• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.220-220
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• 2003

최근, Cu기판 위에 YBaCuO$_{7-x}$ 초전도체를 입혀 초전도 선재를 제작하려는 연구가 이루어지고 있으며 이 과정에서 CuO와 Cu$_2$O가 생성된다는 보고가 있다. CuO 및 Cu$_2$O의 생성은 초전도 선재의 전기전도적 특성 및 기계적 특성에 상당한 영향을 끼칠 수 있다. 따라서 CuO와 Cu$_2$O에 대한 연구가 필요하다고 할 수 있다. 본 연구에서는 DV-X$\alpha$ 분자궤도법을 통해 CuO와 Cu$_2$O에 대한 (Cu$_{29}$ O$_{58}$ )$^{58-}$ , (Cu$_{52}$ O$_{19}$ )$^{14+}$ 모델을 이용하여 전자상태계산을 하였다. CuO, Cu$_2$O의 valence orbital level 구조 및 DOS (Density of State)를 통해 Cu원자와 O원자간의 공유결합 세기를 측정하였으며 CuO, Cu$_2$O 서로간의 차이점을 분석하였다.

• Journal of Powder Materials
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• v.21 no.3
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• pp.191-195
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• 2014

This study reports a simple way of fabricating the porous Cu with unidirectional pore channels by freeze drying camphene slurry with Cu oxide coated Cu powders. The coated powders were prepared by calcination of ball-milled powder mixture of Cu and Cu-nitrate. Improved dispersion stability of camphene slurry could be achieved using the Cu oxide coated Cu powders instead of pure Cu powders. Pores in the frozen specimen at $-25^{\circ}C$ were generated by sublimation of the camphene during drying in air, and the green bodies were sintered at $750^{\circ}C$ for 1 h in $H_2$ atmosphere. XRD analysis revealed that the coated layer of Cu oxide was completely converted to Cu phase without any reaction phases by hydrogen heat treatment. The porous Cu specimen prepared from pure Cu powders showed partly large pores with unidirectional pore channels, but most of pores were randomly distributed. In contrast, large and aligned parallel pores to the camphene growth direction were clearly observed in the sample using Cu oxide coated Cu powders. Pore formation behavior depending on the initial powders was discussed based on the degree of powder rearrangement and dispersion stability in slurry.

• YAKHAK HOEJI
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• v.15 no.2
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• pp.41-52
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• 1971

Cu(II) chelates of several sulfanilamide derivatives (Sulfa-Cu) were prepared and their effects on solubility, absorptivity in intestinal lumen, biding tendency with serum protein and erythrocytes, concentration in rabbit blood, and acetylation rate were studied in comparison with their free ligand forms. For solubility concerned, the partition coefficients of Sulfa-Cu are decreased as following order: Sulfadimethoxine Copper chelate (SDM-Cu), Sulfamethoxypyridazine Copper chelate (SD-Cu), Sulfamerazine Copper chelate (SM-Cu), Sulfaisoxazole Copper chelate (SIX-Cu). The partition coefficients of SDM-Cu and ST-Cu were much greater than those of ligands. this phenomenone acounts for the rapid absorption of SDM-Cu and ST-Cu in the rat small intestine (in situ). The Sulfa-Cu were absorbed at the intestinal lumen of a rat in the rate of first order and there was no difference between long acting sulfa drugs and their Cu0chelates in biological half lives. In binding experiments, sulfa-Cu binded with serum protein in lower ratio than their ligands except SIX-Cu. On other hand, acetylation rates of sulfa-Cu were higher than those of free sulfa drugs and the acetylation rate were higher than those of free sulfa drugs and powder. In a experiment on Sulfa-Cu concentration in rabbit blood, the half lives of SD-Cu, SIX-cu, ST-Cu, and SM-Cu were longer than those of their ligands. Above all, the half life of SD-Cu appeared to be approximately 3.5 times logner than that of corresponding ligand, SD. When absorption of sulfa drugs or sulfa-Cu at the small intestinal lumen of a rat and the concentration in rabbit blood after absorption were compared, it was found that there was not always conrrelated.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.33-37
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• 2008

A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the $Cu/Cu_3Sn$ interface of the solder joint during thermal aging at $150^{\circ}C$. The in-situ AES analysis of fractured joints revealed S segregation on the void surface. Only Cu, Sn, and S peaks were detected at the fractured $Cu/Cu_3Sn$ interfaces, and the S peak decreased rapidly with AES depth profiling. The segregation of S at the $Cu/Cu_3Sn$ interface lowered interface energy and thereby reduced the free energy barrier for the Kirkendall void nucleation. The drop impact test revealed that the electrodeposited Cu film with SPS degraded drastically with aging time. Fracture occurred at the $Cu/Cu_3Sn$ interface where a lot of voids existed. Therefore, voids occupied at the $Cu/Cu_3Sn$ interface are shown to seriously degrade drop reliability of solder joints.

• The Korean Journal of Ecology
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• v.28 no.1
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• pp.7-13
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• 2005

In the present study, we investigated the tolerance of Commelina communis to growth in Cu-contaminated soil and water We examined the germination rate, root and shoot growth of seedlings, fresh biomass in soil and water, and ability to eliminate Cu. We found that C. communis eliminated 41% of Cu in soil containing 50 mg Cu/kg and removed over 50% of Cu from water containing 100 mg Cu/L Cu. In addition, the plants could accumulate 90 mg Cu/g when grown in soil containing 50 mg Cu/kg and 140 mg Cu/g when grown in soil containing 100 mg Cu/kg thus higher levels of Cu removal were observed in soils containing higher Cu concentrations. In water, the maximal accumulation rate was 4.9 mg Cu/g root and 1.2 mg Cu/g shoot in water containing 20 mg Cu/L, and 7 days after exposure, Cu absorption saturated. Further, the growth rate of C. communis was not affected by up to 100 mg Cu/kg in the soil. Therefore, the phytotoxic effect of Cu on plants increased as the concentration of Cu was raised, although to different extents depending on whether the Cu was in soil or water. Overall, Cu removal from soil by C. communis was most effective at 100 mg Cu/kg in soil and 10 mg Cu/L in water. Finally, we identified two peaks of Cu-binding ligands in C. communis. Which is a high molecular weight peak (HMWL) at 60 kDa (Fraction 17 to 25) and a Cu binding peptide peak at <1 kDa (Very low molecular weight ligand: VLMWL). Cu-binding peptide (Cu-BP) was observed to have an amino acid composition typical of phytochelations.

• Journal of Animal Science and Technology
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• v.45 no.1
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• pp.49-56
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• 2003

An experiment was conducted to study the effects of the dietary Cu sources on the performance of the weanling pigs. Forty-eight, 24 in each sex, 4 weeks old pigs were assigned to four treatments; control, methionine-Cu chelate, chitosan-Cu chelate or yeast-Cu chelate. Control diet contained 136ppm Cu to which additional 100ppm Cu in different chelated form was added to the respective treatment. Individual pig weight and feed intake of each pen were recorded weekly for 5 weeks. Average daily feed intakes(ADFI), average daily gains(ADG) and ADFI/ADG were not significantly different among treatments. Nutrient availability was not also significantly affected by treatments. Serum triglyceride concentration of chitosan-Cu treatment was significantly lower than those of methionine-Cu and yeast-Cu treatments but was not significantly different from that of the control. Serum cholesterol concentration of yeast-Cu was significantly lower than those of the control and methionine-Cu but was not significantly different from that of chitosan-Cu treatment. Serum HDL-cholesterol concentration was not significantly affected by treatments. Serum IgG concentrations of all copper treatments were significantly lower than that of the control. It was concluded that Cu-chelates supplemented to the basal diet (136ppm Cu) by the level of 100ppm Cu did not significantly affect growth performance of weaning pigs. However, serum parameters of cholesterol, cholesterol and IgG were significantly affected by the treatments.

• Korean Journal of Poultry Science
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• v.38 no.2
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• pp.121-128
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• 2011

This study was conducted to investigate the effects of dietary supplementation of Cu-sulfate, Cu-methionine chelate (Cu-Met) and Cu-soy proteinate (Cu-SP) on the performance, blood parameters and mineral contents of muscle. It was conducted with a total of 1,000 one d old broilers chickens (Ross$^{(R)}$) which were assigned to four dietary treatments; Control, Cu sulfate (200 ppm Cu as $CuSO_4{\cdot}5H_2O$), Cu-Met (200 ppm Cu as Cu-methionine chelate), Cu-SP (200 ppm Cu as Cu-soy proteinate). There were significant differences (p<0.05) among treatments in weight gain. Weight gain of Cu treated groups were higher than the control during 3~5 wk. There were significant differences (p<0.05) among treatments in feed intake during 0~3 wk. Cu-Met was significantly (p<0.05) lower than the control but the differences among Cu treatments were not significant. There were significant differences (p<0.05) among treatments in feed conversion rate (FCR). Cu treated groups were lower than the control during the whole period. Production efficiency factor (PEF) was significantly higher (p<0.01) in Cu treated groups than the control. Nutrient availabilities of diets were not significantly different among the treatments. The count of white blood cell (WBC) and eosinophil (EO) were lower in Cu-SP treatment than in the control. Copper concentration in the liver was significantly (p<0.01) higher in Cu treated groups than the control. Zinc concentration in the breast and wing muscle was lower in Cu treated and that of leg muscle was higher in Cu-Met than the control. The result of this experiment showed that Cu supplementation at the level of 200 ppm as Cu sulfate, Cu-Met and Cu-SP improves weight gain (4~5 wk), FCR and PEF. Differences among Cu sources were not significant.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.217.2-217.2
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• 2014

We prepared a flexible and transparent CuO/Cu/CuO multilayer electrodes on a polyethylene terephthalate (PET) substrate using a specially designed roll-to-roll sputtering system at room temperature for GFF-type touch screen panels (TSPs). By the continuous roll-to-roll sputtering of the CuO and Cu layer, we fabricated a flexible CuO(150nm)/Cu(150nm)/CuO(150nm) multilayer electrodes with a sheet resistance of $0.289{\Omega}/square$, resistivity of $5.991{\times}10^{-23}{\Omega}-cm$, at the optimized condition without breaking the vacuum. To investigate the feasibility of the CuO/Cu/CuO multilayer as a transparent electrode for GFF-type TSPs, we fabricated simple GFF-type TSPs using the diamond patterned CuO/Cu/CuO electrode on PET substrate as function of mesh line width. Using diamond patterned CuO/Cu/CuO electrode of mesh line $5{\mu}m$ with sheet resistance of 38 Ohm/square, optical transmittance of 90% at 550 nm and an average transmittance of 89% at wavelength range from 380 to 780 nm, we successfully demonstrated GFF-type touch panel screens (TPSs). The successful operation of GFF-type TPSs with CuO/Cu/CuO multilayer electrodes indicates that the CuO/Cu/CuO multilayer is a promising transparent electrode for large-area capacitive-type TPSs due to its low sheet resistance and high transparency.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.35.2-35.2
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• 2009

최근 본 연구실에서 무연 솔더를 위한 새로운 Cu-Zn 합금 젖음층을 개발하였다. 전해도금을 통하여 Cu-Zn 합금층을 형성한 뒤 그 위에 Sn-4.0wt% Ag-0.5wt% Cu (SAC 405) 솔더를 리플로 솔더링을 통해 솔더접합부를 형성하였으며 계면에서 생성된 금속간 화합물의 형성 및 성장 거동을 연구하였다. SAC/Cu 시스템의 경우, $150^{\circ}C$에서 시효 처리를 실시하는 동안 솔더와 도금된 Cu 계면에서 $Cu_6Sn_5$ 상과 미세한 공공이 형성된 $Cu_3Sn$ 상이 발견되었다. 반면에 SAC/Cu-Zn 시스템에서는 계면에서 $Cu_6Sn_5$ 상만이 형성되었다. 또한 큰 판상형의 $Ag_3Sn$ 상이 SAC/Cu 시스템에 비해 현저하게 억제되었다. SAC/Cu-Zn 계면에서의 금속간 화합물의 성장 속도가 SAC/Cu 계면에서 형성된 금속간 화합물의 성장 속도보다 느리게 나타났다. Cu-Zn 젖음층의 Zn가 솔더와 Cu-Zn 층 사이에서 Cu와 Sn 원자의 상호 확산을 방해하기 때문이다. 본 연구에서는 Cu와 Cu-Zn 층을 이용한 솔더 접합부의 낙하 충격 신뢰성을 연구하였다. 낙하 충격 시험 시편은 두 개의 인쇄 회로 기판을 SAC 405 솔더볼을 이용하여 리플로를 통해 상호연결 하여 제조되었다. 이 때, 각각의 인쇄 회로 기판의 패드에는 Cu 층과 Cu-Zn층을 전해도금을 통하여 각각 $10{\mu}m$두께의 젖음층을 형성하였다. 낙하 시험 시편을 제조한 뒤, 시효 처리에 대한 낙하 저항 신뢰성의 특성을 연구하기 위해 250, 500 시간동안 시효처리를 한 후 각 조건에서 계면에 형성된 금속간 화합물의 성장 거동을 관찰하였으며, 낙하 충격 시험을 실시하였다. 낙하 시험은 daisy chain으로 연결된 시편의 저항이 100 Ohm 이상 측정되었을 때 중단되도록 하였다. Cu-Zn/SAC/Cu-Zn 시편의 경우 초기 리플로를 하였을 때 불량이 발생하는 평균 낙하 수는 350이며, Cu/SAC/Cu 시편의 평균 낙하수는 200 미만으로 나타났다. Cu/SAC/Cu 시편의 경우, 시효처리 시간이 증가함에 따라 평균 낙하수는 큰 폭으로 감소하였지만, Cu-Zn/SAC/Cu-Zn 시편은 불량이 발생하는 평균 낙하수의 감소폭이 보다 완만하게 나타났다. Cu 층에 Zn를 첨가함으로써 솔더와 젖음층 사이에서 형성된 금속간 화합물의 성장 및 미세 공공의 형성이 억제되었고, 솔더 접합부의 과냉을 감소시킴으로써 큰 판상형의 $Ag_3Sn$ 상의 형성을 억제함으로써 Cu-Zn/SAC/Cu-Zn 솔더 접합부에서 Cu/SAC/Cu 솔더 접합부보다 낙하 충격에 대한 저항성 및 신뢰성이 향상되었다. 이는 무연 솔더에 Zn를 첨가하여 낙하 충격 신뢰성을 향상시킨 것과 동일한 효과를 나타냈음을 확인하였다. 본 연구는 한국 과학 기술 재단의 전자패키지 재료 연구 센터(CEPM)와 지식 경제부의 부품 소재 기술 개발 사업의 지원을 받아 수행되었습니다.

• Asian-Australasian Journal of Animal Sciences
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• v.19 no.9
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• pp.1322-1327
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• 2006

An experiment was conducted to investigate the effects of supplemental copper (Cu) chelates (methionine, chitosan and yeast) on the performance, nutrient digestibility, serum IgG level, gizzard erosion, Cu content in the liver and excreta and the level of total cholesterol in breast muscle and serum of broiler chickens. Two hundred and forty hatched broiler chickens (Ross$^{(R)}$ 208) were assigned to 4 treatments: control, 100 ppm Cu in methionine chelate (Met-Cu), 100 ppm Cu in chitosan chelate (Chitosan-Cu) and 100 ppm Cu in yeast chelate (Yeast-Cu). Each treatment had six replicates of 10 (5 males+5 females) birds each. Weight gain and feed intake tended to be higher in Cu chelate treatments than the control; weight gain was significantly higher in the Met-Cu chelate treatment and feed intake was significantly higher in the Yeast-Cu chelate treatment than the control (p<0.05). Feed/gain was significantly different between treatments in which Met-Cu was lowest followed by the control, Chitosan-Cu and Yeast-Cu. DM availability was increased by Cu chelates among which chitosan-Cu showed the highest DM availability. Cu chelates supplementation tended to increase gizzard erosion index, and Cu content in the liver was highest in the Met-Cu treatment. Supplementation of Cu chelates tended to decrease total cholesterol level in breast muscle and serum but tended to increase the level of HDL in serum. It was concluded that dietary supplementation of 100 ppm Cu in chelates increased weight gain, feed intake and DM availability. Met-Cu was more effective than Chitosan-Cu or Yeast-Cu in improving productivity of broiler chickens.