• Title/Summary/Keyword: Cu/Si (111)

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A Study on the Magnetic Properties in Ni-Fe-Co/Cu/Ni-Fe-Co/Fe-Mn Multilayered Thin Films for Magnetoresistive Head (자기저항 헤드용 Ni-Fe-Co/Cu/Ni-Fe-Co/Fe-Mn 다층박막의 자기적 성질에 관한 연구)

  • 배성태;신경호;김진영
    • Journal of the Korean Vacuum Society
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    • v.4 no.1
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    • pp.67-76
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    • 1995
  • 자기저항헤드용 Ni-Fe-Co/Cu/Ni-Fe-Co/Fe-Mn 다층박막에서 자기적 성질과 전기적 성질에 관하여 조사하였다. 저 포화자계에서 고 자기저항을 나타내는 스핀 밸브형 다층박막을 제작하기 위하여 Borond이 도핑된 p-type Si(100)기판위에 Ni-Fe-Co 단층박막과 Si/Ni-Fe-Co/Cu/Ni-FeCo, Si/Ni-Fe-Co/Fe-Mn 구조의 다층막을 제작하여 자기적 특성을 조사하였다. Ni-Fe-Co 단층박막의 자기적 특성은 고정된 아르곤 분압에서 박막의 두께 등에 의존성이 있는 것으로 나타났다. 또한 Si/Ni-Fe-Co($70AA$)/Fe-Mn 구조에서 Ni-Fe-Co와 Fe-Mn 계면에서의 두 자성층의 이방성 차이에 의해서 발생되어지는 교환자기이방성이 존재하였으며, 교환자기이방성자계값은 Fe-Mn 두께가 $150\AA$일 때 가장 큰 값을 나타내었다. Ni-Fe-Co texture와 교환자기이방성자계값은 Fe-Mn 두께가 $150\AA$일 때 가장 큰 값을 나타내었다. Ni-Fe-Co texture와 교환자기이방성자계값의 의존성을 알아보기 위하여 Ti, Cu를 바닥층으로 사용하였다. Ti을 바닥층으로 사용하였을 경우, 교환자기이방성자계값은 23.5 Oe 정도의 가장 큰 값을 나타내었다. XRD 분석결과, Ti 바닥층이 Cu 바닥층이나, 바닥층이 없는 경우와 비교하여 성막된 Ni-Fe-Co 자성층의 강한 fcc(111) texture를 형성하는 것으로 나타났다. 각각의 단층박막과 다층박막에서의 자기적 특성을 측정한 후, Si/Ti($50\AA$)/Ni-Fe-Co($70\AA$)/Cu($23\AA$)/Ni-Fe-Co($70\AA$)/Fe-Mn(150$\AA$)/Cu(50$\AA$)의 스핀밸브구조를 갖는 다층박막을 제작하였으며, 11 Oe의 낮은 포화자계값에서 4.1%의 고 자기저항값을 얻을 수 있었다.

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Growth and Annealing Effect of Cu thin Films Using Electroplating Technique (전해도금법을 이용한 구리 박막의 성장 및 열처리 효과)

  • 박병남;강현재;최시영
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.10
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    • pp.1-8
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    • 2003
  • Copper thin films were deposited on a Cu/Ta/Si substrate using the electroplating technique. Deposition rate was about 200 nm/min in proportion to current density and in inverse proportion to flow rate. Resistivity of copper thin film was approximately 2.1 ${\mu}$Ωcm and Int$\sub$(111)//Int$\sub$(200)/ ratio of copper film was 5.4 and no significant impurities were detected. After the deposition, electroplating copper films were annealed at various temperatures in a background pressure of 10$\^$-3/ torr. The resistivity of copper thin films were improved by ∼17 % and texture was improved by ∼40 % after annealing at 170$^{\circ}C$. The stress in films was not reduced much after annealing below 170$^{\circ}C$.

Texture Analysis of Cu Interconnects Using X-ray Microdiffraction (X-ray Microdiffraction 을 이용한 구리 Interconnect의 Texture 분석)

  • 정진석
    • Korean Journal of Crystallography
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    • v.12 no.4
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    • pp.233-238
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    • 2001
  • X-ray microdiffraction which uses x-ray beam focused down to a micron size from synchrotron radiation sources allow precision measurements of local orientation and strain variations in polycrystalline materials. Using x-ray microdiffraction setup at Pohang Light Source, we investigated the tex-ture of Cu interconnects with various widths on Si wafer by collecting Laue images and focused to about 2×3㎛ ² in size. Our results show that 1㎛ wide Cu interconnect had grains in rather ran- dom orientation. On the other hand the 20㎛ wide interconnects showed a 〈111〉fiber texture near the center. The grains were 2∼5㎛ long at the 1㎛ wide interconnect and 6∼8㎛ in size at the 20㎛ wide interconnect.

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Effect of the Substrate Temperature on the Copper Oxide Thin Films

  • Park, Ju-Yeon;Gang, Yong-Cheol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.71-71
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    • 2010
  • Copper oxide thin films were deposited on the p-type Si(100) by r.f. magnetron sputtering as a function of different substrate temperature. The deposited copper oxide thin films were investigated by atomic force microscopy (AFM), scanning electron microscopy (SEM), spectroscopic ellipsometry (SE), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The SEM and SE data show that the thickness of the copper oxide films was about 170 nm. AFM images show that the surface roughness of copper oxide films was increased with increasing substrate temperature. As the substrate temperature increased, monoclinic CuO (111) peak appeared and the crystal size decreased while the monoclinic CuO (-111) peak was independent on the substrate temperature. The oxidation states of Cu 2p and O 1s resulted from XPS were not affected on the substrate temperature. The contact angle measurement was also studied and indicated that the surface of copper oxide thin films deposited high temperature has more hydrophobic surface than that of deposited at low temperature.

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Preparation and Characterization of $BaTiO_3-CuFe_2O_4$ Bi-Layer Thin Films Prepared By Pulsed Laser Deposition

  • Yoon, Dong-Jin;Kim, Kyung-Man;Lee, Jai-Yeoul;Lee, Hee-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.209-209
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    • 2010
  • Multiferroic properties of $BaTiO_3-CuFe_2O_4$ thin films grown on highly-textured Pt(111)/$TiO_2/SiO_2$/Si(100) substrates were studied. $CuFe_2O_4$ ceramic target was synthesized by mixing oxide powders of CuO, $Fe_2O_03$, $BaTiO_3$ ceramic target was also prepared separately. The film structure was of bi-layer type, where $BaTiO_3$ layer lies underneath of $CuFe_2O_4$ layer, where both layers were grown by pulsed laser deposition technique. We will report the ferroelectric and magnetic properties of $BaTiO_3-CuFe_2O_4$ bi-layer films in some detail.

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Surface state Electrons as a 2-dimensional Electron System

  • Hasegawa, Yukio
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.156-156
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    • 2000
  • Recently, the surface electronic states have attracted much attention since their standing wave patterns created around steps, defects, and adsorbates on noble metal surfaces such as Au(111), Ag(110), and Cu(111) were observed by scanning tunneling microscopy (STM). As a typical example, a striking circular pattern of "Quantum corral" observed by Crommie, Lutz, and Eigler, covers a number of text books of quantum mechanics, demonstrating a wavy nature of electrons. After the discoveries, similar standing waves patterns have been observed on other metal and demiconductor surfaces and even on a side polane of nano-tubes. With an expectation that the surface states could be utilized as one of ideal cases for studying two dimensionakl (sD) electronic system, various properties, such as mean free path / life time of the electronic states, have been characterized based on an analysis of standing wave patterns, . for the 2D electron system, electron density is one of the most importnat parameters which determines the properties on it. One advantage of conventional 2D electron system, such as the ones realized at AlGaAs/GaAs and SiO2/Si interfaces, is their controllability of the electrondensity. It can be changed and controlled by a factor of orders through an application of voltage on the gate electrode. On the other hand, changing the leectron density of the surface-state 2D electron system is not simple. On ewqy to change the electron density of the surface-state 2D electron system is not simple. One way to change the electron density is to deposit other elements on the system. it has been known that Pd(111) surface has unoccupied surface states whose energy level is just above Fermi level. Recently, we found that by depositing Pd on Cu(111) surface, occupied surface states of Cu(111) is lifted up, crossing at Fermi level around 2ML, and approaches to the intrinsic Pd surface states with a increase in thickness. Electron density occupied in the states is thus gradually reduced by Pd deposition. Park et al. also observed a change in Fermi wave number of the surface states of Cu(111) by deposition of Xe layer on it, which suggests another possible way of changing electron density. In this talk, after a brief review of recent progress in a study of standing weaves by STM, I will discuss about how the electron density can be changed and controlled and feasibility of using the surface states for a study of 2D electron system. One of the most important advantage of the surface-state 2D electron system is that one can directly and easily access to the system with a high spatial resolution by STM/AFM.y STM/AFM.

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A Study on the Analysis of Magnetoresistive Behavior in Giant Magnetoresistive Spin Valve Trilayer Films (거대자기저항 스핀밸브 삼층박막의 자기저항 거동 해석에 관한 연구)

  • 김형준;이병일;주승기
    • Journal of the Korean Magnetics Society
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    • v.8 no.4
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    • pp.224-230
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    • 1998
  • The relationships between R-H curves of gaint magnetoresistance (GMR) spin valve trilayer films and M-H curves of each magnetic layer consisting of the trilayer films were analyzed and simple formula representing the relations between the curves were suggested for theoretical analysis and study of magnetoresistance (MR) in those films, especially where the MR is from the difference of coercivity. Using two kinds of NiFe/Cu/Co films, which had been deposited on Cu(50 $\AA$)/Si(111, 4$^{\circ}$ tilt-cut) and Cu(50 $\AA$)/glass, R-H and M-H curves were measured and compared with the calculated ones, which were obtained by appying the M-H curves of single NiFe and Co films, deposited on the same substrates, to the previously reported single-domain and multi-domain models. The calcuated ones were well consistent with the measured ones and the suggested simple relationships between R-H and M-H curves are thought to be very useful for the deep understanding of MR behavior and the reasonable approach to improve MR properties in GMR spin valve trilayer films.

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Crystallographic Effects of Anode on the Mechanical Properties of Electrochemically Deposited Copper Films (아노드의 결정성에 따른 전기도금 구리박막의 기계적 특성 연구)

  • Kang, Byung-Hak;Park, Jieun;Park, Kangju;Yoo, Dayoung;Lee, Dajeong;Lee, Dongyun
    • Korean Journal of Materials Research
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    • v.26 no.12
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    • pp.714-720
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    • 2016
  • We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of as-deposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37 %, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.

Si 기판상에 도금된 구리 박막의 이방성 에칭 특성

  • Kim, Sang-Hyeok;Park, Chae-Min;Mun, Seong-Jae;Lee, Hyo-Jong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.67.1-67.1
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    • 2017
  • 구리는 탄성이방성이 큰 재료로 Si 박막상에 성장시키면 (111) 방향으로 우선 배향된 박막을 얻을 수 있다. 본 연구는 이러한 (111) 우선 방위를 갖는 Cu 박막의 전기도금층의 재결정 후의 매우 평탄한 표면을 갖는 박막에서 에칭에 따른 박막의 단차와 표면형상을 통해 결정방위별 에칭 특성을 비교 분석한 결과이다. 10 vol% 질산용액에서 에칭한 결과는 구리의 용해에 따라 각 결정면에 대한 고유의 facetted surface morphology를 나타내며, 대표적인 결정 방위인 (111), (110), (100)에 대해 triangular flake, ridge and rectangular pyramidal shapes을 나타내는 것을 알 수 있었다. 에칭속도의 정량적 측정을 위해 120초간 2.2M 농도의 질산용액으로 에칭을 실시하였고, nanosize의 as-plated initial region, (111), (110), (100) oriented regions의 각각에서 383, 270, 276, 317 nm/min의 에칭속도를 갖는 것을 확인하였다. Facet surface의 관찰을 통해 에칭반응이 (111) front surface를 갖는 열역학적 평형상태에서 일어나며, 이러한 결정방위별 에칭속도 차이는 각 결정S면이 갖는 Kink or ledge의 밀도의 차이에 기인할 것으로 판단된다. 즉, 에칭이 평형상태에서 step flow mechanism에 의해 열역학적 평형상태를 유지하면서 진행이 된다. 본 연구는 향후 다양한 에칭관련 용액 효과, 구리 박막의 응력 및 불순물에 의한 효과를 볼 수 있는 기본 방법을 제공해 줄 것으로 기대한다.

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Effects of Ultrathin Co Insertion Layer on Magnetic Anisotropy and GMR Properties of NiFe/Cu/Co Spin Valve Thin Films (NiFe/Cu 계면에 삽입된 Co 층이 NiFe/Cu/Co 스핀밸브 박막의 거대자기저항 특성과 자기이방성에 미치는 영향)

  • 김형준;조권구;주승기
    • Journal of the Korean Magnetics Society
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    • v.9 no.5
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    • pp.251-255
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    • 1999
  • NiFe(60 $\AA$)/Co(0$\AA$$\leq$x$\AA$$\leq$15$\AA$)/Cu(60$\AA$)/Co(30$\AA$) spin valve thin films were prepared on 4$^{\circ}$ tilt-cut Si(111) substrates with a 50 $\AA$ thick Cu underlayer without applying any external magnetic field during the deposition, and the effects of inserted ultrathin Co layer on magnetic anisotropy and GMR properties of the NiFe(60 $\AA$)/Cu(60$\AA$)/Co(30$\AA$) spin valves were investigated. As the ultrathin Co layer was inserted into the NiFe/Cu interface of the spin valves, GMR ratio was increased from about 1.5% to 3.5%, and the easy axis of NiFe(60 $\AA$) layer was rotated by 90$^{\circ}$. Accordingly, it was aligned along the same direction with the easy axis of Co(30 $\AA$)layer. Therefore, squared R-H curves was obtained in the spin valves, which is favorable properties for the digital GMR devices such as MRAM. In order to investigate the change of magnetic anisotropy of NiFe layer of the spin valves in more details,XRD measurement was performed using NiFe(500 $\AA$) and NiFe(500 $\AA$)/Co(10 $\AA$) thin films on the same templates. Strong (220) NiFe peak was observed in both films regardless of the inserted Co layer, so it was thought that the variation of magnetic anisotropy of NiFe layer is from the interface effect, the change of interface from NiFe/Cu to NiFe/Co, rather than the volume effect such as the change of magnetocrystalline effect.

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