COO){\cdot}H_2O$. The influence of microwave irradiation time and concentration of glucose on $Cu_2O$ particles formation and growth has been examined. The morphologies of $Cu_2O$ particles change from spheres with a few fm size to nanowires with diameter of 40 nm as increasing the microwave irradiation times.

• Journal of the Korean Chemical Society
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• v.57 no.4
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• pp.483-488
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• 2013

Copper oxide (CuO) was synthesized from $CuCl_2$ by solution method. Anatase $TiO_2$ particle was dispersed into the solution before preparing CuO, so that $TiO_2$/CuO heterojunction was created through the nucleation of CuO onto the $TiO_2$ surface. Some amount of CuO was reduced to $Cu_2O$ by treating glucose into the solution, thereby preparing $TiO_2/Cu_xO$ complex. The obtained $TiO_2/Cu_xO$ complex showed advanced phtocatalytic activity under the sun light compared with the P-25 sample. In addition, the the $TiO_2/Cu_xO$ complex showed excellent antipathogenic effect.

• Journal of the Korean Ceramic Society
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• v.35 no.1
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• pp.55-65
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• 1998

The oxidation behavior of Ag-36.8a%Cu-7.4at%Ti alloy brazed on Si3N4 substrate was investigated at 400, 500 and 600$^{\circ}C$ in air. Under this experimental condition Si3N4 and Ag were not oxidized whereas Cu and Ti among the brazing alloy components were oxidizied obeying the parabolic oxidation rate law. The activation energy of oxidation was found to be 80kj/ mol which was smaller than that of pure Cu owing to the presence of oxygen active element of Ti. The outer oxide scale formed from the initial oxidation state was always composed of Cu oxides which were known to be growing by the outward diffusion of Cu ions. As the oxidation progressed the concentration gradient occurred due to the continuous consumption of Cu as Cu oxides and consequently build-up of an Ag-enriched layer below the Cu oxides resulted in the formation of multiple oxide scales composed of Cu oxide (CuO) /Ag-enriched layer/Cu oxide (Cu2O) /Ag-enriched layer. Also the inward diffusing of oxygen through Cu oxide and Ag-enriched layers led to the formation of internal oxides of TiO2.

• Bulletin of the Korean Chemical Society
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• v.12 no.6
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• pp.606-612
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• 1991

We have carried out an extended Huckel calculation to rationalize the role of $CuO_3$ chains and the size effect of the charged model clusters for the following charged model culsters : ${{Cu_6}{O_{21}}^{28-},\;{{Cu_6}{O_{22}}^{30-}\;,{{Cu_9}{O_{30}}^{39-}\;,{{Cu_9}{O_{32}}^{43-}\;,{{Cu_{12}{O_{38}}^{48-}\;,{{Cu_{15}{O_{50}}^{65-}\;,{{Cu_{18}{O_{54}}^{66-}\;,{{Cu_{18}{O_{55}}^{68-}\;,{{Cu_{24}{O_{70}}^{84-}\;and\;{{Cu_{27}{O_{78}}^{93-}$ for high-$T_c$ superconductor $YBa_2Cu_3O_7$: ${{Cu_6}{O_{18}}^{22-}\;,{{Cu_9}{O_{26}}^{31-}}\;,{{Cu_{12}{O_{32}}^{36-}\;,{{Cu_{15}{O_{42}}^{49-}\;,{{Cu_{18}{O_{46}}^{50-}\;,{{Cu_{24}{O_{60}}^{64-}\;and\;{{Cu_{27}{O_{66}}^{69-}$ for insulator $YBa_2Cu_3O_6$. The results show that the electronic structures and properties of the charged model clusters relating to high-$T_c$ superconductor are very sensitive to the size change of the clusters with various environmental effects, wherease those of the charged model clusters for insulator $YBa_2Cu_3O_6$ are monotonous to the size change. The $CuO_3$ chains along the b-direction may yield cooperative electronic coupling with the $CuO_2$ layers in determining both conducting and superconducting properties of $YBa_2Cu_3O_{7-x}$ system.

• Korean Journal of Materials Research
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• v.17 no.8
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.